LMV931MGX/NOPB

LMV931MGX/NOPB amplifier basic information:

LMV931MGX/NOPB is an OPERATIONAL AMPLIFIER. Commonly used packaging methods are TSSOP, TSSOP5/6,.08

LMV931MGX/NOPB amplifier core information:

The LMV931MGX/NOPB has a minimum operating temperature of -40 °C and a maximum operating temperature of 125 °C. Its peak reflow temperature is 260°C. Its maximum bias current at 25°C is: 0.035 µA. Its maximum average bias current is 0.05 µA.

How to simply check the efficiency of an amplifier? Looking at its slew rate, the nominal slew rate of the LMV931MGX/NOPB is 0.4 V/us. The maximum slew rate of LMV931MGX/NOPB given by the manufacturer is 0.23 mA. Its minimum voltage gain is 4500. When the op amp is used in closed loop, at a certain closed-loop gain (usually 1 or 2, 10, etc.), the frequency when the LMV931MGX/NOPB gain becomes 0.707 times the low-frequency gain is 1400 kHz. The power of LMV931MGX/NOPB is NO. Its programmable power is NO.

The nominal supply voltage of the LMV931MGX/NOPB is 2.7 V, and its corresponding nominal negative supply voltage is. The input offset voltage of the LMV931MGX/NOPB is 6000 µV (input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).)

Related dimensions of LMV931MGX/NOPB:

The width of LMV931MGX/NOPB is: 1.25 mm and the length is 2 mm. LMV931MGX/NOPB has 5 terminals. Its terminal position type is: DUAL. Terminal pitch is 0.65 mm. Total pins: 5

LMV931MGX/NOPB amplifier additional information:

LMV931MGX/NOPB adopts the VOLTAGE-FEEDBACK architecture. It is not a low-bias amplifier. It does not belong to the low offset class of amplifiers. The frequency compensation status of LMV931MGX/NOPB is: YES. Its temperature grade is: AUTOMOTIVE.

And its humidity sensitivity level is: 1. It is a micropower amplifier. LMV931MGX/NOPB is not Rohs certified. The corresponding JESD-30 code is: R-PDSO-G5. The corresponding JESD-609 code is: e3.

The packaging code of LMV931MGX/NOPB is: TSSOP. LMV931MGX/NOPB packaging materials are mostly PLASTIC/EPOXY. The package shape is RECTANGULAR. LMV931MGX/NOPB package pin forms are: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH. Its terminal forms are: GULL WING.

The maximum seat height is 1.1 mm.