The purpose of LED packaging

Semiconductor packaging is used to maintain the airtightness of diodes, transistors, ICs, etc., and to protect them from the influence of humidity and temperature in the surrounding environment, as well as to prevent electronic components from being damaged by mechanical vibration and impact, which may cause changes in component characteristics. Therefore, the purposes of packaging are as follows:

(1) Prevent moisture from invading from the outside;
(2) Mechanically support the wires;
(3) Effectively discharge the heat generated inside;
(4) Provide a shape that can be held in the hand.
Semiconductor components packaged with ceramic and metal materials have better airtightness, but are more expensive, and are suitable for use in applications with higher reliability requirements. Semiconductor components packaged with plastic have poor airtightness, but are less expensive, so they have become the mainstream of consumer products such as televisions, telephones, computers, and radios.