Interpretation of LED backlight production process

Let's take a preliminary look at the production process of LED backlight sources:

A. Cleaning: Use ultrasonic cleaning to clean the PCB or LED lead frame and dry it.

B. Mounting: After preparing silver glue on the bottom electrode of the LED chip (large wafer), expand it, place the expanded chip (large wafer) on the crystal table, and use a crystal pen to install the tube cores one by one on the corresponding pads of the PCB or LED bracket under a microscope, and then sinter to solidify the silver glue.

C. Pressure welding: Use aluminum wire or gold wire welding machine to connect the electrode to the LED tube core as the lead for current injection. When the LED is directly mounted on the PCB, an aluminum wire welding machine is generally used. (Gold wire welding machine is required to make white light TOP-LED)

D. Packaging: Use epoxy to protect the LED core and solder wires by dispensing glue. Dispensing glue on the PCB board has strict requirements on the shape of the glue after curing, which is directly related to the brightness of the light output of the finished backlight source . This process will also undertake the task of dispensing phosphor ( white light LED ).

E. Soldering: If the backlight source uses SMD-LED or other packaged LEDs, the LEDs need to be soldered to the PCB before the assembly process.

F. Film cutting: Use a punch press to die-cut various diffusion films, reflective films, etc. required for the backlight source.

G. Assembly: According to the drawing requirements, manually install the various materials of the backlight source in the correct position.

H. Test : Check whether the backlight source photoelectric parameters and light uniformity are good.

I. Packaging: Pack and store the finished products as required.