1. The function of LED chip:
LED chip is the main raw material of LED, and LED mainly relies on the chip to emit light.
2. The composition of LED chip
Mainly composed of several elements such as arsenic (AS), aluminum (AL), gallium (Ga), indium (IN), phosphorus (P), nitrogen (N), and strontium (Si).
3. Classification of LED chips
According to luminous brightness:
A. General brightness: R, H, G, Y, E, etc.
B. High brightness: VG, VY, SR, etc.
C. Ultra-high brightness: UG, UY, UR, UYS, URF, UE, etc.
D. Invisible light (infrared): R, SIR, VIR, HIR
E. Infrared receiving tube: PT
F. Photoelectric tube: PD
According to the composition elements:
A. Binary chips (phosphorus, gallium): H, G, etc.
B. Ternary chips (phosphorus, gallium, arsenic): SR, HR, UR, etc.
C. Quaternary chips (phosphorus, aluminum, gallium, indium): SRF, HRF, URF, VY, HY, UY, UYS, UE, HE, UG
4. LED chip characteristics table (see the table below for details)
LED chip model Luminous color Composition elements Wavelength (nm) Chip model Luminous color Composition elements Wavelength (nm)
SBI blue lnGaN/sic 430 HY super bright yellow AlGalnP 595
SBK Brighter Blue lnGaN/sic 468 SE High Bright Orange GaAsP/GaP 610
DBK Brighter Blue GaunN/Gan 470 HE Super Bright Orange AlGalnP 620
SGL Blue-Green lnGaN/sic 502 UE Brightest Orange AlGalnP 620
DGL Brighter Blue-Green LnGaN/GaN 505 URF Brightest Red AlGalnP 630
DGM Brighter Blue-Green lnGaN 523 E Orange GaAsP/GaP635
PG Pure Green GaP 555 R Red GAaAsP 655
SG Standard Green GaP 560 SR Brighter Red GaA/AS 660
G Green GaP 565 HR Super Bright Red GaAlAs 660
VG Brighter Green GaP 565 UR Brightest Red GaAlAs 660
UG Brightest Green AIGalnP 574 H high red GaP 697
Y yellow GaAsP/GaP585 HIR infrared GaAlAs 850
VY brighter yellow GaAsP/GaP 585 SIR infrared GaAlAs 880
UYS brightest yellow AlGalnP 587 VIR infrared GaAlAs 940
UY brightest yellow AlGalnP 595 IR infrared GaAs 940
5. Precautions and other
LED chip manufacturers: A. Guanglei (ED) B. Guolian (FPD) C. Dingyuan (TK) D. Huashang (AOC) E. Hanguan (HL) F. AXT G. Guangjia
LED chips must pay attention to electrostatic protection during production and use.
Previous article:Brief Analysis of LED Welding Technology and Steps
Next article:Several stages of development of LED display industry
Recommended ReadingLatest update time:2024-11-17 00:01
- Popular Resources
- Popular amplifiers
- MathWorks and NXP Collaborate to Launch Model-Based Design Toolbox for Battery Management Systems
- STMicroelectronics' advanced galvanically isolated gate driver STGAP3S provides flexible protection for IGBTs and SiC MOSFETs
- New diaphragm-free solid-state lithium battery technology is launched: the distance between the positive and negative electrodes is less than 0.000001 meters
- [“Source” Observe the Autumn Series] Application and testing of the next generation of semiconductor gallium oxide device photodetectors
- 采用自主设计封装,绝缘电阻显著提高!ROHM开发出更高电压xEV系统的SiC肖特基势垒二极管
- Will GaN replace SiC? PI's disruptive 1700V InnoMux2 is here to demonstrate
- From Isolation to the Third and a Half Generation: Understanding Naxinwei's Gate Driver IC in One Article
- The appeal of 48 V technology: importance, benefits and key factors in system-level applications
- Important breakthrough in recycling of used lithium-ion batteries
- Innolux's intelligent steer-by-wire solution makes cars smarter and safer
- 8051 MCU - Parity Check
- How to efficiently balance the sensitivity of tactile sensing interfaces
- What should I do if the servo motor shakes? What causes the servo motor to shake quickly?
- 【Brushless Motor】Analysis of three-phase BLDC motor and sharing of two popular development boards
- Midea Industrial Technology's subsidiaries Clou Electronics and Hekang New Energy jointly appeared at the Munich Battery Energy Storage Exhibition and Solar Energy Exhibition
- Guoxin Sichen | Application of ferroelectric memory PB85RS2MC in power battery management, with a capacity of 2M
- Analysis of common faults of frequency converter
- In a head-on competition with Qualcomm, what kind of cockpit products has Intel come up with?
- Dalian Rongke's all-vanadium liquid flow battery energy storage equipment industrialization project has entered the sprint stage before production
- Allegro MicroSystems Introduces Advanced Magnetic and Inductive Position Sensing Solutions at Electronica 2024
- Car key in the left hand, liveness detection radar in the right hand, UWB is imperative for cars!
- After a decade of rapid development, domestic CIS has entered the market
- Aegis Dagger Battery + Thor EM-i Super Hybrid, Geely New Energy has thrown out two "king bombs"
- A brief discussion on functional safety - fault, error, and failure
- In the smart car 2.0 cycle, these core industry chains are facing major opportunities!
- The United States and Japan are developing new batteries. CATL faces challenges? How should China's new energy battery industry respond?
- Murata launches high-precision 6-axis inertial sensor for automobiles
- Ford patents pre-charge alarm to help save costs and respond to emergencies
- New real-time microcontroller system from Texas Instruments enables smarter processing in automotive and industrial applications
- Take a break and watch a movie to refresh yourself
- Solving the IoT Landing Dilemma - Alibaba Cloud Hardware Access Best Practices
- [Domestic RISC-V Linux Banfang·Starlight VisionFive trial report] Completed the storage and reading of the sampled person’s data
- Characteristics of embedded software development, design process, and structure of embedded software
- EEWORLD University ---- FPGA Course Basics (Intel Official FPGA Tutorial Series)
- [GD32L233C-START Review] 3. GPIO, EXTI
- Help e-book: Electrical control circuit: basics, control devices, diagram reading, wiring and debugging, edited by Han Xuetao
- [Xianji HPM6750 Review 6] A UVC-like camera with CDC transmission display
- orcad to altium
- [Solved] STM32 open-drain output and pull-up input detection button