2018 Electronic Assembly Quality Benchmarking Research Report

Bannockburn, IL, USA — IPC—The Association Connecting Electronics Industries® has released the 2018 Electronics Assembly Quality Benchmarking Study. This quality benchmarking study based on global electronics assembly companies can be used by electronics assembly companies to compare and contrast their own quality status.

The quality control indicators in the report include the proportion and output of different test methods, the output and defective rate of the first test and the output and defective rate of the final test, the internal output and defective rate of key processes, DPMO and output targets, the average cost caused by poor quality and the rework ratio and scrap ratio. The report also includes the use of different quality control methods.

Additionally, the report includes customer satisfaction and supplier performance measurement indicators, such as customer return rate, return rate due to product defects, on-time delivery rate, and industry-standard quality certification status.

The data in the report is categorized by company size, region, and product type (rigid PCB, flexible PCB, final product, mechanical assembly, cable harness, discrete terminals and connectors) to provide averages, medians, and percentiles.

The report summarizes statistics from 63 electronics assemblers of varying sizes around the world, including OEMs and contract manufacturers.

The full report is 152 pages long. For more information, please visit www.ipc.org/AssemblyBenchmark2018 .