Intelligent perception is one of the key technologies that enable industrial automation such as machine vision, robotics, scanning and detection . With more than 40 years of rich experience in the field of imaging, ON Semiconductor is also a leader in the field of depth perception such as LiDAR, providing a variety of advanced intelligent perception solutions, using highly differentiated imaging technologies such as high dynamic range, global shutter, near infrared, RGB-IR and depth perception technologies such as silicon photomultipliers (SiPM) to meet different application requirements, and cooperate with global leaders in the field of industrial cameras to jointly promote industrial innovation and realize industrial automation.
High Dynamic Range
Dynamic range refers to the ratio between the lightest and darkest areas in a scene.
8.3-megapixel AR0821: On-chip HDR (eHDR) technology, delivering best-in-class dynamic range of over 140 dB
The AR0821 provides 8.3 megapixels, 4K video at 60 fps, and extremely low power consumption. It uses rolling shutter, ON Semiconductor's unique 2.1 µm DR-Pix™ back-illuminated (BSI) pixel design, and embedded high dynamic range (eHDR) technology to enable high quantum efficiency and high dynamic range, providing excellent image quality and advanced features under challenging lighting conditions, suitable for applications such as scanners/card readers, machine vision cameras, etc. The AR0821 has been integrated into the Basler dart series area scan camera module, enabling a wide range of image processing applications and providing the latest machine vision technology.
Global Shutter
The start and end time of each row of rolling shutter exposure are inconsistent, so deformation will occur when shooting moving objects. The global shutter is equivalent to the electronic version of the mechanical shutter. All pixels start and end exposure at the same time, and no deformation will occur when shooting moving objects. Many industrial application scenarios need to capture images of high-speed moving objects, so most industrial cameras need to use global shutter sensors.
Global shutter star product: high-performance, low-noise XGS image sensor series accelerates development
The XGS image sensor series adopts high bandwidth, low power architecture, 3.2 um global exposure, and only 2 PCBs can support 11 resolutions, ranging from 2 million to 45 million. The same camera hardware design is compatible with multiple resolutions and frame rates, greatly shortening the development time of designers. Among them, XGS 2000 to XGS 16000 are pin-to-pin compatible with 29 mm x 29 mm, and XGS 20000 to XGS 45000 are pin-to-pin compatible with cameras larger than 50 mm x 50 mm. For the ITS market, ON Semiconductor provides a dedicated version, and the optimized color filter array (CRA) can adapt to the mainstream lenses on the current ITS market.
Key specifications of the XGS series sensors are as follows:
The XGS series offers different chief incidence angles (CRA) for different applications, such as 0° for machine vision, 10° for large-format capture, and 4.7° or 7.3° for ITS.
The XGS series not only provides 11 different resolutions, but also different speed versions for the same resolution. Designers can choose corresponding products according to different camera interfaces, including CXP-6 interface, 10 GigE, Camera Link, 5Gbase-T, USB 3.0 and other high, medium and low speed interfaces.
ON Semiconductor provides 3 different XGS development platforms: XGS Demo Kit, X-Celerator and X-Cube . XGS Demo Kit is the benchmark for IQ demonstration to clients or conference rooms. The sensor + lens mount is larger, there is no on-board power system, there is no FPGA in the camera, and it can capture the maximum speed, but it can only display less than 30 fps on the computer. The hardware requires ON Semiconductor to provide FrameBuffer board + Demo3, communicate with PC via USB 3.0, and the software is ON Semiconductor's DevWare system. There is no public algorithm code. X-Celerator is provided for FPGA development or ecosystem. The sensor + lens mount is larger, there is an on-board power system, there is no FPGA in the camera, and it can capture the maximum speed. The hardware depends on the FPGA development kit, and the communication with the PC is defined by the user. The software is provided by the customer, and ON Semiconductor can also provide public algorithm code. X-Cube is mainly aimed at ISP systems or SoC systems with MIPI interface, providing a 29 mm x 29 mm interface and an onboard power supply system. There is a small FPGA in the camera to convert the HiSPi interface into a MIPI interface. The system speed is 30 fps. The hardware uses ON Semiconductor's IAS board + Demo3 board or is directly connected to the user's ISP board. PC communication can be defined by the user or through Demo3's USB 3.0. The software depends on the user or uses ON Semiconductor's DevWare, and no public algorithm code is provided.
Global shutter: AR0234, designed for a variety of applications requiring high-quality image perception
As more and more manufacturers adopt vision-based expert systems for automation, the demand for high-quality image perception is increasing. This demand requires optimizing the size, performance, and power consumption of image sensors. The AR0234 meets these requirements and is suitable for a variety of different applications such as machine vision cameras, augmented reality (AR)/virtual reality (VR)/mixed reality (MR) headsets, autonomous mobile robots (AMR) and barcode readers.
The AR0234CS captures 1080p video and single-frame images and can run at up to 120 fps. The 2.3-megapixel sensor produces clear images by minimizing frame-to-frame distortion in high-speed scenes and reducing motion artifacts encountered by other image sensors with its industry-leading shutter efficiency. The AR0234CS sensor's innovative pixel architecture provides the wide dynamic range required to support a variety of lighting conditions, from dark nights to bright sunlight. Low noise and improved low-light response make it suitable for applications across consumer, commercial and industrial IoT, and the extended operating temperature range allows it to be deployed in challenging outdoor conditions. Other advanced features of the AR0234CS include: programmable region of interest with on-chip histogram, automatic exposure control and 5 x 5 statistics engine, fully integrated strobe lighting control, flexible row and column skipping modes, as well as horizontal and vertical mirroring, windowing and pixel merging.
Together with the AP1302 Image Signal Processor (ISP), the AR0234CS provides a comprehensive camera system that can be quickly designed and developed for fast time to market. In addition, system designers can access the DevSuite software to evaluate the sensor's features and capabilities, configuration and fine-tuning, and provide ready-made outputs for further image processing. The AR0234CS is available in color and black and white variants with a CRA of 0° or 28°.
Near Infrared
The quantum efficiency (QE) of near-infrared enhanced (NIR+) products in the near-infrared band is 3 times higher than that of traditional products, which means that under the same noise floor, the same exposure time and gain, the image brightness of NIR+ products is brighter than that of traditional products. Conversely, to achieve the same image brightness, NIR+ products can use less near-infrared lighting, thereby reducing overall power consumption and costs.
RGB-IR
The IR pixels in the array of RGB-IR products use NIR+ IR differential algorithm, which can save the traditional industrial camera from switching IR cut to reduce maintenance costs and reduce space. The images captured by the products processed by RGB-IR will show richer and more realistic colors.
Representative products using RGB-IR: AR0237 RGB-IR, which reduces space and reduces costs
The 2-megapixel, 1/2.7-inch AR0237 RGB-IR sensor integrates the capabilities of daytime color imaging and nighttime near-infrared imaging. Traditional mechanical infrared cut-off filters may cause refocusing problems and expensive maintenance costs, and are noisy and increase space usage. The AR0237 RGB-IR eliminates such mechanical infrared cut-off filters, avoiding these problems and is suitable for high dynamic range imaging applications. The AR0237 RGB-IR uses dual band IRCF. In low-light environments, all pixels are IR pixels. The ISP uses black and white image processing. Under ambient light, the ISP uses IR pixels as a reference to remove infrared signals from RGB pixels for color image processing without losing normal color information.
Laser Radar (LiDAR)
LiDAR perception is a trending solution for industrial automation and control systems because of its advantages such as high accuracy, fast speed and scalability. LiDAR perception using SiPM arrays enables object detection and avoidance, as well as motion and occupancy detection.
ON Semiconductor's SiPM arrays feature innovative fast modes that shorten perception time, industry-leading efficiency and dynamic range, enabling sensors to operate in a variety of environments, including direct sunlight. ON Semiconductor provides LiDAR solutions as well as a wide range of LiDAR development platforms and tools, highly technical and experienced application engineer support to assist in product development.
Related Products
RB Series
The RB series are near infrared (NIR) enhanced SiPMs for LiDAR and range finding applications using NIR illumination such as 905nm and 940nm.
Evaluation/Development Kits
The direct time-of-flight (dToF) SiPM LiDAR reference platform SECO-RANGEFINDER-GEVK is a cost-effective single-point rangefinder development kit for industrial ranging with a range of 0.11 m to 23 m. It is based on the RB series NIR-enhanced SiPM and integrates all basic system components, including laser and reference circuits (Tx), receiving circuits (Rx), power management system, and core FPGA and UART communication. It can be used as an evaluation kit or a complete reference design, ready to use out of the box, with an easy-to-use graphical user interface (GUI), adjustable system variables, time-to-digital converter (TDC) with automatic calibration function, and software-adjustable settings for a variety of industrial applications. It complies with laser safety standards IEC / EN 60825-1:2014, 21 CFR 1040.10 and 1040.11 (except Laser Notice No. 56).
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