Core to China, Science and Technology to the World, Core Technology Empowers China's New Infrastructure

New infrastructure mainly includes three aspects: information infrastructure, integrated infrastructure, and innovative infrastructure, covering seven major areas: 5G infrastructure, ultra-high voltage, intercity high-speed rail and intercity rail transit, new energy vehicle charging piles, big data centers, artificial intelligence, and industrial Internet. Looking at the three aspects and seven major areas of new infrastructure, it can be found that semiconductors may become the focus and key to achieving breakthroughs in new infrastructure. As the brain of industrial intelligence and digitalization, chips are indispensable.

Texas Instruments (TI) has always attached great importance to the Chinese market. Since the establishment of its first office in China in 1986, Texas Instruments has been working in the Chinese market for 35 years, focusing on the innovation of analog and embedded processing products, and has long been working on the seven major areas covered by the new infrastructure. Texas Instruments is committed to helping Chinese customers continue to empower themselves under digital development and provide strong support for the widespread application of new infrastructure. In the seven major areas, Texas Instruments has carried out in-depth and close cooperation with many Chinese companies. Through smarter, more innovative, more reliable and more economical leading products and solutions, as well as comprehensive and extensive service support, we help our customers lay a solid foundation for the "core", carry out digital transformation more quickly, accelerate industrial upgrading, and share new opportunities.

The development potential of new infrastructure is beyond imagination. Please follow us to see how TI's series of innovative technologies and products can unlock and stimulate this unlimited potential for you more quickly, and how to more easily escort your new journey of digital infrastructure!

1. 5G infrastructure: Creating lower latency and more efficient 5G systems

5G is the cornerstone of the new information infrastructure, which is expected to achieve lower latency, higher data rates and bring new applications. As the focus of changes in the field of mobile communications and a "new driving force for economic development", 5G has become a key area for the construction of new infrastructure. 5G plays a fundamental role in a series of fields such as high-definition video, smart cities, Internet of Vehicles, Industrial Internet, and telemedicine, and even plays an indispensable role in some fields. 5G technology also brings complexity to the industry. Spectrum expansion, high speed, high frequency, wide bandwidth, low latency and high channel count also require reducing size, weight, power consumption (SWaP) and cost and supporting all current and emerging cellular standards.

TI's industry-leading advanced RF radio and intermediate frequency sampling technologies and system expertise can help customers design active antenna systems, remote radio units and other systems to meet the latest 5G requirements and meet the growing demand for data transmission and storage. In addition, TI's bridgeless PFC topology, GaN power products and interface ICs help create more reliable, energy-efficient and cost-effective commercial communication power rectifiers, giving China's 5G development a boost.

2. Big Data Center: Building a More Reliable and Efficient Data Center of the Future

In the new infrastructure era, the construction of big data centers has become a general trend, and big data centers are evolving towards intensive and super-large scale. In the process of supporting digital infrastructure and developing cloud computing, it is urgent to develop more reliable and secure data centers, and data centers need to be supported by servers with higher processing power and more energy-efficient power supplies. Stable and reliable power supply capabilities have become a major pain point in data center construction. Especially in a small space, it is extremely challenging to achieve a core voltage as low as 0.6-0.8 volts and a high-current, high-stability power supply system design for various processors such as ASIC, CPU, and FPGA with an ultra-high current of 50-800 amperes. It requires a high-reliability power supply and an efficient DC/DC conversion solution to achieve.

In terms of improving power density and reducing product size, TI's new generation of 600VGaNFETs can provide a glimpse of the potential benefits. Compared with existing solutions, the fast-switching 2.2MHz integrated gate driver can help engineers double the power density, achieve 99% efficiency and reduce the size of power magnetic devices by 59%.

TI's devices enable higher efficiency and power density in AC/DC power supply applications that focus on low loss and reduced circuit board space, such as ultra-large-scale enterprise computing platforms and 5G telecom rectifiers. In addition, TI also helps customers support PCIe Gen 4 and Gen 5 protocols at a lower cost, send signals farther and reduce design complexity through advanced signal conditioning devices.

3. Artificial Intelligence (AI): Unlocking the infinite possibilities of edge AI

The evolving interconnected systems in information infrastructure, such as smart factories, smart homes, medical services, and advanced driver assistance systems (ADAS), rely on artificial intelligence (AI) to adapt to changing situations or environments. AI provides new capabilities for perception applications in robotics and automotive systems, which use machine vision, edge computing, and sensor fusion technologies to quickly sense and process data and transmit the data to the rest of the system. The edge computing dedicated chips that meet the needs of new infrastructure should have the characteristics of high chip integration, easy development, heterogeneous computing structure, and strong computing performance. In fact, the two new infrastructure fields of AI and data centers have similar performance requirements for data acceleration.

TI's embedded processing product portfolio includes devices that support edge computing, suitable for localized decision-making, machine learning and real-time networks that can be easily deployed. TI's comprehensive analog product portfolio is widely used in applications that support AI technology, enabling low power consumption in smart home applications, and high integration, high signal integrity and high efficiency in medical, motor drive and smart factory applications.

4. Industrial Internet: Real-time communication with advanced sensing and control capabilities

As one of the new infrastructures, the industrial Internet is essentially the basis for reducing the digital transformation costs of industrial enterprises, improving production efficiency, and promoting innovative services. With the continuous development of the industrial Internet in China in recent years, the industrial Internet has upgraded from the initial infrastructure for developing platform applications based on networks, data, and security to an architecture that implements functional architectures and implementation frameworks around business scenarios with the support of a technical system. Overall, industrial Internet applications have further unleashed empowerment potential, with applications focusing on data value mining based on device IoT and in-depth optimization of specific scenarios. This has brought many innovations to traditional industrial infrastructure, as well as more design challenges, which requires integrated circuit suppliers to help engineers develop intelligent systems in controllers, communications, and ground sensing.

Smart factory automation and unmanned management require precise and powerful sensing technology. TI's CMOS-based SoC solutions can easily develop radar technology, helping smart factory designers deploy smart robot arms, collaborative robot systems and unmanned factory management. In terms of controllers, relying on the TI Jacinto SoC TDA4x platform, which has an integrated A72 CPU, R5 MCU, multi-core DSP and machine learning accelerator (MMA), general CNN and predictive maintenance functions, it can achieve real-time performance and high computing throughput at low power consumption. In addition, customers can deploy trained network models on TI's efficient deep learning processors (such as TDA4VM), supporting the use of runtime engines supported by industry standards. In terms of network communications, TI products support a wide range of industrial communication standards - from serial interfaces (IO-Link, CAN, RS-485) to industrial Ethernet and new technologies such as time-sensitive network architecture (TSN) and single-pair Ethernet (SPE). This support enables designers to have higher connectivity and scalability to meet the needs of current industry trends.

5. UHV: Building a more efficient and reliable high-voltage AC and DC transmission system

Electricity is the common upstream of new infrastructure. Whether it is 5G, big data centers, industrial Internet or new energy vehicle charging piles, the construction and operation of these technologies are inseparable from the power network. New infrastructure also requires high-voltage AC and DC transmission lines to help achieve the transition to green and low-carbon energy. The development of ultra-high voltage is the general trend. It is the infrastructure of infrastructure and is particularly important for the development of future science and technology industries. The construction of new infrastructure also requires high-voltage AC and DC transmission lines to help achieve the transition to green and low-carbon energy.

TI's analog and embedded processing products and system expertise can help customers design a variety of solutions to more effectively manage, measure and monitor power systems from power sources to end users over long distances. TI's semiconductors are used to design multi-level stackable converters to efficiently manage kV power rails and achieve real-time system protection and control, and can also reduce system downtime through smarter operations, thereby helping to improve system efficiency and robustness. In addition, using TI's microprocessors and wireless solutions can add intelligent features, allowing customers to predict faults early, achieve automatic inspection and self-healing operations.