Silicon Labs Launches New Family of Highly Integrated, Secure Wireless Gecko Modules

Silicon Labs (NASDAQ: SLAB) has introduced a new series of highly integrated, secure Wireless Gecko modules that reduce development cost and complexity to more easily add powerful mesh networking connectivity to a wide range of Internet of Things (IoT) products. The new MGM210x and BGM210x Series 2 modules support leading mesh networking protocols (Zigbee®, Thread and Bluetooth mesh), low-power Bluetooth and multi-protocol connectivity. From smart LED lighting to home and industrial automation, they can provide a one-stop wireless solution to improve mesh network performance in wired-powered IoT systems.

Time to market is a major challenge for IoT product developers and a potential competitive advantage. Silicon Labs' pre-certified xGM210x modules help reduce the R&D cycles associated with RF design and protocol optimization, allowing developers to focus on their end applications. These modules are pre-certified for North America, Europe, Korea, and Japan, minimizing the time, cost, and risk factors associated with global wireless certifications. The xGM210x modules can reduce time to market by months.

The new modules are based on Silicon Labs' Wireless Gecko Series 2 platform, which features industry-leading RF performance, a powerful Arm® Cortex®-M33 processor, a best-in-class software stack, a dedicated security core, and an operating temperature of up to +125°C for use in harsh environmental conditions. The xGM210x modules are designed to optimize the performance of resource-constrained IoT products without sacrificing functionality to affect communication reliability, product security, or field upgradability. The integrated RF power amplifier makes these modules ideal for long-range low-power Bluetooth applications that require hundreds of meters of line-of-sight connectivity.

“This new portfolio of application-optimized modules provides a quick and easy wireless entry point to mesh networking, helping IoT developers get connected products to market ahead of their competitors while protecting their investments in tools and software,” said Matt Saunders, vice president of marketing and applications for Silicon Labs’ IoT products. “Our fully integrated module design, comprehensive wireless protocol stack, state-of-the-art security and powerful development tools help our customers add wireless connectivity and mesh networking capabilities to IoT applications with minimal R&D investment, saving months of engineering effort and testing.”

The initial family of Series 2 module portfolio includes the industry’s first pre-certified wireless modules optimized for LED light bulbs and a universal printed circuit board (PCB) form factor module designed to meet the needs of a variety of ultra-small IoT products.

xGM210L modules are designed to meet the unique performance, environmental, reliability and cost requirements of smart LED lighting. These modules combine a custom form factor that facilitates installation in LED bulb housings, PCB antennas that maximize wireless range, high temperature ratings, extensive global regulatory certifications, and low operating power consumption to bring the perfect wireless solution for cost-sensitive, high-volume production smart LED bulbs.

The xGM210P module features a PCB form factor, integrated chip antenna and minimal structural clearance area, simplifying space-constrained IoT designs, including smart lighting, HVAC, building and factory automation systems.

IoT Security

The xGM210x modules offer best-in-class features that enable developers to implement strong security in IoT products. Secure boot with root of trust and secure loader (RTSL) technology helps prevent malware injection and rollback, ensuring reliable firmware execution and over-the-air (OTA) updates. A dedicated security core isolates the application processor and provides fast and efficient cryptographic operations through differential power analysis (DPA) countermeasures. A true random number generator (TRNG) compliant with NIST SP800-90 and AIS-31 strengthens device encryption. A secure debug interface with lock/unlock functionality allows authenticated access for enhanced fault analysis. The module's Arm Cortex-M33 core integrates TrustZone technology to achieve system-level hardware isolation for trusted software architectures.

Simplifying IoT development

Developers can further accelerate time to market by leveraging Silicon Labs' Simplicity Studio integrated development environment with a complete software stack , application demos and mobile apps. Advanced software tools, including a patented network analyzer and energy profiler, help developers optimize wireless performance and energy consumption for IoT applications.

Pricing and Availability

The xGM210P module is available in volume and samples now. The xGM210L module is planned to be available in volume and samples in Q4 2019. The Wireless Gecko Starter Kit Mainboard and Series 2 Radio Board are available now.