congatec launches server-on-modules based on AMD embedded technology

congatec Technologies, a leading provider of standard and customized embedded computer motherboards and modules, is launching its first server-on-module based on AMD embedded technology at the Embedded World in Nuremberg, Germany. The conga-B7E3 server-on-module uses the latest embedded server technology, the AMD EPYC 3000 embedded processor, which increases the number of instructions per clock by 52% compared to traditional architectures. Server-on-modules are the technological foundation for rugged server designs. Developers can use the new conga-B7E3 module as a drop-in replacement to improve performance within their closed-loop engineering design cycle in a variety of rugged edge applications. Application scenarios include Industry 4.0, smart robot cells for collaborative robots, autonomous robots and logistics vehicles, as well as virtualized on-premises devices in harsh environments to perform functions such as industrial routing, firewall security and VPN technology, and can also be combined with various real-time control and neural network computing for artificial intelligence (AI) applications.

“Embedded edge servers must always meet the highest performance requirements in demanding environments,” explains Martin Danzer, Director Product Management at congatec. “Manufacturers designing with Server-on-Modules can implement these new features on edge server platforms quite easily via closed-loop migration, as the modules are highly compatible with the software of the respective solutions and expose the various functionalities of our continuously expanding Server-on-Module portfolio via standardized APIs.”

“We are very excited to see customers like congatec and the industry using AMD EPYC Embedded 3000 processors in unique ways that leverage the heritage and experience of the EPYC datacenter architecture,” said Stephen Turnbull, director of product marketing for AMD Embedded Solutions. “With the latest congatec standardized Server-on-Modules featuring our AMD EPYC Embedded 3000 SoC, customers can build and configure new modular server platforms with the performance they need for potential edge computing applications.”

For edge server deployments, the server-on-module supports an extended temperature range (-40 to 85°C) for selected versions, as well as comprehensive RAS (reliability, availability and serviceability) features common to all versions. They implement the same efficient remote system monitoring, management and maintenance functions to optimize the total cost of ownership (TCO) in distributed deployments, such as commercial-grade data centers. Edge applications benefit from hardware-integrated virtualization and a comprehensive security approach, including a secure boot system, secure memory encryption (SME) and secure encrypted virtualization (SEV), as well as a secure migration channel between two SEV platforms. Internet Protocol Security Protocol (IPsec) with integrated cryptographic acceleration is also supported. As a result, even server administrators cannot access such encrypted virtual machines (VMs). This is very important for the high security required by many edge server vendors, which must enable multi-vendor mechanisms in Industry 4.0 automation while effectively preventing hackers from sabotaging them.

New Server Module Features

       The conga-B7E3 COM Express Type 7 Computer-on-Module features AMD EPYC Embedded 3000 processors with 4, 8, 12 or 16 high-performance cores, as well as simultaneous multi-threading (SMT) and up to 96 GB of DDR4 2666 memory. In a COM Express Basic Type 7 form factor measuring just 125 x 95 mm, the module supports up to 4 10 GbE and up to 32 PCIe Gen 3 lanes. For storage, the module even integrates an optional 1 TB NVMe SSD and offers 2 SATA Gen 3.0 ports for traditional storage devices. Other interfaces include 4 USB 3.1 Gen1, 4 USB 2.0 as well as 2 UARTs, GPIO, I2C, LPC and SPI. Attractive features also include seamless support for dedicated high-end GPUs and improved floating-point performance, which are essential for emerging AI and HPC applications. congatec also offers advanced cooling solutions for the conga-B7E3 COM Express Type 7 Server-on-Modules, which support fanless cooling even above 65W TDP and can be adapted to the customer's enclosure. This enables OEMs to integrate maximum processor performance into their designs, as performance is often limited by the system's cooling capabilities. Operating systems supported include Linux and Yocto, as well as Microsoft Windows 10 and Windows Server.

The new conga-B7E3 COM Express Type 7 Server-on-Modules offer the following standard features: