TDK provides miniaturized common mode filters for automotive high-speed differential transmission
TDK Corporation has developed the KCZ1210DH series of common mode filters for automotive applications. The series provides noise control for automotive high-speed differential transmission signal lines in a 1210 case size (1.25 x 1.0 x 0.5 mm) and will begin mass production in February 2022.
With the increase of advanced driver assistance systems, the demand for forward sensing cameras and panoramic monitoring imaging systems is growing rapidly. Common mode filters are used in the signal lines of autonomous driving car cameras as noise suppression products. In order to process large-capacity video signals, the signal transmission rate will continue to increase to build a safe and reliable autonomous driving system.
This product supports high-speed signals with a transmission rate of more than 10Gbps. In addition, due to the increase in speed, this product also helps to control noise in the GHz band. By supporting an operating temperature range of -55 ºC to +125 ºC and adopting a conductive resin-based electrode, this product can control gaps caused by thermal shock in the product while increasing durability against mechanical stress such as substrate strain. The overall dimensions are 1.25 (length) × 1.0 (width) × 0.5 mm (height), which can save board installation space.
TDK is working to enhance the product's use in sensing devices for advanced driver assistance systems and will expand its line of miniaturized common mode filters to further support market demand for high-speed differential signaling.
Features and Applications
main application
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High-speed interface
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HDMI1.4/ 2.0 (3.4 Gbps / 6 Gbps), LVDS/ MIPI D-PHY(4.5 Gbps), USB3.0 / 3.1 Gen1 (5 Gbps), USB3.1 Gen2 (10 Gbps), Next Gen Interface(10 Gbps~)
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Advanced Driver Assistance Systems
Key Features and Benefits
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Supports high-speed differential transmission over 10Gbps
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Maximum operating temperature 125 ºC
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Conductive resin-based electrodes are used to reduce mechanical and thermal stress
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Compact size of 1.25 (L) × 1.0 (W) × 0.5 mm (H) to save space
Key data
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