Analyst: TSMC will mass produce 2nm within five years
Latest update time：2021-09-05 06:23
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TSMC's 5nm technology surpasses Samsung. According to the latest survey by foreign bank JPMorgan Chase, TSMC has made great strides in advanced process and has the opportunity to lead its competitors in the more niche 2nm. It will be able to mass-produce 2nm as early as 2024, that is, within five years;
it will be the first wafer foundry to mass-produce 2nm, grabbing large orders from customers such as Huawei and Apple.
Foreign investors are optimistic about TSMC's operations and have been increasing their investment in recent days. Following the record high spot price last Friday (6th), the ADR rose 0.99% in the evening to close at US$54.94. The spot price is calculated to be NT$335, which has the potential to set a record high.
5nm will be mass-produced next year, 3nm in 2022
TSMC held a supply chain management forum yesterday (5th), revealing three important indicators in front of more than 700 supply chain executives:
including 5nm mass production in the first half of next year;
next year's capital expenditure is similar to this year's 14 billion to 15 billion US dollars;
the new R&D center will start construction in the first quarter of next year and is expected to be completed and put into use in 2021, supporting the R&D of 3 nanometers and below and more advanced technologies in the next 20 years.
TSMC's Supply Chain Management Forum highly emphasized the positive and optimistic future prospects. Foreign buying reignited yesterday, pushing the stock price up by 6 yuan to close at 312 yuan. The market value returned to 8.09 trillion yuan, and foreign capital turned to buying 14,561 shares.
As TSMC enters the critical countdown to 5nm mass production, the company's materials and risk management department responsible for supply chain management attaches great importance to this year's Supply Chain Management Forum, mobilizing more than 700 suppliers of equipment, raw materials, packaging, testing, factory services, information systems and services from around the world to participate.
TSMC President Wei Zhejia was absent from the meeting yesterday as he was visiting an important overseas customer. The meeting was hosted by TSMC Senior Vice President of Materials and Risk Management Lin Jinkun and Senior Vice President of Operations Wang Jianguang. They thanked all suppliers for their full assistance in completing this important feat and looked forward to continued cooperation with suppliers to prepare for 5nm.
Wang Jianguang said that TSMC will continue to expand its 7nm production capacity, and the 5nm process will be mass-produced in the first half of next year.
In response to the strong demand for 7nm and 5nm processes, this year's capital expenditure has been raised to US$14 billion to US$15 billion, and will remain at the same level next year.
TSMC's 5nm process is the world's first wafer fab to use extreme ultraviolet (EUV) lithography equipment to provide wafer foundry services. The first and second phases of Fab 18 in Nanke have completed installation and are actively carrying out cleaning operations before mass production.
It is understood that Apple's next-generation processors, HiSilicon's next-generation mobile phone and base station chips, AMD's next-generation central processing unit, and Qualcomm's new mobile phone chips will all be produced using TSMC's 5nm process. TSMC's third-phase plant, which will provide an enhanced 5nm process, will also begin installation in mid-2020 and go into mass production in the fourth quarter.
As for the fourth to sixth phases of Fab 18, the most advanced 3-nanometer technology will be introduced to lead the world again.
Wang Jianguang said that TSMC's 3-nanometer process is expected to be mass-produced in 2022. The
R&D center located in Baoshan, Hsinchu, started construction in the first quarter of 2020 and will be completed in 2021. It will be TSMC's R&D base for 3-nanometer and advanced technologies in the next 20 years.
*Disclaimer: This article is originally written by the author. The content of the article is the author's personal opinion. Semiconductor Industry Observer reprints it only to convey a different point of view. It does not mean that Semiconductor Industry Observer agrees or supports this point of view. If you have any objections, please contact Semiconductor Industry Observer.
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