Changing the market landscape, SP Zhongpeng ranks among the top ten semiconductor plastic packaging material manufacturers in the world

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Information from the "2012 China Semiconductor Plastic Encapsulation Materials Research Report" of the Packaging Branch of the China Semiconductor Industry Association: The top ten semiconductor plastic encapsulation material manufacturers in the world in 2012 are: 1. Japan's Sumitomo Bakelite, 2. Japan's Hitachi Chemical, 3. Taiwan's Changchun Sumitomo Chemical, 4. Germany 's Henkel Warwick, 5. Japan's Panasonic Electric, 6. Japan's Kyocera Chemical, 7. South Korea's KCC , 8. South Korea's Samsung Cheil , 9. Chinese brand Zhongpeng SP , 10. Japan's Shin-Etsu Chemical (Source: Prismark) ; among them, six are Japanese (Hitachi acquired Japan's Nitto plastic encapsulation materials business in early 2012, and Panasonic acquired Singapore's Cookson plastic encapsulation materials business in 2010). The top four Japanese manufacturers have factories in mainland China. Taiwan's Changchun is a joint venture between Japan's Sumitomo and Taiwan's Changchun Group, which only produces low-end products. Among the four non-Japanese companies, two are Korean and have not yet set up factories in mainland China; among the four non-Japanese companies, one is European, American and one is Chinese, both of which are located in Lianyungang, Jiangsu; the foreign company Henkel Huawei is the result of the German Henkel Group's acquisition of the American Hysol plastic encapsulation business in 2000, and the acquisition and control of Jiangsu Huawei Electronics in 2005, and then the integration and conversion of production; the Chinese company Jiangsu Zhongpeng is the top Chinese-owned sales champion of Lianyungang plastic encapsulation materials in the world , and is committed to building a world-class non-Japanese environmentally friendly plastic encapsulation material brand.

In 2012, the global plastic encapsulation compound output was 137,900 tons, with a negative growth rate of 12.7% compared with 2011 (Source: Prismark) ; Japan, China and South Korea are the world's three largest producers of epoxy molding compounds (EMC) for semiconductor packaging ; Jiangsu Zhongpeng New Materials Co., Ltd., foreign-owned Changchun Sealing Plastics (Changshu) Co., Ltd. and Henkel Huawei Electronics Co., Ltd. are the three world-class semiconductor plastic encapsulation compound brands in mainland China, and are also the top three sales brands in the Chinese market; in 2013, the leading Chinese enterprise Zhongpeng Packaging Plastic Encapsulation Compound expanded its production to 14,000 tons/year (surpassing the scale of leading Korean enterprises), and took the lead in expanding the market for advanced packaging plastic encapsulation compounds (GBA QFN TSSOP SP-G900), accelerating its development and growth in the competition with the localized Japanese Sumitomo/Changchun and Japanese Hitachi (Nisto), and the European and American Henkel Huawei may accelerate its marginalization.

SinoPeng Green and environmentally friendly SP-G900 (EME-G750) SP-G880 SP-G610 (EME-G600) SP-G480 SP-G402 SP-G360 SP-G260 SP-G160 (EME-E120), lead-free low stress SP-700 (EME6600CS) SP-480S (KL-4500) SP-400DH, ordinary SP-100 (EME1200/2500 KL1000) and other three types of EMC series, products are used in BGA QFN LQFP TSOP SOP SOT SOD DIP TO DO and other packaging forms, accelerate the research and development of national 02 special project SiP BGA CSP and TSV 3D IC green and environmentally friendly EMC and industrialization (www.sinopaco.com).

Zhongpeng New Materials Lianyungang (EMC packaging plastics), Ningbo Kangqiang Electronics (lead frame bonding wire), Shanghai Synthetic Resin Research Institute (DAD chip glue), Tongling Sanjia (injection press plastic mold lead frame), Beijing Dabo (bonding wire) are the largest and most influential packaging support brands in China! Unfortunately, among these companies, only Jiangsu Zhongpeng New Materials participated in the IC CHINA 2013 Shanghai New International Expo Center Exhibition and Summit Forum, and the others were absent.

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