SMIC's 28nm process explodes! Qualcomm and HiSilicon are here

Latest update time：2021-09-15 18:35

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Li Xuwu, senior vice president of technology research and development at Semiconductor Manufacturing International Corporation (SMIC), recently revealed that in addition to Qualcomm, Broadcom and Huawei's HiSilicon have also become new customers of SMIC's 28nm process.

Li Xuwu said that SMIC's 28nm process yield is quite good and there is still room for further improvement. Now, Qualcomm is willing to be its first customer, and SMIC is confident in its 28nm.

At present, SMIC's 28nm PolySiON process has been put into mass production, and the higher-performance 28nm HKMG is also ready for commercial production. Broadcom and HiSilicon have signed contracts, and a large number of Chinese local IC manufacturers are emerging. He is confident that everyone will place orders after the process is put into mass production. Regarding

TSMC's upcoming establishment of a 300mm wafer production line in China, Li Xuwu admitted that TSMC's technology is more advanced and is very strong in the world, and SMIC needs to work hard to catch up.

In June this year, SMIC announced that it would jointly enter the 14nm FinFET process with Huawei, Qualcomm, and the Belgian Microelectronics Research Center (IMEC), and it is expected to be put into risk trial production as early as 2018.

Source: Fast Technology

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