The SN74LVC1G08 performs the Boolean funcTIon or Y = A • B or Y = A + B in posiTIve logic.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for parTIal-power-down applicaTIons using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
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