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[Synopsys IP Resources] Prototyping as a Service (PaaS): Breaking through chip design process bottlenecks and simplifying the path to innovation
The success of tape-out is undoubtedly the common goal of all chip developers, otherwise the time-consuming and long-lasting efforts and the high costs of tape-out will be wasted. FPGA-based prototype
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[Xianji HPM6750 Review] + Environment Setup Test
In the previous article, we introduced the relevant performance after unpacking. In this article, we use two routines to complete the initial development test.First, we unzip the SDK. There are some c
EEWORLD University ---- Webinar: Thermal Monitoring and Protection
Webinar: Thermal Monitoring and Protection : https://training.eeworld.com.cn/course/5285Thermal monitoring is a classic techniques used to enhance system efficiency while ensuring system safety and he
How to solve the power supply ripple
I designed a project, which is similar to the previous project. There are LDO33 and LDO120 inside, but the ripple of 3.3 and 1.2 measured by myself is very large. The filter circuits are the same and
【AT-START-F425 Review】No.06 Driving Segment LCD
Today at 10:00 AM Award-winning live broadcast: STMicroelectronics SiC products and industrial application guide
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Do you think domestic regulators will prevent Nvidia from acquiring ARM?
[Qinheng RISC-V core CH582] Application of ADC and general controller

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DSP final exam key points