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High-speed placement technology for packaged devices

  • 2013-09-29
  • 283.5KB
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              High-speed placement technology for packaged devices [pic] | | | || || High-speed placement technology for packaged devices || || || || || || As area array packages become increasingly important, especially in the fields of automotive, telecommunications and computer applications, productivity has become a focus of discussion. The main problem of fine-pitch QFP and TSOP packages with a pin pitch of less than 0.4mm, i.e. 0.5mm, is the low productivity. However, since the pin pitch of area array packages is not very small (e.g., less than 200μm for flip chips), after reflow, the DMP rate is at least 10 times better than that of conventional fine-pitch technology. Furthermore, compared with QFP and TSOP packages of the same pitch, considering the automatic alignment during reflow, its placement precision...             

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