2023 Synopsys Developer Conference: Leading the way with innovation, foreseeing the future with foresight

Shanghai, China – On September 8, the chip industry’s annual carnival “2023 Synopsys Developer Conference” was successfully held in Shanghai with nearly 3,000 developers. With the theme of "Vision", this conference will analyze technological innovation and multiple technologies with hundreds of technology industry leaders and developers through the summit forum, two leading chip technology forums and five industry technology forums covering cutting-edge fields. The future development direction of the technology field, predicting the future with foresight.

"What is 'vision'? See what others have not seen, think about what others have not thought of, and dare to see what others have not done," said Ge Qun, global senior vice president of Synopsys Technology and chairman and president of Synopsys China: "Face-to-face In times of uncertainty, our industry must look to the future and accumulate strength for longer-term development.”

Ge Qun shared two suggestions for future development. Talent is the foundation for the development of the chip industry. Looking to 2030, today's teenagers will become the mainstay of the future chip industry. Synopsys has extended its talent training strategy from professionals and college students to teenagers, and is committed to cultivating more "second generation cores" who will reshape the future. On the other hand, under the guidance of the dual carbon goals, energy structure changes and emission reductions in key areas are crucial. Therefore, our industry also considers future development earlier and continues to innovate in green technology to help build a future in which man and nature coexist harmoniously. Synopsys looks forward to working with more partners who share the same ideals to promote chip knowledge to a wider group of people and jointly promote the entire society to continue to move toward low-carbon and green development.

Scientific and technological foresight, leading the future with innovation

Visionaries, predict the future! In the keynote speech at the Developer Conference, Synopsys Global President Sassine Ghazi forward-lookingly proposed five major challenges that chip developers will face in the SysMoore era: software complexity, system complexity, energy efficiency, information security and functional safety, and Product time to market.

In this regard, Synopsys uses electronic digital twin technology to create virtual models and perform hardware-assisted software development to address software complexity challenges; it uses 3DIC Compiler, Die-to-Die interfaces, and chip lifecycle management to support multi-die chip system innovation ;Proposed an end-to-end low-power solution that covers the complete process from architecture, RTL, implementation to sign-off; utilized three-stage chip life cycle management including chip, system and application levels to achieve automotive functions and information security; relying on the industry Synopsys.ai, the first full-stack AI-driven EDA solution and its extensive IP portfolio, help developers significantly improve productivity and accelerate product time to market.

Sassine finally emphasized: "China accounts for approximately 50% of global semiconductor chip consumption, and China's demand and technological innovation continue to influence the direction of global technology development. Synopsys has been deeply involved in the Chinese market for 28 years and supports the development of China's semiconductor industry." In the future, we will continue to work with partners in the upstream and downstream industries to continue to promote the accelerated development of the entire ecosystem. Only by working together can we create a better future!”

Industry foresight and cooperation to seek common development

Visionaries, see the overall situation! No era has relied as much on the power of technology as it does today, and the realization of collaborative innovation in the chip industry chain will surely press the "accelerator button" for technological development. During the peak dialogue session, Dr. Shi Kan, a well-known science and technology blogger, served as the moderator and met with Dr. Chen Ping, deputy general manager of TSMC (China), Dr. Wang Kai, founder, chairman and CEO of Xinqing Technology, and Synopsys Global Technology Innovation Wang Bingda, Vice President of Strategic Cooperation, and Dr. Wang Xiaonan, Global Vice President of Synopsys, conducted in-depth discussions on the opportunities and challenges brought by emerging technologies such as AI and large models, as well as industrial ecological cooperation and other topics.

The rise of AI and large models has given rise to diversified implementation scenarios, including the automotive field. According to Dr. Wang Kai, there are five major challenges for implementation: huge demand for computing power, data volume, reliability, traceability and compliance. , only through more forward-looking innovation can we usher in the "AI moment" of the automotive industry. Dr. Wang Xiaonan pointed out that as models become larger and have more parameters, this means that the bandwidth and interconnection requirements between different computing units are becoming higher, which places higher demands on chip design and EDA tools. EDA+ AI will be a development track that developers need to pay special attention to.

Many people believe that Moore's Law is reaching its limit, but the pace of chip energy efficiency ratio optimization has not stopped. Dr. Chen Ping emphasized that the challenges of large computing power brought by large models can only be solved by maintaining the traditional device shrinkage schedule, combining advanced 3D processes, and co-optimizing with the design end and system end. Wang Bingda said that over the years, Synopsys' leading technologies have penetrated into all aspects of the semiconductor industry chain such as design, manufacturing and software, which allows us to have a broader technological innovation landscape. We hope to become a catalyst in this ecosystem and continue to create better interactions within the entire ecosystem.

When talking about industrial ecological cooperation, the guests all said that responding to the development of new technologies requires a whole-industry chain thinking, and starting from the market and specific application scenarios, in order to better meet customer needs. Finally, industry leaders also shared their "heart-to-heart" suggestions with young developers based on their own experiences. They all believe that only technological innovation can produce real value. They hope that young developers will maintain their passion and continuous investment, accelerate with 120 points of strength, and form their own core competitiveness.

Technological vision, breaking boundaries with change

Visionaries, seek to create change! The technical forums after the summit forum focused on the five popular tracks of "artificial intelligence", "smart cars", "data centers", "digital twins", and "XR and mobile". Technology gurus used cutting-edge innovation speeches to deconstruct chip technology innovation and implementation directions, and work with developers to foresee the future of technology.

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As large models are gradually implemented, data centers bear huge demands for computing power. At the same time, it is also a key infrastructure that supports the innovative development of the digital economy and empowers applications in thousands of industries. At the data center technology forum, well-known corporate experts in the industry expressed their opinions on the transformation and development of data centers. Ji Longwei, Global Vice President of AMD and General Manager of AMD China R&D Center, believes that high-performance and adaptive computing product portfolios incorporating AI will drive the future development and transformation of data centers. At the same time, Wang Jincheng, vice president of R&D at Hongjun Microelectronics, proposed that the scale and architectural model changes of comprehensive data centers will be led by end-to-end integrated data center solutions. Faced with the increasing demand for high-performance general-purpose GPU chips, Ding Yunfan, vice president of system architecture of Biren Technology, introduced in detail at the artificial intelligence technology forum how to deal with the special needs of large models on the chip, software and system levels through software and hardware collaboration.

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At the Smart Car Technology Forum, Dr. Yang Xinxin, senior vice president of R&D at Xinqing Technology, analyzed the advantages and design features of heterogeneous computing architecture car-scale chips from the perspective of the new trend of automotive domain control integration. As a domestic professional RISC-V CPU IP and solution provider, Xinlai Technology CEO Peng Jianying believes that the Z01X solution has functions such as high-speed simulation, statistical sampling and extensive fault modeling, which can accelerate functional safety RISC-V CPU IP development and ISO 26262 certified.

Digital twin technology is leading the real world to the digital future, promoting innovation and progress in various fields. At the Digital Twin Technology Forum, MiTech General Manager Guo Tianyi explained how digital twin technology and Metaverse technology will promote the development of digital intelligence as the next generation of digital revolution. When digital twins meet the metaverse, Zhang Xiaojun, founder and CEO of Vision+AR, uses the spatial computing open platform as an entry point to envision a future where the metaverse and the real world are seamlessly connected.

At the XR and Mobile Technology Forum, Wang Haiqing, Chief Financial Officer of Gravity, showed developers how to use chips as carriers and hardware technology and algorithms as support to provide the industry with the next generation of complete XR technology solutions.

Vision for the future, creating vision with new power

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Visionaries, to new life! This developer conference also created a special science exhibition "Chip Changes the World" and a "Chip Youth Laboratory" for young people, and welcomed a group of "future developers" from various middle schools in Shanghai. They understood the great role of small chips through popular science + practical operations on site, learned to examine life scenes from a "digital" perspective, and designed their own chip applications to solve practical problems in life through the youth version of EDA tools. , ignite their curiosity and let technological innovation start from the younger generation.