Assembly Process Introduction Manufacturing Process and Related Instructions Place the basket loaded with iron rings into the cutting machine, and use automatic feeding/identification/cutting/cleaning/drying to cut through and separate each die on the wafer. The motion coordinates of the tool must be set before cutting. During cutting, the debris is rinsed with pure water, and then dried with Spin Dry. Indirect materials: pure water Fixtures: blades Use a high-power microscope to sample and check whether the quality of the cut die is defective, broken/scratched/silicon powder residues, etc.
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