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Printed circuit board processing flow - inner layer production

  • 2013-09-20
  • 591.29KB
  • Points it Requires : 2

Dry the inner film. Leave it for 15 minutes. Leave it for 15 minutes. Chemically clean. Roll the dry film. Expose and develop. Chemically clean with alkaline solution to remove oil, fingerprints and other organic dirt on the copper surface. Then use acidic solution to remove the oxide layer and the protective coating on the original copper substrate to prevent copper from being oxidized. Finally, micro-etching is performed to obtain a fully roughened surface with excellent adhesion to the dry film.

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