The wafer-level packaging process based on BCB was studied. This process represents the development trend of MEMS accelerometer sensor packaging and is the key to the industrialization of MEMS accelerometers. The 3000 series BCB material was selected for the bonding process test of MEMS sensors, which solved the wafer-level packaging problem. The wafer-level packaging of the accelerometer was realized at a low temperature of 250 ℃ and with the assistance of appropriate pressure ≤2.5 bar (1 bar=100 kPa), and many related process parameters such as spin coating, bonding, atmosphere, and pressure were optimized.
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