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Study on Assembly Technology of Microstrip Isolator

  • 2013-09-22
  • 82.2KB
  • Points it Requires : 2

  The failure mechanism of cracks or even breakage of the ferrite substrate in the microstrip isolator caused by assembly mechanical stress is analyzed, several low-stress joint structures connecting the microstrip isolator with other circuit units are given, and the causes and countermeasures of the melting corrosion phenomenon of the AgPd thick film conductor in the microstrip isolator during the welding process are discussed.

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