AM29LV400BB120WAK datasheet, PDF

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AM29LV400BB120WAK: DescriptionFlash, 256KX16, 120ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, LEAD FREE, FBGA-48; Categorystorage storage; File Size1MB，48 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/; Environmental Compliance

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AM29LV400BB120WAK Overview

Flash, 256KX16, 120ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, LEAD FREE, FBGA-48

AM29LV400BB120WAK Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	SPANSION
Parts packaging code	BGA
package instruction	6 X 8 MM, 0.80 MM PITCH, LEAD FREE, FBGA-48
Contacts	48
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Maximum access time	120 ns
Other features	BOTTOM BOOT BLOCK
Spare memory width	8
startup block	BOTTOM
command user interface	YES
Data polling	YES
Durability	1000000 Write/Erase Cycles
JESD-30 code	R-PBGA-B48
JESD-609 code	e1
length	8.15 mm
memory density	4194304 bit
Memory IC Type	FLASH
memory width	16
Humidity sensitivity level	3
Number of functions	1
Number of departments/size	1,2,1,7
Number of terminals	48
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	256KX16
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Encapsulate equivalent code	BGA48,6X8,32
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
power supply	3/3.3 V
Programming voltage	3 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	1.2 mm
Department size	16K,8K,32K,64K
Maximum standby current	0.000005 A
Maximum slew rate	0.03 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
switch bit	YES
type	NOR TYPE
width	6.15 mm

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Am29LV400B

Data Sheet

RETIRED

PRODUCT

This product has been retired and is not available for designs. For new and current designs,

S29AL004D supersedes Am29LV400B and is the factory-recommended migration path. Please refer

to the S29AL004D datasheet for specifications and ordering information. Availability of this docu-

ment is retained for reference and historical purposes only.

The following document contains information on Spansion memory products.

Continuity of Specifications

There is no change to this data sheet as a result of offering the device as a Spansion product. Any

changes that have been made are the result of normal data sheet improvement and are noted in the

document revision summary.

For More Information

Please contact your local sales office for additional information about Spansion memory solutions.

Publication Number

21523

Revision

Amendment

Issue Date

December 4, 2006

D A T A

S H E E T

TABLE OF CONTENTS

Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 4

Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . 5

Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . 6

Special Handling Instructions for (FBGA) ......................................7

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 8

Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 9

Table 1. Am29LV400B Device Bus Operations ......................................9

Table 6. Write Operation Status ........................................................... 23

Absolute Maximum Ratings. . . . . . . . . . . . . . . . . 24

Figure 7. Maximum Negative Overshoot Waveform............................. 24

Figure 8. Maximum Positive Overshoot Waveform .............................. 24

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 25

Figure 9. I

CC1

Current vs. Time (Showing Active and Automatic

Sleep Currents)..................................................................................... 26

Figure 10. Typical I

CC1

vs. Frequency................................................... 26

Word/Byte Configuration ................................................................9

Requirements for Reading Array Data ...........................................9

Writing Commands/Command Sequences .................................. 10

Program and Erase Operation Status .......................................... 10

Standby Mode .............................................................................. 10

Automatic Sleep Mode ................................................................. 10

RESET#: Hardware Reset Pin ..................................................... 10

Output Disable Mode ................................................................... 11

Table 2. Am29LV400BT Top Boot Sector Address Table .....................11

Table 3. Am29LV400BB Bottom Boot Sector Address Table ...............11

Test Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Figure 11. Test Setup ........................................................................... 27

Table 7. Test Specifications .................................................................. 27

Figure 12. Input Waveforms and Measurement Levels ........................ 27

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 28

Read Operations .......................................................................... 28

Figure 13. Read Operations Timings.................................................... 28

Hardware Reset (RESET#) .......................................................... 29

Figure 14. RESET# Timings ................................................................. 29

Autoselect Mode .......................................................................... 12

Table 4. Am29LV400B Autoselect Codes (High Voltage Method) ........12

Word/Byte Configuration (BYTE#) ............................................. 30

Figure 15. BYTE# Timings for Read Operations .................................. 30

Figure 16. BYTE# Timings for Write Operations .................................. 30

Sector Protection/Unprotection .................................................... 12

Figure 1. In-System Sector Protect/Unprotect Algorithms .................... 13

Erase/Program Operations .......................................................... 31

Figure 17. Program Operation Timings ................................................

Figure 18. Chip/Sector Erase Operation Timings .................................

Figure 19. Data# Polling Timings (During Embedded Algorithms) .......

Figure 20. Toggle Bit Timings (During Embedded Algorithms) ............

Figure 21. DQ2 vs. DQ6 .......................................................................

Figure 22. Temporary Sector Unprotect Timing Diagram.....................

Figure 23. Sector Protect/Unprotect Timing Diagram...........................

Figure 24. Alternate CE# Controlled Write Operation Timings .............

Temporary Sector Unprotect ........................................................ 14

Figure 2. Temporary Sector Unprotect Operation................................. 14

Hardware Data Protection ............................................................ 14

Low V

Write Inhibit .................................................................... 14

Write Pulse “Glitch” Protection ..................................................... 14

Logical Inhibit ............................................................................... 14

Power-Up Write Inhibit ................................................................. 14

Command Definitions . . . . . . . . . . . . . . . . . . . . . 15

Reading Array Data ...................................................................... 15

Reset Command .......................................................................... 15

Autoselect Command Sequence .................................................. 15

Word/Byte Program Command Sequence ................................... 15

Unlock Bypass Command Sequence ........................................... 16

Figure 3. Program Operation ................................................................ 16

Chip Erase Command Sequence ................................................. 16

Sector Erase Command Sequence .............................................. 17

Erase Suspend/Erase Resume Commands ................................ 17

Figure 4. Erase Operation..................................................................... 18

Table 5. Am29LV400B Command Definitions .......................................19

Write Operation Status . . . . . . . . . . . . . . . . . . . . 20

DQ7: Data# Polling ...................................................................... 20

Figure 5. Data# Polling Algorithm ......................................................... 20

RY/BY#: Ready/Busy# ................................................................. 21

DQ6: Toggle Bit I .......................................................................... 21

DQ2: Toggle Bit II ......................................................................... 21

Reading Toggle Bits DQ6/DQ2 .................................................... 21

DQ5: Exceeded Timing Limits ...................................................... 22

DQ3: Sector Erase Timer ............................................................. 22

Figure 6. Toggle Bit Algorithm............................................................... 22

Erase And Programming Performance. . . . . . . . 39

Latchup Characteristics . . . . . . . . . . . . . . . . . . . 39

TSOP And SO Pin Capacitance . . . . . . . . . . . . . 39

BGA Ball Capacitance . . . . . . . . . . . . . . . . . . . . . 40

Data Retention . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

TS 048—48-Pin Standard TSOP ................................................. 41

TSR048—48-Pin Reverse TSOP ................................................. 42

FBA048—48-ball Fine-Pitch Ball Grid Array (FBGA)

6 x 8 mm package ........................................................................ 43

SO 044—44-Pin Small Outline Package ..................................... 44

Revision A (January 1998) ........................................................... 45

Revision B (July 1998) ................................................................. 45

Revision B+1 (August 1998) ........................................................ 45

Revision C (January 1999) ........................................................... 45

Revision C+1 (July 2, 1999) ......................................................... 45

Revision D (January 3, 1999) ....................................................... 45

Revision D+1 (November 8, 2000) ............................................... 45

Revision D+2 (October 30, 2003) ................................................ 45

Revision D+3 (December 13, 2005) ............................................. 45

Revision D4 (December 4, 2006) ................................................. 45

December 4, 2006 21523D4

Am29LV400B

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