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Electronic integrated circuit packaging technology and transfer mold design

  • 2013-09-22
  • 220.14KB
  • Points it Requires : 1

  The packaging process of electronic integrated circuits is introduced. According to the packaging requirements of electronic integrated circuits, the key points of transfer mold structure design are proposed. In particular, new requirements are put forward for the flow channel design, injection head structure, cavity design and prevention of island movement of large packaging transfer molds, so as to improve the packaging quality of electronic integrated circuits.

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