The interface behavior of surface mounted solder joints has a decisive influence on the reliability of the entire solder joint. The study of the interface behavior between solder alloys and printed circuit boards and device metallization layers is of great significance for the development of reliability prediction theory and testing technology for surface mounted solder joints, and the development of high-reliability solders, especially environmentally friendly Pb-free solders. This paper studies the interfacial compound growth behavior of SnAgCu lead-free solder alloy/Cu interface under thermal-shear cycling conditions. The results show that under thermal-shear cycling conditions, the growth rate of intermetallic compounds at the SnAgCu lead-free solder alloy/Cu interface is faster than that under thermal cycling without shear strain; the growth rate of intermetallic compounds increases with the increase of shear strain (stress).
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