In view of the thermal failure problem that is prone to occur in electronic systems, this paper discusses the estimation and measurement methods of the junction temperature of semiconductor devices in the thermal management design and verification of electronic systems. By measuring the internal diode parameters of the semiconductor device, the relationship curve between the forward voltage drop of the diode and its temperature is plotted, and then the estimated value of the junction temperature of the device is solved to guide the thermal management design; the actual junction temperature of the device is calculated by thermal distribution measurement and extreme value measurement, and the thermal management design is evaluated and verified. Using the estimation and measurement methods, the semiconductor junction temperature can be measured with an accuracy of ±5%, which can effectively evaluate the thermal reliability of the device in a specific electronic system and provide a reliable data analysis basis for reliable thermal management.
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