MC14073BD datasheet, PDF - EEWORLD Datasheet

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MC14073BD: DescriptionLogic Gates 3-18V Triple 3-Input; Categorylogic logic; File Size159KB，12 Pages; ManufacturerON Semiconductor; Websitehttp://www.onsemi.cn

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MC14073BD Overview

Logic Gates 3-18V Triple 3-Input

MC14073BD Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	ON Semiconductor
Parts packaging code	SOIC
package instruction	SOP, SOP14,.25
Contacts	14
Reach Compliance Code	not_compliant
Factory Lead Time	1 week
series	4000/14000/40000
JESD-30 code	R-PDSO-G14
JESD-609 code	e0
length	8.65 mm
Load capacitance (CL)	50 pF
Logic integrated circuit type	AND GATE
Humidity sensitivity level	1
Number of functions	3
Number of entries	3
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP14,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
method of packing	RAIL
Peak Reflow Temperature (Celsius)	240
power supply	5/15 V
Prop。Delay @ Nom-Sup	300 ns
propagation delay (tpd)	300 ns
Certification status	Not Qualified
Schmitt trigger	NO
Maximum seat height	1.75 mm
Maximum supply voltage (Vsup)	18 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	3.9 mm
Base Number Matches	1

MC14073BD Related Products

	MC14073BD	MC14001BD	MC14081BDR2	MC14081BFEL	MC14011BDR2	MC14071BDTR2	MC14023BDR2	MC14073BFEL	MC14023BCP
Description	Logic Gates 3-18V Triple 3-Input	Logic Gates 3-18V Quad 2-Input	Logic Gates 3-18V Quad 2-Input	Logic Gates 3-18V Quad 2-Input		Logic Gates 3-18V Quad 2-Input	Logic Gates 3-18V Triple 3-Input	Logic Gates 3-18V Triple 3-Input	Logic Gates 3-18V Triple 3-Input
Is it Rohs certified?	incompatible	incompatible	incompatible	conform to	incompatible	conform to	incompatible	conform to	incompatible
Maker	ON Semiconductor	ON Semiconductor	ON Semiconductor	ON Semiconductor	ON Semiconductor	ON Semiconductor	ON Semiconductor	ON Semiconductor	ON Semiconductor
Parts packaging code	SOIC	SOIC	SOIC	SOIC	SOIC	TSSOP	SOIC	SOIC	DIP
package instruction	SOP, SOP14,.25	SOIC-14	SOP, SOP14,.25	SOP, SOP14,.3	SOP, SOP14,.25	LEAD FREE, TSSOP-14	SOIC-14	EIAJ, SO-14	DIP, DIP14,.3
Contacts	14	14	14	14	14	14	14	14	14
Reach Compliance Code	not_compliant	not_compliant	not_compliant	unknown	not_compliant	unknown	not_compliant	unknown	not_compliant
series	4000/14000/40000	4000/14000/40000	4000/14000/40000	4000/14000/40000	4000/14000/40000	4000/14000/40000	4000/14000/40000	4000/14000/40000	4000/14000/40000
JESD-30 code	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PDIP-T14
JESD-609 code	e0	e0	e0	e4	e0	e4	e0	e4	e0
length	8.65 mm	8.65 mm	8.65 mm	10.2 mm	8.65 mm	5 mm	8.65 mm	10.2 mm	18.86 mm
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	AND GATE	NOR GATE	AND GATE	AND GATE	NAND GATE	OR GATE	NAND GATE	AND GATE	NAND GATE
Number of functions	3	4	4	4	4	4	3	3	3
Number of entries	3	2	2	2	2	2	3	3	3
Number of terminals	14	14	14	14	14	14	14	14	14
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	SOP	SOP	SOP	SOP	TSSOP	SOP	SOP	DIP
Encapsulate equivalent code	SOP14,.25	SOP14,.25	SOP14,.25	SOP14,.3	SOP14,.25	TSSOP14,.25	SOP14,.25	SOP14,.3	DIP14,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE	IN-LINE
method of packing	RAIL	RAIL	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL	RAIL
Peak Reflow Temperature (Celsius)	240	240	240	260	240	260	240	260	240
power supply	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V
Prop。Delay @ Nom-Sup	300 ns	250 ns	300 ns	300 ns	250 ns	300 ns	300 ns	300 ns	300 ns
propagation delay (tpd)	300 ns	250 ns	300 ns	300 ns	250 ns	300 ns	300 ns	300 ns	300 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Schmitt trigger	NO	NO	NO	NO	NO	NO	NO	NO	NO
Maximum seat height	1.75 mm	1.75 mm	1.75 mm	2.05 mm	1.75 mm	1.2 mm	1.75 mm	2.05 mm	4.69 mm
Maximum supply voltage (Vsup)	18 V	18 V	18 V	18 V	18 V	18 V	18 V	18 V	18 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Nickel/Palladium/Gold (Ni/Pd/Au)	Tin/Lead (Sn/Pb)	Nickel/Palladium/Gold (Ni/Pd/Au)	Tin/Lead (Sn85Pb15)	Nickel/Palladium/Gold (Ni/Pd/Au)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	THROUGH-HOLE
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	0.65 mm	1.27 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	30	30	30	40	30	40	30	40	30
width	3.9 mm	3.9 mm	3.9 mm	5.275 mm	3.9 mm	4.4 mm	3.9 mm	5.275 mm	7.62 mm
Humidity sensitivity level	1	1	1	-	1	1	-	3	-

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