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MC14023BDR2

Description
Logic Gates 3-18V Triple 3-Input
Categorylogic    logic   
File Size159KB,12 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
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MC14023BDR2 Overview

Logic Gates 3-18V Triple 3-Input

MC14023BDR2 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerON Semiconductor
Parts packaging codeSOIC
package instructionSOIC-14
Contacts14
Reach Compliance Codenot_compliant
Is SamacsysN
series4000/14000/40000
JESD-30 codeR-PDSO-G14
JESD-609 codee0
length8.65 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeNAND GATE
Number of functions3
Number of entries3
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP14,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE
method of packingTAPE AND REEL
Peak Reflow Temperature (Celsius)240
power supply5/15 V
Prop。Delay @ Nom-Sup300 ns
propagation delay (tpd)300 ns
Certification statusNot Qualified
Schmitt triggerNO
Maximum seat height1.75 mm
Maximum supply voltage (Vsup)18 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn85Pb15)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width3.9 mm
Base Number Matches1

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Description Logic Gates 3-18V Triple 3-Input Logic Gates 3-18V Quad 2-Input Logic Gates 3-18V Quad 2-Input Logic Gates 3-18V Quad 2-Input Logic Gates 3-18V Triple 3-Input Logic Gates 3-18V Quad 2-Input Logic Gates 3-18V Triple 3-Input Logic Gates 3-18V Triple 3-Input
Is it Rohs certified? incompatible incompatible incompatible conform to incompatible incompatible conform to conform to incompatible
Maker ON Semiconductor ON Semiconductor ON Semiconductor ON Semiconductor ON Semiconductor ON Semiconductor ON Semiconductor ON Semiconductor ON Semiconductor
Parts packaging code SOIC SOIC SOIC SOIC SOIC SOIC TSSOP SOIC DIP
package instruction SOIC-14 SOIC-14 SOP, SOP14,.25 SOP, SOP14,.3 SOP, SOP14,.25 SOP, SOP14,.25 LEAD FREE, TSSOP-14 EIAJ, SO-14 DIP, DIP14,.3
Contacts 14 14 14 14 14 14 14 14 14
Reach Compliance Code not_compliant not_compliant not_compliant unknown not_compliant not_compliant unknown unknown not_compliant
series 4000/14000/40000 4000/14000/40000 4000/14000/40000 4000/14000/40000 4000/14000/40000 4000/14000/40000 4000/14000/40000 4000/14000/40000 4000/14000/40000
JESD-30 code R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 R-PDIP-T14
JESD-609 code e0 e0 e0 e4 e0 e0 e4 e4 e0
length 8.65 mm 8.65 mm 8.65 mm 10.2 mm 8.65 mm 8.65 mm 5 mm 10.2 mm 18.86 mm
Load capacitance (CL) 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type NAND GATE NOR GATE AND GATE AND GATE NAND GATE AND GATE OR GATE AND GATE NAND GATE
Number of functions 3 4 4 4 4 3 4 3 3
Number of entries 3 2 2 2 2 3 2 3 3
Number of terminals 14 14 14 14 14 14 14 14 14
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP SOP SOP SOP SOP SOP TSSOP SOP DIP
Encapsulate equivalent code SOP14,.25 SOP14,.25 SOP14,.25 SOP14,.3 SOP14,.25 SOP14,.25 TSSOP14,.25 SOP14,.3 DIP14,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE IN-LINE
method of packing TAPE AND REEL RAIL TAPE AND REEL TAPE AND REEL TAPE AND REEL RAIL TAPE AND REEL TAPE AND REEL RAIL
Peak Reflow Temperature (Celsius) 240 240 240 260 240 240 260 260 240
power supply 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V
Prop。Delay @ Nom-Sup 300 ns 250 ns 300 ns 300 ns 250 ns 300 ns 300 ns 300 ns 300 ns
propagation delay (tpd) 300 ns 250 ns 300 ns 300 ns 250 ns 300 ns 300 ns 300 ns 300 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Schmitt trigger NO NO NO NO NO NO NO NO NO
Maximum seat height 1.75 mm 1.75 mm 1.75 mm 2.05 mm 1.75 mm 1.75 mm 1.2 mm 2.05 mm 4.69 mm
Maximum supply voltage (Vsup) 18 V 18 V 18 V 18 V 18 V 18 V 18 V 18 V 18 V
Minimum supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES YES YES NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
Terminal surface Tin/Lead (Sn85Pb15) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Lead (Sn/Pb)
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING THROUGH-HOLE
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 0.65 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 30 30 30 40 30 30 40 40 30
width 3.9 mm 3.9 mm 3.9 mm 5.275 mm 3.9 mm 3.9 mm 4.4 mm 5.275 mm 7.62 mm
Humidity sensitivity level - 1 1 - 1 1 1 3 -

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