High Linearity Broadband SP2T
5MHz to 10GHz
Description
The F2976 is a single-pole double-throw (SP2T) reflective RF
switch featuring high linearity and wide bandwidth. This device is
optimized from 5MHz to 1.8GHz to support downstream cable
modem future migration for DOCSIS 3.1 applications, and operates
at up to 10GHz to support a multitude of wireless RF applications.
Superb performance is achieved when used in either 50 or 75
terminating impedance applications.
The F2976 uses a single positive supply voltage of either +3.3V or
+5.0V and is compatible with either 1.8V or 3.3V control logic.
F2976
Datasheet
Features (75 )
Low insertion loss:
0.23dB at 204MHz
0.34dB at 1.8GHz
High Isolation: 40dB at 1.8GHz
P0.1dB compression of +37dBm at 204MHz
Second Harmonic: -100dBc at 204MHz
Third Harmonic: -120dBc at 204MHz
Composite Second Order Distortion > 100dBc
Composite Triple Beat Distortion > 100dBc
Competitive Advantage
The F2976 provides extremely low insertion loss across the entire
bandwidth while providing superb distortion performance.
Optimized for DOCSIS 3.1 applications up to 1.8GHz
Optimized for Wi-Fi applications up to 5.9GHz
Low insertion loss
High isolation
Fast switching
No external matching required
Features (50 )
Low insertion loss:
0.40dB at 2.4GHz
0.55dB at 8GHz
High Isolation:
34dB at 2.4GHz
High Linearity:
IIP2 +125dBm at 2.4GHz
IIP3 +77dBm at 2.4GHz
P0.1dB compression of +40dBm at 2.4GHz
Second Harmonic: -100dBc at 2.4GHz
Third Harmonic: -110dBc at 2.4GHz
Typical Applications
Broadband Cable DOCSIS 3.0 / 3.1
Set top box
CATV filter bank switching
Wi-Fi
Cellular BTS
General purpose
Block Diagram
Figure 1.
Block Diagram
RFC
General Features
Supply voltage: +2.5V to +5.25V
1.8V and 3.3V compatible control logic
2mm x 2mm, 12-pin TQFN package
-40°C to +105°C operating temperature range
RF1
RF2
LS
V
CTL
© 2017 Integrated Device Technology, Inc.
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Rev O April 19, 2017
F2976 Datasheet
Pin Assignments
Figure 2.
Pin Assignments for 2mm x 2mm x 0.5mm 12-pin TQFN, NEG12 – Top View
Vcc
LS
V
CT L
GND
RF2
GND
EP
GND
F2976
RF1
GND
GND
RFC
GND
Pin Descriptions
Table 1.
Pin Descriptions
Number
1
2
3
4
5
6
7
8
9
10
11
12
Name
GND
RF2
GND
GND
RFC
GND
GND
RF1
GND
V
CTL
LS
V
CC
EP
Description
Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias.
RF2 Port. If this pin is not 0V DC, then an external coupling capacitor must be used.
Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias.
Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias.
RF Common Port. If this pin is not 0V DC, then an external coupling capacitor must be used.
Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias.
Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias.
RF1 Port. If this pin is not 0V DC, then an external coupling capacitor must be used.
Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias.
Logic control pin (see Table 9).
Truth Table select pin. Defines V
CTL
logic for RF switching (see Table 9). Pin is internally pulled up to 2.5V
through a 500k resistor.
Power supply. Bypass to GND with capacitors shown in the Typical Application Circuit as close as
possible to pin.
Exposed Pad. Internally connected to GND. Solder this exposed pad to a PCB pad that uses multiple
ground vias to provide heat transfer out of the device into the PCB ground planes. These multiple ground
vias are also required to achieve the specified RF performance.
© 2017 Integrated Device Technology, Inc.
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Rev O April 19, 2017
F2976 Datasheet
Absolute Maximum Ratings
Stresses beyond those listed below may cause permanent damage to the device. Functional operation of the device at these or any other
conditions beyond those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions
for extended periods may affect device reliability.
Table 2.
Absolute Maximum Ratings
Parameter
V
CC
to GND
V
CTL
, LS
RF1, RF2, RFC
5MHz ≤ f
RF
≤ 10MHz
Maximum Input CW
Power, 50 , T
EP
= 25°C,
Vcc = 5.25V (any port,
insertion loss state)
[a,b]
10MHz < f
RF
≤ 25MHz
25MHz < f
RF
≤ 200MHz
200MHz < f
RF
≤ 6000MHz
f
RF
> 6000MHz
5MHz ≤ f
RF
≤ 10MHz
Maximum Peak Power,
50 , T
EP
= 25°C,
Vcc = 5.25V (any port,
insertion loss state)
[a, b, c]
10MHz < f
RF
≤ 25MHz
25MHz < f
RF
≤ 200MHz
200MHz < f
RF
≤ 6000MHz
f
RF
> 6000MHz
Maximum Junction Temperature
Storage Temperature Range
Lead Temperature (soldering, 10s)
Electrostatic Discharge – HBM
(JEDEC/ESDA JS-001-2012)
Electrostatic Discharge – CDM
(JEDEC 22-C101F)
a. In a 50 system, dBmV = dBm [50 ] + 47.
In a 75 system, dBmV = dBm [75 ] + 48.75.
b. T
EP
= Temperature of the exposed paddle.
c. 5 % duty cycle of a 4.6ms period.
Symbol
V
CC
V
LOGIC
V
RF
P
ABSCW1
P
ABSCW2
P
ABSCW3
P
ABSCW4
P
ABSCW5
P
ABSPK1
P
ABSPK2
P
ABSPK3
P
ABSPK4
P
ABSPK5
T
JMAX
T
ST
T
LEAD
V
ESDHBM
V
ESDCDM
Minimum
-0.3
-0.3
-0.3
Maximum
+5.5
Lower of
(V
CC
+ 0.3, 3.9)
+0.3
30
32
33
34
33
35
37
38
39
38
+140
Units
V
V
V
dBm
dBm
°C
°C
°C
V
V
-65
+150
+260
2500
(Class 2)
1000
(Class C3)
© 2017 Integrated Device Technology, Inc.
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F2976 Datasheet
Recommended Operating Conditions
Table 3.
Recommended Operating Conditions
Parameter
Supply Voltage
Operating Temperature Range
RF Frequency Range
Maximum Operating Input Power
Port Impedance (RFC, RF1, RF2)
Symbol
V
CC
T
EP
f
RF
P
MAX
Z
RF
Condition
Exposed Paddle
75
50
Insertion Loss State
Z
S
= Z
L
= 50
75 System
50 System
Minimum
2.5
-40
0.005
0.005
Typical
3.3
Maximum
5.25
+105
1.8
10
See Figure 3
[a]
Units
V
°C
GHz
dBm
75
50
a. In a 50 system, dBmV = dBm [50 ] + 47. In a 75 system, dBmV = dBm [75 ] + 48.75.
Figure 3.
Maximum Operating RF Input Power (Z
S
= Z
L
= 50Ω)
© 2017 Integrated Device Technology, Inc.
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F2976 Datasheet
General Specifications
Table 4.
General Specifications
See F2976 Typical Application Circuit. Specifications apply when operated with V
CC
= +3.3V, T
EP
= +25°C, LS = HIGH, single tone signal
applied at RF1 or RF2 and measured at RFC, unless otherwise noted.
Parameter
Logic Input High Threshold
Logic Input Low Threshold
Logic Current
DC Current (V
CC
)
Switching Rate
Symbol
V
IH
V
IL
I
IH
, I
IL
I
CC
SW
RATE
Condition
V
CTL
, LS pins
V
CTL
, LS pins
V
CTL
, LS pins (each pin)
Minimum
1.17
[b]
-0.3
-10
[a]
80
Typical
Maximum
Lower of
( V
CC
, 3.6 )
0.6
+10
150
25
Units
V
V
A
A
kHz
Peak transient during
switching. Z
S
= Z
L
= 75 .
Maximum Video Feed-Through,
VID
FT
Measured with 20ns rise time,
RFC Port
0V to 3.3V (3.3V to 0V)
control pulse applied to V
CTL.
Switching Time
[c]
SW
TIME
50% V
CTL
to 90% or 10% RF
a. Items in min/max columns in
bold italics
are guaranteed by test.
b. Items in min/max columns that are not bold italics are guaranteed by design characterization.
c. Measured at f
RF
= 1GHz.
5
mVp-p
1.5
3
s
© 2017 Integrated Device Technology, Inc.
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Rev O April 19, 2017
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