MC9S08QG8CFFER datasheet, PDF - EEWORLD Datasheet

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MC9S08QG8CFFER: DescriptionSurface Mount Fuses 1206 SLO-BLO .500A SLIMLINE HALIDE FREE; CategoryThe embedded processor and controller Microcontrollers and processors; File Size3MB，316 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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Surface Mount Fuses 1206 SLO-BLO .500A SLIMLINE HALIDE FREE

MC9S08QG8CFFER Parametric

Parameter Name	Attribute value
Brand Name	Freescale
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	QFN
package instruction	5 X 5 MM, 1 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, QFN-16
Contacts	16
Reach Compliance Code	unknown
ECCN code	3A991.A.2
Has ADC	YES
Address bus width
bit size	8
maximum clock frequency	16 MHz
DAC channel	NO
DMA channel	NO
External data bus width
JESD-30 code	S-XQCC-N16
JESD-609 code	e3
length	5 mm
Humidity sensitivity level	3
Number of I/O lines	14
Number of terminals	16
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	UNSPECIFIED
encapsulated code	VQCCN
Encapsulate equivalent code	LCC16,.2SQ,32
Package shape	SQUARE
Package form	CHIP CARRIER, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260
power supply	1.8/3.6 V
Certification status	Not Qualified
RAM (bytes)	512
rom(word)	8192
ROM programmability	FLASH
Maximum seat height	1 mm
speed	16 MHz
Maximum slew rate	5 mA
Maximum supply voltage	3.6 V
Minimum supply voltage	1.8 V
Nominal supply voltage	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn)
Terminal form	NO LEAD
Terminal pitch	0.8 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	40
width	5 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

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Freescale Semiconductor

Addendum

Document Number: QFN_Addendum

Rev. 0, 07/2014

Addendum for New QFN

Package Migration

This addendum provides the changes to the 98A case outline numbers for products covered in this book.

Case outlines were changed because of the migration from gold wire to copper wire in some packages. See

the table below for the old (gold wire) package versus the new (copper wire) package.

To view the new drawing, go to Freescale.com and search on the new 98A package number for your

device.

For more information about QFN package use, see EB806:

Electrical Connection Recommendations for

the Exposed Pad on QFN and DFN Packages.

MC9S08QG8CFFER Related Products

	MC9S08QG8CFFER	MC9S08QG4CFFER	MC9S08QG8CPBE	MC9S08QG8MDNE	MC9S08QG4CFKE	MC9S08QG4CPAE	MC9S08QG4CDNER	MC9S08QG4CPBE	MC9S08QG4CFFE
Description	Surface Mount Fuses 1206 SLO-BLO .500A SLIMLINE HALIDE FREE	Headers u0026 Wire Housings 1.5 WTB HDR VERT SMT 4CRT	8-bit Microcontrollers - MCU 20mhz 8bit CPU	Development Boards u0026 Kits - S08 / S12 MC9S08QH8 DEMO BOARD	Development Boards u0026 Kits - S08 / S12 MC9S08QH8 DEMO BOARD	Networking Modules DSTni-EX DIN RailMnt 10Base-T/100Base-TX	8-bit Microcontrollers - MCU S08QG 8-bit MCU, S08 core, 4KB Flash, 20MHz, SOIC 8	EEPROM 64kx8 - 1.8V	Battery Management 250-mA 75nA 6-DSBGA 0 to 125
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Maker	NXP	NXP	NXP	NXP	NXP	NXP	NXP	NXP	NXP
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	compliant	unknown	unknown
ECCN code	3A991.A.2	3A991.A.2	3A991.A.2	EAR99	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2
bit size	8	8	8	8	8	8	8	8	8
JESD-30 code	S-XQCC-N16	S-XQCC-N16	R-PDIP-T16	R-PDSO-G8	S-XQCC-N24	R-PDIP-T8	R-PDSO-G8	R-PDIP-T16	S-XQCC-N16
Number of terminals	16	16	16	8	24	8	8	16	16
Maximum operating temperature	85 °C	85 °C	85 °C	125 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	UNSPECIFIED	UNSPECIFIED	PLASTIC/EPOXY	PLASTIC/EPOXY	UNSPECIFIED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	UNSPECIFIED
encapsulated code	VQCCN	HVQCCN	DIP	SOP	HVQCCN	DIP	SOP	DIP	HVQCCN
Package shape	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE
Package form	CHIP CARRIER, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	IN-LINE	SMALL OUTLINE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	IN-LINE	SMALL OUTLINE	IN-LINE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260	260	NOT SPECIFIED	260	260	NOT SPECIFIED	260	NOT SPECIFIED	260
ROM programmability	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
speed	16 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	16 MHz	20 MHz
surface mount	YES	YES	NO	YES	YES	NO	YES	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	AUTOMOTIVE	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	NO LEAD	NO LEAD	THROUGH-HOLE	GULL WING	NO LEAD	THROUGH-HOLE	GULL WING	THROUGH-HOLE	NO LEAD
Terminal pitch	0.8 mm	0.8 mm	2.54 mm	1.27 mm	0.5 mm	2.54 mm	1.27 mm	2.54 mm	0.8 mm
Terminal location	QUAD	QUAD	DUAL	DUAL	QUAD	DUAL	DUAL	DUAL	QUAD
Maximum time at peak reflow temperature	40	40	NOT SPECIFIED	40	40	NOT SPECIFIED	40	NOT SPECIFIED	40
Parts packaging code	QFN	QFN	DIP	SOIC	QFN	DIP	-	DIP	QFN
package instruction	5 X 5 MM, 1 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, QFN-16	5 X 5 MM, 1 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, QFN-16	ROHS COMPLIANT, PLASTIC, DIP-16	SOP, SOP8,.25	4 X 4 MM, 1 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, MO-220VGGD-8, QFN-24	ROHS COMPLIANT, PLASTIC, DIP-8	ROHS COMPLIANT, MS-012AA, SOIC-8	-	5 X 5 MM, 1 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, QFN-16
Contacts	16	16	16	8	24	8	-	16	16
Has ADC	YES	YES	YES	YES	YES	YES	YES	-	YES
maximum clock frequency	16 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	-	20 MHz
DAC channel	NO	NO	NO	NO	NO	NO	NO	-	NO
DMA channel	NO	NO	NO	NO	NO	NO	NO	-	NO
JESD-609 code	e3	-	e3	e3	-	e3	e3	e3	-
length	5 mm	5 mm	19.175 mm	4.9 mm	4 mm	9.779 mm	4.9 mm	-	5 mm
Humidity sensitivity level	3	3	-	3	3	-	3	-	3
Number of I/O lines	14	14	14	6	14	6	6	-	14
PWM channel	YES	YES	YES	YES	YES	YES	YES	-	YES
Encapsulate equivalent code	LCC16,.2SQ,32	LCC16,.2SQ,32	DIP16,.3	SOP8,.25	LCC24,.16SQ,20	DIP8,.3	-	DIP16,.3	LCC16,.2SQ,32
power supply	1.8/3.6 V	1.8/3.6 V	1.8/3.6 V	1.8/3.6 V	1.8/3.6 V	1.8/3.6 V	-	1.8/3.6 V	1.8/3.6 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified
RAM (bytes)	512	256	512	512	256	256	-	256	256
rom(word)	8192	4096	8192	8192	4096	4096	-	4096	4096
Maximum seat height	1 mm	1 mm	4.44 mm	1.75 mm	1 mm	5.334 mm	1.75 mm	-	1 mm
Maximum slew rate	5 mA	5 mA	-	5 mA	5 mA	-	-	5 mA	-
Maximum supply voltage	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	-	3.6 V
Minimum supply voltage	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	-	1.8 V
Nominal supply voltage	3 V	3 V	3 V	3 V	3 V	3 V	3 V	-	3 V
Terminal surface	Matte Tin (Sn)	-	Matte Tin (Sn)	Matte Tin (Sn)	-	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	-
width	5 mm	5 mm	7.62 mm	3.9 mm	4 mm	7.62 mm	3.9 mm	-	5 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	-	MICROCONTROLLER

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