Battery Management 250-mA 75nA 6-DSBGA 0 to 125
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | NXP |
| Parts packaging code | QFN |
| package instruction | 5 X 5 MM, 1 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, QFN-16 |
| Contacts | 16 |
| Reach Compliance Code | unknown |
| ECCN code | 3A991.A.2 |
| Has ADC | YES |
| Address bus width | |
| bit size | 8 |
| maximum clock frequency | 20 MHz |
| DAC channel | NO |
| DMA channel | NO |
| External data bus width | |
| JESD-30 code | S-XQCC-N16 |
| length | 5 mm |
| Humidity sensitivity level | 3 |
| Number of I/O lines | 14 |
| Number of terminals | 16 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| PWM channel | YES |
| Package body material | UNSPECIFIED |
| encapsulated code | HVQCCN |
| Encapsulate equivalent code | LCC16,.2SQ,32 |
| Package shape | SQUARE |
| Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 1.8/3.6 V |
| Certification status | Not Qualified |
| RAM (bytes) | 256 |
| rom(word) | 4096 |
| ROM programmability | FLASH |
| Maximum seat height | 1 mm |
| speed | 20 MHz |
| Maximum supply voltage | 3.6 V |
| Minimum supply voltage | 1.8 V |
| Nominal supply voltage | 3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal form | NO LEAD |
| Terminal pitch | 0.8 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | 40 |
| width | 5 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
| MC9S08QG4CFFE | MC9S08QG8CFFER | MC9S08QG4CFFER | MC9S08QG8CPBE | MC9S08QG8MDNE | MC9S08QG4CFKE | MC9S08QG4CPAE | MC9S08QG4CDNER | MC9S08QG4CPBE | |
|---|---|---|---|---|---|---|---|---|---|
| Description | Battery Management 250-mA 75nA 6-DSBGA 0 to 125 | Surface Mount Fuses 1206 SLO-BLO .500A SLIMLINE HALIDE FREE | Headers u0026 Wire Housings 1.5 WTB HDR VERT SMT 4CRT | 8-bit Microcontrollers - MCU 20mhz 8bit CPU | Development Boards u0026 Kits - S08 / S12 MC9S08QH8 DEMO BOARD | Development Boards u0026 Kits - S08 / S12 MC9S08QH8 DEMO BOARD | Networking Modules DSTni-EX DIN RailMnt 10Base-T/100Base-TX | 8-bit Microcontrollers - MCU S08QG 8-bit MCU, S08 core, 4KB Flash, 20MHz, SOIC 8 | EEPROM 64kx8 - 1.8V |
| Is it lead-free? | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free |
| Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to | conform to | conform to | conform to |
| Maker | NXP | NXP | NXP | NXP | NXP | NXP | NXP | NXP | NXP |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | compliant | unknown |
| ECCN code | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | EAR99 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 |
| bit size | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| JESD-30 code | S-XQCC-N16 | S-XQCC-N16 | S-XQCC-N16 | R-PDIP-T16 | R-PDSO-G8 | S-XQCC-N24 | R-PDIP-T8 | R-PDSO-G8 | R-PDIP-T16 |
| Number of terminals | 16 | 16 | 16 | 16 | 8 | 24 | 8 | 8 | 16 |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 125 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | HVQCCN | VQCCN | HVQCCN | DIP | SOP | HVQCCN | DIP | SOP | DIP |
| Package shape | SQUARE | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | IN-LINE | SMALL OUTLINE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | IN-LINE | SMALL OUTLINE | IN-LINE |
| Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | NOT SPECIFIED | 260 | 260 | NOT SPECIFIED | 260 | NOT SPECIFIED |
| ROM programmability | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
| speed | 20 MHz | 16 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 16 MHz |
| surface mount | YES | YES | YES | NO | YES | YES | NO | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal form | NO LEAD | NO LEAD | NO LEAD | THROUGH-HOLE | GULL WING | NO LEAD | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
| Terminal pitch | 0.8 mm | 0.8 mm | 0.8 mm | 2.54 mm | 1.27 mm | 0.5 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| Terminal location | QUAD | QUAD | QUAD | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | 40 | 40 | 40 | NOT SPECIFIED | 40 | 40 | NOT SPECIFIED | 40 | NOT SPECIFIED |
| Parts packaging code | QFN | QFN | QFN | DIP | SOIC | QFN | DIP | - | DIP |
| package instruction | 5 X 5 MM, 1 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, QFN-16 | 5 X 5 MM, 1 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, QFN-16 | 5 X 5 MM, 1 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, QFN-16 | ROHS COMPLIANT, PLASTIC, DIP-16 | SOP, SOP8,.25 | 4 X 4 MM, 1 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, MO-220VGGD-8, QFN-24 | ROHS COMPLIANT, PLASTIC, DIP-8 | ROHS COMPLIANT, MS-012AA, SOIC-8 | - |
| Contacts | 16 | 16 | 16 | 16 | 8 | 24 | 8 | - | 16 |
| Has ADC | YES | YES | YES | YES | YES | YES | YES | YES | - |
| maximum clock frequency | 20 MHz | 16 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz | - |
| DAC channel | NO | NO | NO | NO | NO | NO | NO | NO | - |
| DMA channel | NO | NO | NO | NO | NO | NO | NO | NO | - |
| length | 5 mm | 5 mm | 5 mm | 19.175 mm | 4.9 mm | 4 mm | 9.779 mm | 4.9 mm | - |
| Humidity sensitivity level | 3 | 3 | 3 | - | 3 | 3 | - | 3 | - |
| Number of I/O lines | 14 | 14 | 14 | 14 | 6 | 14 | 6 | 6 | - |
| PWM channel | YES | YES | YES | YES | YES | YES | YES | YES | - |
| Encapsulate equivalent code | LCC16,.2SQ,32 | LCC16,.2SQ,32 | LCC16,.2SQ,32 | DIP16,.3 | SOP8,.25 | LCC24,.16SQ,20 | DIP8,.3 | - | DIP16,.3 |
| power supply | 1.8/3.6 V | 1.8/3.6 V | 1.8/3.6 V | 1.8/3.6 V | 1.8/3.6 V | 1.8/3.6 V | 1.8/3.6 V | - | 1.8/3.6 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| RAM (bytes) | 256 | 512 | 256 | 512 | 512 | 256 | 256 | - | 256 |
| rom(word) | 4096 | 8192 | 4096 | 8192 | 8192 | 4096 | 4096 | - | 4096 |
| Maximum seat height | 1 mm | 1 mm | 1 mm | 4.44 mm | 1.75 mm | 1 mm | 5.334 mm | 1.75 mm | - |
| Maximum supply voltage | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - |
| Minimum supply voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | - |
| Nominal supply voltage | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | - |
| width | 5 mm | 5 mm | 5 mm | 7.62 mm | 3.9 mm | 4 mm | 7.62 mm | 3.9 mm | - |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | - |
| JESD-609 code | - | e3 | - | e3 | e3 | - | e3 | e3 | e3 |
| Maximum slew rate | - | 5 mA | 5 mA | - | 5 mA | 5 mA | - | - | 5 mA |
| Terminal surface | - | Matte Tin (Sn) | - | Matte Tin (Sn) | Matte Tin (Sn) | - | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
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