MC9S08QG4CPBE datasheet, PDF - EEWORLD Datasheet

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MC9S08QG4CPBE: DescriptionEEPROM 64kx8 - 1.8V; CategoryThe embedded processor and controller Microcontrollers and processors; File Size3MB，316 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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MC9S08QG4CPBE Overview

EEPROM 64kx8 - 1.8V

MC9S08QG4CPBE Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	DIP
Contacts	16
Reach Compliance Code	unknown
ECCN code	3A991.A.2
Samacsys Description	HCS08 Microcontrollers
bit size	8
JESD-30 code	R-PDIP-T16
JESD-609 code	e3
Number of terminals	16
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	1.8/3.6 V
Certification status	Not Qualified
RAM (bytes)	256
rom(word)	4096
ROM programmability	FLASH
speed	16 MHz
Maximum slew rate	5 mA
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED

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Freescale Semiconductor

Addendum

Document Number: QFN_Addendum

Rev. 0, 07/2014

Addendum for New QFN

Package Migration

This addendum provides the changes to the 98A case outline numbers for products covered in this book.

Case outlines were changed because of the migration from gold wire to copper wire in some packages. See

the table below for the old (gold wire) package versus the new (copper wire) package.

To view the new drawing, go to Freescale.com and search on the new 98A package number for your

device.

For more information about QFN package use, see EB806:

Electrical Connection Recommendations for

the Exposed Pad on QFN and DFN Packages.

MC9S08QG4CPBE Related Products

	MC9S08QG4CPBE	MC9S08QG8CFFER	MC9S08QG4CFFER	MC9S08QG8CPBE	MC9S08QG8MDNE	MC9S08QG4CFKE	MC9S08QG4CPAE	MC9S08QG4CDNER	MC9S08QG4CFFE
Description	EEPROM 64kx8 - 1.8V	Surface Mount Fuses 1206 SLO-BLO .500A SLIMLINE HALIDE FREE	Headers u0026 Wire Housings 1.5 WTB HDR VERT SMT 4CRT	8-bit Microcontrollers - MCU 20mhz 8bit CPU	Development Boards u0026 Kits - S08 / S12 MC9S08QH8 DEMO BOARD	Development Boards u0026 Kits - S08 / S12 MC9S08QH8 DEMO BOARD	Networking Modules DSTni-EX DIN RailMnt 10Base-T/100Base-TX	8-bit Microcontrollers - MCU S08QG 8-bit MCU, S08 core, 4KB Flash, 20MHz, SOIC 8	Battery Management 250-mA 75nA 6-DSBGA 0 to 125
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Maker	NXP	NXP	NXP	NXP	NXP	NXP	NXP	NXP	NXP
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	compliant	unknown
ECCN code	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2	EAR99	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2
bit size	8	8	8	8	8	8	8	8	8
JESD-30 code	R-PDIP-T16	S-XQCC-N16	S-XQCC-N16	R-PDIP-T16	R-PDSO-G8	S-XQCC-N24	R-PDIP-T8	R-PDSO-G8	S-XQCC-N16
Number of terminals	16	16	16	16	8	24	8	8	16
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	125 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	UNSPECIFIED	UNSPECIFIED	PLASTIC/EPOXY	PLASTIC/EPOXY	UNSPECIFIED	PLASTIC/EPOXY	PLASTIC/EPOXY	UNSPECIFIED
encapsulated code	DIP	VQCCN	HVQCCN	DIP	SOP	HVQCCN	DIP	SOP	HVQCCN
Package shape	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE
Package form	IN-LINE	CHIP CARRIER, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	IN-LINE	SMALL OUTLINE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	IN-LINE	SMALL OUTLINE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	260	260	NOT SPECIFIED	260	260	NOT SPECIFIED	260	260
ROM programmability	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
speed	16 MHz	16 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz
surface mount	NO	YES	YES	NO	YES	YES	NO	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	AUTOMOTIVE	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	THROUGH-HOLE	NO LEAD	NO LEAD	THROUGH-HOLE	GULL WING	NO LEAD	THROUGH-HOLE	GULL WING	NO LEAD
Terminal pitch	2.54 mm	0.8 mm	0.8 mm	2.54 mm	1.27 mm	0.5 mm	2.54 mm	1.27 mm	0.8 mm
Terminal location	DUAL	QUAD	QUAD	DUAL	DUAL	QUAD	DUAL	DUAL	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	40	40	NOT SPECIFIED	40	40	NOT SPECIFIED	40	40
Parts packaging code	DIP	QFN	QFN	DIP	SOIC	QFN	DIP	-	QFN
Contacts	16	16	16	16	8	24	8	-	16
JESD-609 code	e3	e3	-	e3	e3	-	e3	e3	-
Encapsulate equivalent code	DIP16,.3	LCC16,.2SQ,32	LCC16,.2SQ,32	DIP16,.3	SOP8,.25	LCC24,.16SQ,20	DIP8,.3	-	LCC16,.2SQ,32
power supply	1.8/3.6 V	1.8/3.6 V	1.8/3.6 V	1.8/3.6 V	1.8/3.6 V	1.8/3.6 V	1.8/3.6 V	-	1.8/3.6 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified
RAM (bytes)	256	512	256	512	512	256	256	-	256
rom(word)	4096	8192	4096	8192	8192	4096	4096	-	4096
Maximum slew rate	5 mA	5 mA	5 mA	-	5 mA	5 mA	-	-	-
Terminal surface	Matte Tin (Sn)	Matte Tin (Sn)	-	Matte Tin (Sn)	Matte Tin (Sn)	-	Matte Tin (Sn)	Matte Tin (Sn)	-
package instruction	-	5 X 5 MM, 1 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, QFN-16	5 X 5 MM, 1 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, QFN-16	ROHS COMPLIANT, PLASTIC, DIP-16	SOP, SOP8,.25	4 X 4 MM, 1 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, MO-220VGGD-8, QFN-24	ROHS COMPLIANT, PLASTIC, DIP-8	ROHS COMPLIANT, MS-012AA, SOIC-8	5 X 5 MM, 1 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, QFN-16
Has ADC	-	YES	YES	YES	YES	YES	YES	YES	YES
maximum clock frequency	-	16 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz
DAC channel	-	NO	NO	NO	NO	NO	NO	NO	NO
DMA channel	-	NO	NO	NO	NO	NO	NO	NO	NO
length	-	5 mm	5 mm	19.175 mm	4.9 mm	4 mm	9.779 mm	4.9 mm	5 mm
Humidity sensitivity level	-	3	3	-	3	3	-	3	3
Number of I/O lines	-	14	14	14	6	14	6	6	14
PWM channel	-	YES	YES	YES	YES	YES	YES	YES	YES
Maximum seat height	-	1 mm	1 mm	4.44 mm	1.75 mm	1 mm	5.334 mm	1.75 mm	1 mm
Maximum supply voltage	-	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage	-	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
Nominal supply voltage	-	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
width	-	5 mm	5 mm	7.62 mm	3.9 mm	4 mm	7.62 mm	3.9 mm	5 mm
uPs/uCs/peripheral integrated circuit type	-	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER

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