|
MS62256H-20RC |
MS62256H-15NC |
MS62256H-35RC |
MS62256H-35NC |
MS62256H-25NC |
MS62256H |
MS62256H-20NC |
Description |
32k x 8 high speed cmos static ram |
32k x 8 high speed cmos static ram |
32k x 8 high speed cmos static ram |
32k x 8 high speed cmos static ram |
32k x 8 high speed cmos static ram |
32k x 8 high speed cmos static ram |
32k x 8 high speed cmos static ram |
Is it lead-free? |
Contains lead |
Contains lead |
Contains lead |
Contains lead |
Contains lead |
- |
Contains lead |
Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
- |
incompatible |
Maker |
Mosel Vitelic Corporation ( MVC ) |
Mosel Vitelic Corporation ( MVC ) |
Mosel Vitelic Corporation ( MVC ) |
Mosel Vitelic Corporation ( MVC ) |
Mosel Vitelic Corporation ( MVC ) |
- |
Mosel Vitelic Corporation ( MVC ) |
Parts packaging code |
SOJ |
DIP |
SOJ |
DIP |
DIP |
- |
DIP |
package instruction |
SOJ, SOJ28,.34 |
DIP, DIP28,.3 |
SOJ, SOJ28,.34 |
DIP, DIP28,.3 |
DIP, DIP28,.3 |
- |
DIP, DIP28,.3 |
Contacts |
28 |
28 |
28 |
28 |
28 |
- |
28 |
Reach Compliance Code |
unknown |
unknown |
unknown |
unknown |
unknown |
- |
unknown |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
- |
EAR99 |
Maximum access time |
20 ns |
15 ns |
35 ns |
35 ns |
25 ns |
- |
20 ns |
I/O type |
COMMON |
COMMON |
COMMON |
COMMON |
COMMON |
- |
COMMON |
JESD-30 code |
R-PDSO-J28 |
R-PDIP-T28 |
R-PDSO-J28 |
R-PDIP-T28 |
R-PDIP-T28 |
- |
R-PDIP-T28 |
JESD-609 code |
e0 |
e0 |
e0 |
e0 |
e0 |
- |
e0 |
length |
18.034 mm |
35.2552 mm |
18.034 mm |
35.2552 mm |
35.2552 mm |
- |
35.2552 mm |
memory density |
262144 bit |
262144 bit |
262144 bit |
262144 bit |
262144 bit |
- |
262144 bit |
Memory IC Type |
STANDARD SRAM |
STANDARD SRAM |
STANDARD SRAM |
STANDARD SRAM |
STANDARD SRAM |
- |
STANDARD SRAM |
memory width |
8 |
8 |
8 |
8 |
8 |
- |
8 |
Number of functions |
1 |
1 |
1 |
1 |
1 |
- |
1 |
Number of ports |
1 |
1 |
1 |
1 |
1 |
- |
1 |
Number of terminals |
28 |
28 |
28 |
28 |
28 |
- |
28 |
word count |
32768 words |
32768 words |
32768 words |
32768 words |
32768 words |
- |
32768 words |
character code |
32000 |
32000 |
32000 |
32000 |
32000 |
- |
32000 |
Operating mode |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
- |
ASYNCHRONOUS |
Maximum operating temperature |
70 °C |
70 °C |
70 °C |
70 °C |
70 °C |
- |
70 °C |
organize |
32KX8 |
32KX8 |
32KX8 |
32KX8 |
32KX8 |
- |
32KX8 |
Output characteristics |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
- |
3-STATE |
Exportable |
YES |
YES |
YES |
YES |
YES |
- |
YES |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
encapsulated code |
SOJ |
DIP |
SOJ |
DIP |
DIP |
- |
DIP |
Encapsulate equivalent code |
SOJ28,.34 |
DIP28,.3 |
SOJ28,.34 |
DIP28,.3 |
DIP28,.3 |
- |
DIP28,.3 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
- |
RECTANGULAR |
Package form |
SMALL OUTLINE |
IN-LINE |
SMALL OUTLINE |
IN-LINE |
IN-LINE |
- |
IN-LINE |
Parallel/Serial |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
- |
PARALLEL |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
- |
NOT SPECIFIED |
power supply |
5 V |
5 V |
5 V |
5 V |
5 V |
- |
5 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
- |
Not Qualified |
Maximum seat height |
3.7 mm |
4.445 mm |
3.7 mm |
4.445 mm |
4.445 mm |
- |
4.445 mm |
Maximum standby current |
0.002 A |
0.002 A |
0.002 A |
0.002 A |
0.002 A |
- |
0.002 A |
Minimum standby current |
2 V |
2 V |
2 V |
2 V |
2 V |
- |
2 V |
Maximum slew rate |
0.2 mA |
0.2 mA |
0.2 mA |
0.2 mA |
0.2 mA |
- |
0.2 mA |
Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
- |
5.5 V |
Minimum supply voltage (Vsup) |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
- |
4.5 V |
Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
5 V |
5 V |
- |
5 V |
surface mount |
YES |
NO |
YES |
NO |
NO |
- |
NO |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
- |
CMOS |
Temperature level |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
- |
COMMERCIAL |
Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
- |
Tin/Lead (Sn/Pb) |
Terminal form |
J BEND |
THROUGH-HOLE |
J BEND |
THROUGH-HOLE |
THROUGH-HOLE |
- |
THROUGH-HOLE |
Terminal pitch |
1.27 mm |
2.54 mm |
1.27 mm |
2.54 mm |
2.54 mm |
- |
2.54 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
- |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
- |
NOT SPECIFIED |
width |
7.7 mm |
7.62 mm |
7.7 mm |
7.62 mm |
7.62 mm |
- |
7.62 mm |