Standard SRAM, 4KX4, 35ns, CMOS, PDIP22
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Reach Compliance Code | _compli |
Maximum access time | 35 ns |
I/O type | COMMON |
JESD-30 code | R-PDIP-T22 |
JESD-609 code | e0 |
memory density | 16384 bi |
Memory IC Type | STANDARD SRAM |
memory width | 4 |
Number of terminals | 22 |
word count | 4096 words |
character code | 4000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 4KX4 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP22,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
power supply | 5 V |
Certification status | Not Qualified |
Maximum standby current | 0.003 A |
Minimum standby current | 4.5 V |
Maximum slew rate | 0.1 mA |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Base Number Matches | 1 |
MT5C1605-35 | MT5C1605C-12L | MT5C1605C-12 | MT5C1605C-35 | MT5C1605C-35L | MT5C1605C-20 | MT5C1605C-25 | MT5C1605C-20L | MT5C1605C-25L | MT5C1605DJ-30L | |
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Description | Standard SRAM, 4KX4, 35ns, CMOS, PDIP22 | Standard SRAM, 4KX4, 12ns, CMOS, CDIP22 | Standard SRAM, 4KX4, 12ns, CMOS, CDIP22 | Standard SRAM, 4KX4, 35ns, CMOS, CDIP22 | Standard SRAM, 4KX4, 35ns, CMOS, CDIP22 | Standard SRAM, 4KX4, 20ns, CMOS, CDIP22 | Standard SRAM, 4KX4, 25ns, CMOS, CDIP22 | Standard SRAM, 4KX4, 20ns, CMOS, CDIP22 | Standard SRAM, 4KX4, 25ns, CMOS, CDIP22 | Standard SRAM, 4KX4, 30ns, CMOS, PDSO24 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Reach Compliance Code | _compli | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | unknown | unknown | not_compliant |
Maximum access time | 35 ns | 12 ns | 12 ns | 35 ns | 35 ns | 20 ns | 25 ns | 20 ns | 25 ns | 30 ns |
I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 code | R-PDIP-T22 | R-XDIP-T22 | R-XDIP-T22 | R-XDIP-T22 | R-XDIP-T22 | R-XDIP-T22 | R-XDIP-T22 | R-XDIP-T22 | R-XDIP-T22 | R-PDSO-J24 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
memory density | 16384 bi | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit |
Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
memory width | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
Number of terminals | 22 | 22 | 22 | 22 | 22 | 22 | 22 | 22 | 22 | 24 |
word count | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words |
character code | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 4KX4 | 4KX4 | 4KX4 | 4KX4 | 4KX4 | 4KX4 | 4KX4 | 4KX4 | 4KX4 | 4KX4 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY |
encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | SOJ |
Encapsulate equivalent code | DIP22,.3 | DIP22,.3 | DIP22,.3 | DIP22,.3 | DIP22,.3 | DIP22,.3 | DIP22,.3 | DIP22,.3 | DIP22,.3 | SOJ24,.34 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum standby current | 0.003 A | 0.00025 A | 0.003 A | 0.003 A | 0.00025 A | 0.003 A | 0.003 A | 0.00025 A | 0.00025 A | 0.00025 A |
Minimum standby current | 4.5 V | 2 V | 4.5 V | 4.5 V | 2 V | 4.5 V | 4.5 V | 2 V | 2 V | 2 V |
Maximum slew rate | 0.1 mA | 0.14 mA | 0.14 mA | 0.1 mA | 0.1 mA | 0.11 mA | 0.1 mA | 0.11 mA | 0.1 mA | 0.1 mA |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | NO | NO | NO | NO | NO | NO | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |