inverters 3.3V triple inverter
| Parameter Name | Attribute value |
| Brand Name | NXP Semiconductor |
| Is it Rohs certified? | conform to |
| Parts packaging code | TSSOP |
| package instruction | 3 MM, PLASTIC, SOT505-2, TSSOP-8 |
| Contacts | 8 |
| Manufacturer packaging code | SOT505-2 |
| Reach Compliance Code | compliant |
| series | LVC/LCX/Z |
| JESD-30 code | S-PDSO-G8 |
| JESD-609 code | e4 |
| length | 3 mm |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | INVERTER |
| MaximumI(ol) | 0.024 A |
| Humidity sensitivity level | 1 |
| Number of functions | 3 |
| Number of entries | 1 |
| Number of terminals | 8 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSSOP |
| Encapsulate equivalent code | TSSOP8,.16 |
| Package shape | SQUARE |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| method of packing | TAPE AND REEL |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 3.3 V |
| Prop。Delay @ Nom-Sup | 5.5 ns |
| propagation delay (tpd) | 9.5 ns |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| Maximum seat height | 1.1 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 1.65 V |
| Nominal supply voltage (Vsup) | 1.8 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | AUTOMOTIVE |
| Terminal surface | NICKEL PALLADIUM GOLD |
| Terminal form | GULL WING |
| Terminal pitch | 0.65 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 30 |
| width | 3 mm |
| Base Number Matches | 1 |
| 74LVC3G04DP,125 | 74LVC3G04DC,125 | 74LVC3G04GN,115 | 74LVC3G04GD,125 | 74LVC3G04GM,125 | 74LVC3G04GS,115 | 74LVC3G04GF,115 | |
|---|---|---|---|---|---|---|---|
| Description | inverters 3.3V triple inverter | inverters 3.3V triple inverter | inverters triple inverter | inverters inverter 3-element cmos 8-pin | inverters 3.3V triple inverter | inverters 8circ 9.5 ns 6.5 V | inverters triple inverter |
| Brand Name | NXP Semiconductor | NXP Semiconductor | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc |
| Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to | conform to |
| Parts packaging code | TSSOP | SSOP | SON | SON | QFN | SON | SON |
| package instruction | 3 MM, PLASTIC, SOT505-2, TSSOP-8 | VSSOP, TSSOP8,.12,20 | 1.20 X 1 MM, 0.35 MM HEIGHT, SOT-1116, SON-8 | 3 X 2 MM, 0.50 MM HEIGHT, PLASTIC, SOT996-2, XSON-8 | VBCC, LCC8,.06SQ,20 | 1.35 X 1 MM, 0.35 MM HEIGHT, 0.35 MM PITCH, SOT-1203, SON-8 | 1.35 X 1 MM, 0.50 MM HEIGHT, MO-252, SOT-1089, SON-8 |
| Contacts | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Manufacturer packaging code | SOT505-2 | SOT765-1 | SOT1116 | SOT996-2 | SOT902-2 | SOT1203 | SOT1089 |
| Reach Compliance Code | compliant | compliant | compli | compli | compli | compli | compli |
| series | LVC/LCX/Z | LVC/LCX/Z | - | LVC/LCX/Z | LVC/LCX/Z | - | - |
| JESD-30 code | S-PDSO-G8 | R-PDSO-G8 | - | R-PDSO-N8 | S-PBCC-B8 | - | - |
| JESD-609 code | e4 | e4 | - | e4 | e4 | - | - |
| length | 3 mm | 2.3 mm | - | 3 mm | 1.6 mm | - | - |
| Load capacitance (CL) | 50 pF | 50 pF | - | 50 pF | 50 pF | - | - |
| Logic integrated circuit type | INVERTER | INVERTER | - | INVERTER | INVERTER | - | - |
| MaximumI(ol) | 0.024 A | 0.024 A | - | 0.024 A | 0.024 A | - | - |
| Humidity sensitivity level | 1 | 1 | - | 1 | 1 | - | - |
| Number of functions | 3 | 3 | - | 3 | 3 | - | - |
| Number of entries | 1 | 1 | - | 1 | 1 | - | - |
| Number of terminals | 8 | 8 | - | 8 | 8 | - | - |
| Maximum operating temperature | 125 °C | 125 °C | - | 125 °C | 125 °C | - | - |
| Minimum operating temperature | -40 °C | -40 °C | - | -40 °C | -40 °C | - | - |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - |
| encapsulated code | TSSOP | VSSOP | - | VSON | VBCC | - | - |
| Encapsulate equivalent code | TSSOP8,.16 | TSSOP8,.12,20 | - | SOLCC8,.11,20 | LCC8,.06SQ,20 | - | - |
| Package shape | SQUARE | RECTANGULAR | - | RECTANGULAR | SQUARE | - | - |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, VERY THIN PROFILE | CHIP CARRIER, VERY THIN PROFILE | - | - |
| method of packing | TAPE AND REEL | TAPE AND REEL | - | TAPE AND REEL | TAPE AND REEL | - | - |
| Peak Reflow Temperature (Celsius) | 260 | 260 | - | 260 | 260 | - | - |
| power supply | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V | - | - |
| propagation delay (tpd) | 9.5 ns | 9.5 ns | - | 9.5 ns | 9.5 ns | - | - |
| Certification status | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | - | - |
| Schmitt trigger | NO | NO | - | NO | NO | - | - |
| Maximum seat height | 1.1 mm | 1 mm | - | 0.5 mm | 0.5 mm | - | - |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | - | - |
| Minimum supply voltage (Vsup) | 1.65 V | 1.65 V | - | 1.65 V | 1.65 V | - | - |
| Nominal supply voltage (Vsup) | 1.8 V | 1.8 V | - | 1.8 V | 1.8 V | - | - |
| surface mount | YES | YES | - | YES | YES | - | - |
| technology | CMOS | CMOS | - | CMOS | CMOS | - | - |
| Temperature level | AUTOMOTIVE | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE | - | - |
| Terminal surface | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | - | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | - | - |
| Terminal form | GULL WING | GULL WING | - | NO LEAD | BUTT | - | - |
| Terminal pitch | 0.65 mm | 0.5 mm | - | 0.5 mm | 0.5 mm | - | - |
| Terminal location | DUAL | DUAL | - | DUAL | BOTTOM | - | - |
| Maximum time at peak reflow temperature | 30 | 30 | - | 30 | 30 | - | - |
| width | 3 mm | 2 mm | - | 2 mm | 1.6 mm | - | - |
| Maker | - | NXP | NXP | NXP | - | NXP | NXP |
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