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74LVC3G04GF,115

Description
inverters triple inverter
Categorylogic    logic   
File Size276KB,21 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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74LVC3G04GF,115 Overview

inverters triple inverter

74LVC3G04GF,115 Parametric

Parameter NameAttribute value
Brand NameNXP Semiconduc
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeSON
package instruction1.35 X 1 MM, 0.50 MM HEIGHT, MO-252, SOT-1089, SON-8
Contacts8
Manufacturer packaging codeSOT1089
Reach Compliance Codecompli

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Description inverters triple inverter inverters 3.3V triple inverter inverters triple inverter inverters inverter 3-element cmos 8-pin inverters 3.3V triple inverter inverters 8circ 9.5 ns 6.5 V inverters 3.3V triple inverter
Brand Name NXP Semiconduc NXP Semiconductor NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconductor
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to
Parts packaging code SON SSOP SON SON QFN SON TSSOP
package instruction 1.35 X 1 MM, 0.50 MM HEIGHT, MO-252, SOT-1089, SON-8 VSSOP, TSSOP8,.12,20 1.20 X 1 MM, 0.35 MM HEIGHT, SOT-1116, SON-8 3 X 2 MM, 0.50 MM HEIGHT, PLASTIC, SOT996-2, XSON-8 VBCC, LCC8,.06SQ,20 1.35 X 1 MM, 0.35 MM HEIGHT, 0.35 MM PITCH, SOT-1203, SON-8 3 MM, PLASTIC, SOT505-2, TSSOP-8
Contacts 8 8 8 8 8 8 8
Manufacturer packaging code SOT1089 SOT765-1 SOT1116 SOT996-2 SOT902-2 SOT1203 SOT505-2
Reach Compliance Code compli compliant compli compli compli compli compliant
Maker NXP NXP NXP NXP - NXP -
series - LVC/LCX/Z - LVC/LCX/Z LVC/LCX/Z - LVC/LCX/Z
JESD-30 code - R-PDSO-G8 - R-PDSO-N8 S-PBCC-B8 - S-PDSO-G8
JESD-609 code - e4 - e4 e4 - e4
length - 2.3 mm - 3 mm 1.6 mm - 3 mm
Load capacitance (CL) - 50 pF - 50 pF 50 pF - 50 pF
Logic integrated circuit type - INVERTER - INVERTER INVERTER - INVERTER
MaximumI(ol) - 0.024 A - 0.024 A 0.024 A - 0.024 A
Humidity sensitivity level - 1 - 1 1 - 1
Number of functions - 3 - 3 3 - 3
Number of entries - 1 - 1 1 - 1
Number of terminals - 8 - 8 8 - 8
Maximum operating temperature - 125 °C - 125 °C 125 °C - 125 °C
Minimum operating temperature - -40 °C - -40 °C -40 °C - -40 °C
Package body material - PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY
encapsulated code - VSSOP - VSON VBCC - TSSOP
Encapsulate equivalent code - TSSOP8,.12,20 - SOLCC8,.11,20 LCC8,.06SQ,20 - TSSOP8,.16
Package shape - RECTANGULAR - RECTANGULAR SQUARE - SQUARE
Package form - SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH - SMALL OUTLINE, VERY THIN PROFILE CHIP CARRIER, VERY THIN PROFILE - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packing - TAPE AND REEL - TAPE AND REEL TAPE AND REEL - TAPE AND REEL
Peak Reflow Temperature (Celsius) - 260 - 260 260 - 260
power supply - 3.3 V - 3.3 V 3.3 V - 3.3 V
propagation delay (tpd) - 9.5 ns - 9.5 ns 9.5 ns - 9.5 ns
Certification status - Not Qualified - Not Qualified Not Qualified - Not Qualified
Schmitt trigger - NO - NO NO - NO
Maximum seat height - 1 mm - 0.5 mm 0.5 mm - 1.1 mm
Maximum supply voltage (Vsup) - 5.5 V - 5.5 V 5.5 V - 5.5 V
Minimum supply voltage (Vsup) - 1.65 V - 1.65 V 1.65 V - 1.65 V
Nominal supply voltage (Vsup) - 1.8 V - 1.8 V 1.8 V - 1.8 V
surface mount - YES - YES YES - YES
technology - CMOS - CMOS CMOS - CMOS
Temperature level - AUTOMOTIVE - AUTOMOTIVE AUTOMOTIVE - AUTOMOTIVE
Terminal surface - Nickel/Palladium/Gold (Ni/Pd/Au) - NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au) - NICKEL PALLADIUM GOLD
Terminal form - GULL WING - NO LEAD BUTT - GULL WING
Terminal pitch - 0.5 mm - 0.5 mm 0.5 mm - 0.65 mm
Terminal location - DUAL - DUAL BOTTOM - DUAL
Maximum time at peak reflow temperature - 30 - 30 30 - 30
width - 2 mm - 2 mm 1.6 mm - 3 mm

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