|
74LVC3G04DC,125 |
74LVC3G04GN,115 |
74LVC3G04GD,125 |
74LVC3G04GM,125 |
74LVC3G04GS,115 |
74LVC3G04GF,115 |
74LVC3G04DP,125 |
Description |
inverters 3.3V triple inverter |
inverters triple inverter |
inverters inverter 3-element cmos 8-pin |
inverters 3.3V triple inverter |
inverters 8circ 9.5 ns 6.5 V |
inverters triple inverter |
inverters 3.3V triple inverter |
Brand Name |
NXP Semiconductor |
NXP Semiconduc |
NXP Semiconduc |
NXP Semiconduc |
NXP Semiconduc |
NXP Semiconduc |
NXP Semiconductor |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
Parts packaging code |
SSOP |
SON |
SON |
QFN |
SON |
SON |
TSSOP |
package instruction |
VSSOP, TSSOP8,.12,20 |
1.20 X 1 MM, 0.35 MM HEIGHT, SOT-1116, SON-8 |
3 X 2 MM, 0.50 MM HEIGHT, PLASTIC, SOT996-2, XSON-8 |
VBCC, LCC8,.06SQ,20 |
1.35 X 1 MM, 0.35 MM HEIGHT, 0.35 MM PITCH, SOT-1203, SON-8 |
1.35 X 1 MM, 0.50 MM HEIGHT, MO-252, SOT-1089, SON-8 |
3 MM, PLASTIC, SOT505-2, TSSOP-8 |
Contacts |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
Manufacturer packaging code |
SOT765-1 |
SOT1116 |
SOT996-2 |
SOT902-2 |
SOT1203 |
SOT1089 |
SOT505-2 |
Reach Compliance Code |
compliant |
compli |
compli |
compli |
compli |
compli |
compliant |
Maker |
NXP |
NXP |
NXP |
- |
NXP |
NXP |
- |
series |
LVC/LCX/Z |
- |
LVC/LCX/Z |
LVC/LCX/Z |
- |
- |
LVC/LCX/Z |
JESD-30 code |
R-PDSO-G8 |
- |
R-PDSO-N8 |
S-PBCC-B8 |
- |
- |
S-PDSO-G8 |
JESD-609 code |
e4 |
- |
e4 |
e4 |
- |
- |
e4 |
length |
2.3 mm |
- |
3 mm |
1.6 mm |
- |
- |
3 mm |
Load capacitance (CL) |
50 pF |
- |
50 pF |
50 pF |
- |
- |
50 pF |
Logic integrated circuit type |
INVERTER |
- |
INVERTER |
INVERTER |
- |
- |
INVERTER |
MaximumI(ol) |
0.024 A |
- |
0.024 A |
0.024 A |
- |
- |
0.024 A |
Humidity sensitivity level |
1 |
- |
1 |
1 |
- |
- |
1 |
Number of functions |
3 |
- |
3 |
3 |
- |
- |
3 |
Number of entries |
1 |
- |
1 |
1 |
- |
- |
1 |
Number of terminals |
8 |
- |
8 |
8 |
- |
- |
8 |
Maximum operating temperature |
125 °C |
- |
125 °C |
125 °C |
- |
- |
125 °C |
Minimum operating temperature |
-40 °C |
- |
-40 °C |
-40 °C |
- |
- |
-40 °C |
Package body material |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
- |
PLASTIC/EPOXY |
encapsulated code |
VSSOP |
- |
VSON |
VBCC |
- |
- |
TSSOP |
Encapsulate equivalent code |
TSSOP8,.12,20 |
- |
SOLCC8,.11,20 |
LCC8,.06SQ,20 |
- |
- |
TSSOP8,.16 |
Package shape |
RECTANGULAR |
- |
RECTANGULAR |
SQUARE |
- |
- |
SQUARE |
Package form |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
- |
SMALL OUTLINE, VERY THIN PROFILE |
CHIP CARRIER, VERY THIN PROFILE |
- |
- |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
method of packing |
TAPE AND REEL |
- |
TAPE AND REEL |
TAPE AND REEL |
- |
- |
TAPE AND REEL |
Peak Reflow Temperature (Celsius) |
260 |
- |
260 |
260 |
- |
- |
260 |
power supply |
3.3 V |
- |
3.3 V |
3.3 V |
- |
- |
3.3 V |
propagation delay (tpd) |
9.5 ns |
- |
9.5 ns |
9.5 ns |
- |
- |
9.5 ns |
Certification status |
Not Qualified |
- |
Not Qualified |
Not Qualified |
- |
- |
Not Qualified |
Schmitt trigger |
NO |
- |
NO |
NO |
- |
- |
NO |
Maximum seat height |
1 mm |
- |
0.5 mm |
0.5 mm |
- |
- |
1.1 mm |
Maximum supply voltage (Vsup) |
5.5 V |
- |
5.5 V |
5.5 V |
- |
- |
5.5 V |
Minimum supply voltage (Vsup) |
1.65 V |
- |
1.65 V |
1.65 V |
- |
- |
1.65 V |
Nominal supply voltage (Vsup) |
1.8 V |
- |
1.8 V |
1.8 V |
- |
- |
1.8 V |
surface mount |
YES |
- |
YES |
YES |
- |
- |
YES |
technology |
CMOS |
- |
CMOS |
CMOS |
- |
- |
CMOS |
Temperature level |
AUTOMOTIVE |
- |
AUTOMOTIVE |
AUTOMOTIVE |
- |
- |
AUTOMOTIVE |
Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
- |
NICKEL PALLADIUM GOLD |
Nickel/Palladium/Gold (Ni/Pd/Au) |
- |
- |
NICKEL PALLADIUM GOLD |
Terminal form |
GULL WING |
- |
NO LEAD |
BUTT |
- |
- |
GULL WING |
Terminal pitch |
0.5 mm |
- |
0.5 mm |
0.5 mm |
- |
- |
0.65 mm |
Terminal location |
DUAL |
- |
DUAL |
BOTTOM |
- |
- |
DUAL |
Maximum time at peak reflow temperature |
30 |
- |
30 |
30 |
- |
- |
30 |
width |
2 mm |
- |
2 mm |
1.6 mm |
- |
- |
3 mm |