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74LVC3G04DC,125

Description
inverters 3.3V triple inverter
Categorylogic    logic   
File Size276KB,21 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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74LVC3G04DC,125 Overview

inverters 3.3V triple inverter

74LVC3G04DC,125 Parametric

Parameter NameAttribute value
Brand NameNXP Semiconductor
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeSSOP
package instructionVSSOP, TSSOP8,.12,20
Contacts8
Manufacturer packaging codeSOT765-1
Reach Compliance Codecompliant
Is SamacsysN
seriesLVC/LCX/Z
JESD-30 codeR-PDSO-G8
JESD-609 codee4
length2.3 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeINVERTER
MaximumI(ol)0.024 A
Humidity sensitivity level1
Number of functions3
Number of entries1
Number of terminals8
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeVSSOP
Encapsulate equivalent codeTSSOP8,.12,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
method of packingTAPE AND REEL
Peak Reflow Temperature (Celsius)260
power supply3.3 V
Prop。Delay @ Nom-Sup5.5 ns
propagation delay (tpd)9.5 ns
Certification statusNot Qualified
Schmitt triggerNO
Maximum seat height1 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)1.65 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width2 mm
Base Number Matches1

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Description inverters 3.3V triple inverter inverters triple inverter inverters inverter 3-element cmos 8-pin inverters 3.3V triple inverter inverters 8circ 9.5 ns 6.5 V inverters triple inverter inverters 3.3V triple inverter
Brand Name NXP Semiconductor NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconductor
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to
Parts packaging code SSOP SON SON QFN SON SON TSSOP
package instruction VSSOP, TSSOP8,.12,20 1.20 X 1 MM, 0.35 MM HEIGHT, SOT-1116, SON-8 3 X 2 MM, 0.50 MM HEIGHT, PLASTIC, SOT996-2, XSON-8 VBCC, LCC8,.06SQ,20 1.35 X 1 MM, 0.35 MM HEIGHT, 0.35 MM PITCH, SOT-1203, SON-8 1.35 X 1 MM, 0.50 MM HEIGHT, MO-252, SOT-1089, SON-8 3 MM, PLASTIC, SOT505-2, TSSOP-8
Contacts 8 8 8 8 8 8 8
Manufacturer packaging code SOT765-1 SOT1116 SOT996-2 SOT902-2 SOT1203 SOT1089 SOT505-2
Reach Compliance Code compliant compli compli compli compli compli compliant
Maker NXP NXP NXP - NXP NXP -
series LVC/LCX/Z - LVC/LCX/Z LVC/LCX/Z - - LVC/LCX/Z
JESD-30 code R-PDSO-G8 - R-PDSO-N8 S-PBCC-B8 - - S-PDSO-G8
JESD-609 code e4 - e4 e4 - - e4
length 2.3 mm - 3 mm 1.6 mm - - 3 mm
Load capacitance (CL) 50 pF - 50 pF 50 pF - - 50 pF
Logic integrated circuit type INVERTER - INVERTER INVERTER - - INVERTER
MaximumI(ol) 0.024 A - 0.024 A 0.024 A - - 0.024 A
Humidity sensitivity level 1 - 1 1 - - 1
Number of functions 3 - 3 3 - - 3
Number of entries 1 - 1 1 - - 1
Number of terminals 8 - 8 8 - - 8
Maximum operating temperature 125 °C - 125 °C 125 °C - - 125 °C
Minimum operating temperature -40 °C - -40 °C -40 °C - - -40 °C
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY - - PLASTIC/EPOXY
encapsulated code VSSOP - VSON VBCC - - TSSOP
Encapsulate equivalent code TSSOP8,.12,20 - SOLCC8,.11,20 LCC8,.06SQ,20 - - TSSOP8,.16
Package shape RECTANGULAR - RECTANGULAR SQUARE - - SQUARE
Package form SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH - SMALL OUTLINE, VERY THIN PROFILE CHIP CARRIER, VERY THIN PROFILE - - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packing TAPE AND REEL - TAPE AND REEL TAPE AND REEL - - TAPE AND REEL
Peak Reflow Temperature (Celsius) 260 - 260 260 - - 260
power supply 3.3 V - 3.3 V 3.3 V - - 3.3 V
propagation delay (tpd) 9.5 ns - 9.5 ns 9.5 ns - - 9.5 ns
Certification status Not Qualified - Not Qualified Not Qualified - - Not Qualified
Schmitt trigger NO - NO NO - - NO
Maximum seat height 1 mm - 0.5 mm 0.5 mm - - 1.1 mm
Maximum supply voltage (Vsup) 5.5 V - 5.5 V 5.5 V - - 5.5 V
Minimum supply voltage (Vsup) 1.65 V - 1.65 V 1.65 V - - 1.65 V
Nominal supply voltage (Vsup) 1.8 V - 1.8 V 1.8 V - - 1.8 V
surface mount YES - YES YES - - YES
technology CMOS - CMOS CMOS - - CMOS
Temperature level AUTOMOTIVE - AUTOMOTIVE AUTOMOTIVE - - AUTOMOTIVE
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) - NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au) - - NICKEL PALLADIUM GOLD
Terminal form GULL WING - NO LEAD BUTT - - GULL WING
Terminal pitch 0.5 mm - 0.5 mm 0.5 mm - - 0.65 mm
Terminal location DUAL - DUAL BOTTOM - - DUAL
Maximum time at peak reflow temperature 30 - 30 30 - - 30
width 2 mm - 2 mm 1.6 mm - - 3 mm
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