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74LVC3G04GD,125

Description
inverters inverter 3-element cmos 8-pin
Categorylogic    logic   
File Size276KB,21 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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74LVC3G04GD,125 Overview

inverters inverter 3-element cmos 8-pin

74LVC3G04GD,125 Parametric

Parameter NameAttribute value
Brand NameNXP Semiconduc
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeSON
package instruction3 X 2 MM, 0.50 MM HEIGHT, PLASTIC, SOT996-2, XSON-8
Contacts8
Manufacturer packaging codeSOT996-2
Reach Compliance Codecompli
seriesLVC/LCX/Z
JESD-30 codeR-PDSO-N8
JESD-609 codee4
length3 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeINVERTER
MaximumI(ol)0.024 A
Humidity sensitivity level1
Number of functions3
Number of entries1
Number of terminals8
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeVSON
Encapsulate equivalent codeSOLCC8,.11,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE, VERY THIN PROFILE
method of packingTAPE AND REEL
Peak Reflow Temperature (Celsius)260
power supply3.3 V
Prop。Delay @ Nom-Su5.5 ns
propagation delay (tpd)9.5 ns
Certification statusNot Qualified
Schmitt triggerNO
Maximum seat height0.5 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)1.65 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceNICKEL PALLADIUM GOLD
Terminal formNO LEAD
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width2 mm

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Description inverters inverter 3-element cmos 8-pin inverters 3.3V triple inverter inverters triple inverter inverters 3.3V triple inverter inverters 8circ 9.5 ns 6.5 V inverters triple inverter inverters 3.3V triple inverter
Brand Name NXP Semiconduc NXP Semiconductor NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconductor
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to
Parts packaging code SON SSOP SON QFN SON SON TSSOP
package instruction 3 X 2 MM, 0.50 MM HEIGHT, PLASTIC, SOT996-2, XSON-8 VSSOP, TSSOP8,.12,20 1.20 X 1 MM, 0.35 MM HEIGHT, SOT-1116, SON-8 VBCC, LCC8,.06SQ,20 1.35 X 1 MM, 0.35 MM HEIGHT, 0.35 MM PITCH, SOT-1203, SON-8 1.35 X 1 MM, 0.50 MM HEIGHT, MO-252, SOT-1089, SON-8 3 MM, PLASTIC, SOT505-2, TSSOP-8
Contacts 8 8 8 8 8 8 8
Manufacturer packaging code SOT996-2 SOT765-1 SOT1116 SOT902-2 SOT1203 SOT1089 SOT505-2
Reach Compliance Code compli compliant compli compli compli compli compliant
Maker NXP NXP NXP - NXP NXP -
series LVC/LCX/Z LVC/LCX/Z - LVC/LCX/Z - - LVC/LCX/Z
JESD-30 code R-PDSO-N8 R-PDSO-G8 - S-PBCC-B8 - - S-PDSO-G8
JESD-609 code e4 e4 - e4 - - e4
length 3 mm 2.3 mm - 1.6 mm - - 3 mm
Load capacitance (CL) 50 pF 50 pF - 50 pF - - 50 pF
Logic integrated circuit type INVERTER INVERTER - INVERTER - - INVERTER
MaximumI(ol) 0.024 A 0.024 A - 0.024 A - - 0.024 A
Humidity sensitivity level 1 1 - 1 - - 1
Number of functions 3 3 - 3 - - 3
Number of entries 1 1 - 1 - - 1
Number of terminals 8 8 - 8 - - 8
Maximum operating temperature 125 °C 125 °C - 125 °C - - 125 °C
Minimum operating temperature -40 °C -40 °C - -40 °C - - -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY - - PLASTIC/EPOXY
encapsulated code VSON VSSOP - VBCC - - TSSOP
Encapsulate equivalent code SOLCC8,.11,20 TSSOP8,.12,20 - LCC8,.06SQ,20 - - TSSOP8,.16
Package shape RECTANGULAR RECTANGULAR - SQUARE - - SQUARE
Package form SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH - CHIP CARRIER, VERY THIN PROFILE - - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packing TAPE AND REEL TAPE AND REEL - TAPE AND REEL - - TAPE AND REEL
Peak Reflow Temperature (Celsius) 260 260 - 260 - - 260
power supply 3.3 V 3.3 V - 3.3 V - - 3.3 V
propagation delay (tpd) 9.5 ns 9.5 ns - 9.5 ns - - 9.5 ns
Certification status Not Qualified Not Qualified - Not Qualified - - Not Qualified
Schmitt trigger NO NO - NO - - NO
Maximum seat height 0.5 mm 1 mm - 0.5 mm - - 1.1 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V - 5.5 V - - 5.5 V
Minimum supply voltage (Vsup) 1.65 V 1.65 V - 1.65 V - - 1.65 V
Nominal supply voltage (Vsup) 1.8 V 1.8 V - 1.8 V - - 1.8 V
surface mount YES YES - YES - - YES
technology CMOS CMOS - CMOS - - CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE - AUTOMOTIVE - - AUTOMOTIVE
Terminal surface NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au) - Nickel/Palladium/Gold (Ni/Pd/Au) - - NICKEL PALLADIUM GOLD
Terminal form NO LEAD GULL WING - BUTT - - GULL WING
Terminal pitch 0.5 mm 0.5 mm - 0.5 mm - - 0.65 mm
Terminal location DUAL DUAL - BOTTOM - - DUAL
Maximum time at peak reflow temperature 30 30 - 30 - - 30
width 2 mm 2 mm - 1.6 mm - - 3 mm

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