EEPROM Card, 8MX16, 65ns, Parallel, CMOS, PBGA80
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Objectid | 1126065589 |
| package instruction | FBGA, BGA80,8X12,32 |
| Reach Compliance Code | compliant |
| ECCN code | 3A991.B.1.B.1 |
| YTEOL | 0 |
| Maximum access time | 65 ns |
| startup block | BOTTOM/TOP |
| command user interface | YES |
| Universal Flash Interface | YES |
| Data polling | YES |
| JESD-30 code | R-PBGA-B80 |
| JESD-609 code | e1 |
| memory density | 134217728 bit |
| Memory IC Type | EEPROM CARD |
| memory width | 16 |
| Number of departments/size | 16,254 |
| Number of terminals | 80 |
| word count | 8388608 words |
| character code | 8000000 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 8MX16 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | FBGA |
| Encapsulate equivalent code | BGA80,8X12,32 |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY, FINE PITCH |
| page size | 8 words |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 260 |
| Programming voltage | 2.7 V |
| Certification status | Not Qualified |
| ready/busy | YES |
| Department size | 4K,32K |
| Maximum standby current | 0.00003 A |
| Maximum slew rate | 0.055 mA |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | TIN SILVER COPPER |
| Terminal form | BALL |
| Terminal pitch | 0.8 mm |
| Terminal location | BOTTOM |
| switch bit | YES |
| type | NOR TYPE |
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