AD's seminar materials comprehensively cover the practical technology of analog circuits, focusing on the actual implementation of circuits, discussing how to reliably design circuits, circuit develop...
Development Trends and Prospects of 3D Packaging[Source: "Electronics and Packaging"] [Author: Weng Shousong]1 Why develop 3D packaging? So far, in the field of IC chips, SoC (system-on-chip) is the m...
Everyone wants more for less: smaller, more features, less power, better packaging, lower cost, etc. More features are better, and to meet this demand, today's discrete solutions are tomorrow's integr...
Hall devices are magnetic sensors based on the Hall effect. They have developed into a diverse family of magnetic sensor products and have been widely used. This article briefly introduces their worki...
The current multi-level conversion technology is mainly aimed at voltage-type inverters: With the development of superconducting energy storage technology, the energy storage efficiency problem of cur...