MD8832-D1G-V3-X-P datasheet, PDF

Datasheet> All Categories > storage> MD8832-D1G-V3-X-P

Preview

MD8832-D1G-V3-X-P: DescriptionIC flash 1gbit 33ns 69fbga; Categorystorage; File Size721KB，85 Pages; ManufacturerSanDisk; Environmental Compliance

Download Datasheet Compare View All

MD8832-D1G-V3-X-P Overview

IC flash 1gbit 33ns 69fbga

Preview

Download Datasheet

View All

DiskOnChip G4 128MB (1Gb)/256MB (2Gb) 1.8V

Flash Disk with MLC NAND and M-Systems’ x2 Technology

Data Sheet, November 2005

Highlights

DiskOnChip G4 is M-Systems' 4

generation of

the DiskOnChip family of products. Based on

Multi-Level Cell (MLC) NAND, utilizing

Toshiba’s 90nm MLC NAND Large Block

flash technology and x2 technology from M-

Systems, it is one of the industry’s most

efficient storage solutions. MLC NAND flash

technology provides the smallest die size by

storing 2 bits of information in a single memory

cell. x2 technology enables MLC NAND to

achieve highly reliable, high-performance data

and code storage with a specially designed error

detection and correction mechanism, optimized

file management, and proprietary algorithms for

enhanced performance.

Further cost benefits derive from the

cost-effective architecture of DiskOnChip G4,

which includes a boot block that can replace

expensive NOR flash, and incorporates both the

flash array and an embedded thin controller in a

single die.

DiskOnChip G4 provides:

Flash disk for both code and data storage

Low voltage: 1.8V core and I/O

Hardware protection and security-enabling

features

High capacity: single die - 1Gb (128MB),

dual die - 2Gb (256MB)

Device cascade capacity: up to 4Gb

(512MB)

Enhanced Programmable Boot Block

enabling eXecute In Place (XIP)

functionality using 16-bit interface

Small form factors:

69-ball FBGA 9x12 mm package

Enhanced performance by implementation

of:

DMA support

MultiBurst operation

Unrivaled data integrity with a robust Error

Detection Code/Error Correction Code

(EDC/ECC) tailored for MLC NAND flash

technology

Maximized flash endurance with TrueFFS

6.3.2 (and higher)

Support for major operating systems (OSs),

including Symbian OS, Microsoft Windows

Mobile, Palm OS, Nucleus, Linux, OSE,

Windows CE, and more.

Compatible with major CPUs, including

TI OMAP, TI DBB, Intel XScale, Infinion,

EGold and SGold, ADI 652x, Freescale

MX, and Qualcomm MSMxxxx.

Data Sheet (Preliminary) Rev. 0.3

92-DS-1105-00

DiskOnChip G4 128MB (1Gb)/256MB (2Gb) 1.8V

ABLE OF

ONTENTS

1. Introduction ............................................................................................................................... 9

2. Product Overview .................................................................................................................... 10

2.1

2.2

Product Description .......................................................................................................... 10

Standard Interface ............................................................................................................ 11

2.2.1

2.2.2

2.2.3

Ball Diagrams ..................................................................................................................... 11

System Interface ................................................................................................................ 12

Signal Description .............................................................................................................. 13

Ball Diagram ....................................................................................................................... 15

System Interface ................................................................................................................ 16

Signal Description .............................................................................................................. 17

2.3

Multiplexed Interface ........................................................................................................ 15

2.3.1

2.3.2

2.3.3

3. Theory of Operation ................................................................................................................ 19

3.1

3.2

Overview........................................................................................................................... 19

System Interface............................................................................................................... 20

3.2.1

3.2.2

Standard (NOR-Like) Interface........................................................................................... 20

Multiplexed Interface .......................................................................................................... 20

3.3

3.4

Configuration Interface ..................................................................................................... 20

Protection and Security-Enabling Features ...................................................................... 21

3.4.1

3.4.2

3.4.3

3.4.4

3.4.5

Read/Write Protection ........................................................................................................ 21

Unique Identification (UID) Number ................................................................................... 21

One-Time Programmable (OTP) Area ............................................................................... 21

One-Time Write (ROM-Like) Partition ................................................................................ 22

Sticky Lock (SLOCK).......................................................................................................... 22

3.5

3.6

3.7

3.8

3.9

4.1

4.2

4.3

Programmable Boot Block with eXecute In Place (XIP) Functionality.............................. 22

Download Engine (DE) ..................................................................................................... 22

Error Detection Code/Error Correction Code (EDC/ECC) ................................................ 23

Control and Status............................................................................................................ 23

Flash Architecture............................................................................................................. 23

MultiBurst Operation......................................................................................................... 25

DMA Operation................................................................................................................. 28

Combined MultiBurst Mode and DMA Operation ............................................................. 29

4. x2 Technology ......................................................................................................................... 25

5. Hardware Protection ............................................................................................................... 30

Data Sheet (Preliminary) Rev. 0.3

92-DS-1105-00

MD8832-D1G-V3-X-P Related Products

	MD8832-D1G-V3-X-P	MD8832-D1G-V3-X-P/Y	MD8832-D1G-V18-X-P/Y	MD8331-D2G-V3-X-P/Y	MD8331-D2G-V18-X-P/Y	MD8331-D2G-V3-X-P	MD8331-D2G-V18-X-P	MD8331-D2G-V18-X	MD8331-D2G-V3-X	MD8832-D1G-V18-X-P
Description	IC flash 1gbit 33ns 69fbga	IC flash 1gbit 33ns 69fbga	IC flash 1gbit 33ns 69fbga	IC flash 2gbit 33ns 69fbga	IC flash 2gbit 33ns 69fbga	IC flash 2gbit 33ns 69fbga	IC flash 2gbit 33ns 69fbga	IC flash 2gbit 33ns 69fbga	IC flash 2gbit 33ns 69fbga	IC flash 1gbit 33ns 69fbga

Recommended Resources

Hisense KFR-25GW-06BP inverter air conditioner indoor fan motor drive circuit

Overvoltage protection circuit diagram using TL431 precision reference source, etc.

Boost-type voltage stabilizing circuit diagram using MC34063 series

JFET crystal oscillator circuit diagram

Curtain automatic opening and closing circuit

STM32F103 vs MM32F103: [size=4]Many programmers and new students have been asking me this question: which one is more suitable between STM32F103 and MM32F103? Our company has been developing and testing for a period of time...; 灞波儿奔 Microcontroller MCU

FPGA Design Tips: ...; 至芯科技FPGA大牛 FPGA/CPLD

UDP packet loss problem: I had a recent interview, and the product I was working on used a network port and UDP to communicate with the host computer. That product wasn’t done well either. As a result, the interviewer asked m...; chenbingjy stm32/stm8

Live broadcast data collection | ST home appliance three-phase motor control solution: Live broadcast details: ST three-phase motor control solution for home appliancesLive replay:Click to viewLive PPT:Click to viewFAQ 1. What is the main control strategy of ST household appliance motor...; EEWORLD社区 ST Sensors & Low Power Wireless Technology Forum

New generation of ESD protection devices no longer require VCC connection: Due to their ever-decreasing process nodes, digital and analog ICs are increasingly susceptible to damage from electrostatic discharge (ESD), so discrete ESD protection diodes are a necessary componen...; qwqwqw2088 Analogue and Mixed Signal

The latest MicroPython official PDF technical documentation (updated to v1.21): [i=s]This post was last edited by dcexpert on 2023-10-11 11:41[/i]Recently, the official technical documentation has been updated a lot, and many contents have been updated to the latest version. For ...; dcexpert MicroPython Open Source section

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components