MD8832-D1G-V18-X-P/Y datasheet, PDF

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MD8832-D1G-V18-X-P/Y: DescriptionIC flash 1gbit 33ns 69fbga; Categorystorage; File Size721KB，85 Pages; ManufacturerSanDisk; Environmental Compliance

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MD8832-D1G-V18-X-P/Y Overview

IC flash 1gbit 33ns 69fbga

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DiskOnChip G4 128MB (1Gb)/256MB (2Gb) 1.8V

Flash Disk with MLC NAND and M-Systems’ x2 Technology

Data Sheet, November 2005

Highlights

DiskOnChip G4 is M-Systems' 4

generation of

the DiskOnChip family of products. Based on

Multi-Level Cell (MLC) NAND, utilizing

Toshiba’s 90nm MLC NAND Large Block

flash technology and x2 technology from M-

Systems, it is one of the industry’s most

efficient storage solutions. MLC NAND flash

technology provides the smallest die size by

storing 2 bits of information in a single memory

cell. x2 technology enables MLC NAND to

achieve highly reliable, high-performance data

and code storage with a specially designed error

detection and correction mechanism, optimized

file management, and proprietary algorithms for

enhanced performance.

Further cost benefits derive from the

cost-effective architecture of DiskOnChip G4,

which includes a boot block that can replace

expensive NOR flash, and incorporates both the

flash array and an embedded thin controller in a

single die.

DiskOnChip G4 provides:

Flash disk for both code and data storage

Low voltage: 1.8V core and I/O

Hardware protection and security-enabling

features

High capacity: single die - 1Gb (128MB),

dual die - 2Gb (256MB)

Device cascade capacity: up to 4Gb

(512MB)

Enhanced Programmable Boot Block

enabling eXecute In Place (XIP)

functionality using 16-bit interface

Small form factors:

69-ball FBGA 9x12 mm package

Enhanced performance by implementation

of:

DMA support

MultiBurst operation

Unrivaled data integrity with a robust Error

Detection Code/Error Correction Code

(EDC/ECC) tailored for MLC NAND flash

technology

Maximized flash endurance with TrueFFS

6.3.2 (and higher)

Support for major operating systems (OSs),

including Symbian OS, Microsoft Windows

Mobile, Palm OS, Nucleus, Linux, OSE,

Windows CE, and more.

Compatible with major CPUs, including

TI OMAP, TI DBB, Intel XScale, Infinion,

EGold and SGold, ADI 652x, Freescale

MX, and Qualcomm MSMxxxx.

Data Sheet (Preliminary) Rev. 0.3

92-DS-1105-00

DiskOnChip G4 128MB (1Gb)/256MB (2Gb) 1.8V

ABLE OF

ONTENTS

1. Introduction ............................................................................................................................... 9

2. Product Overview .................................................................................................................... 10

2.1

2.2

Product Description .......................................................................................................... 10

Standard Interface ............................................................................................................ 11

2.2.1

2.2.2

2.2.3

Ball Diagrams ..................................................................................................................... 11

System Interface ................................................................................................................ 12

Signal Description .............................................................................................................. 13

Ball Diagram ....................................................................................................................... 15

System Interface ................................................................................................................ 16

Signal Description .............................................................................................................. 17

2.3

Multiplexed Interface ........................................................................................................ 15

2.3.1

2.3.2

2.3.3

3. Theory of Operation ................................................................................................................ 19

3.1

3.2

Overview........................................................................................................................... 19

System Interface............................................................................................................... 20

3.2.1

3.2.2

Standard (NOR-Like) Interface........................................................................................... 20

Multiplexed Interface .......................................................................................................... 20

3.3

3.4

Configuration Interface ..................................................................................................... 20

Protection and Security-Enabling Features ...................................................................... 21

3.4.1

3.4.2

3.4.3

3.4.4

3.4.5

Read/Write Protection ........................................................................................................ 21

Unique Identification (UID) Number ................................................................................... 21

One-Time Programmable (OTP) Area ............................................................................... 21

One-Time Write (ROM-Like) Partition ................................................................................ 22

Sticky Lock (SLOCK).......................................................................................................... 22

3.5

3.6

3.7

3.8

3.9

4.1

4.2

4.3

Programmable Boot Block with eXecute In Place (XIP) Functionality.............................. 22

Download Engine (DE) ..................................................................................................... 22

Error Detection Code/Error Correction Code (EDC/ECC) ................................................ 23

Control and Status............................................................................................................ 23

Flash Architecture............................................................................................................. 23

MultiBurst Operation......................................................................................................... 25

DMA Operation................................................................................................................. 28

Combined MultiBurst Mode and DMA Operation ............................................................. 29

4. x2 Technology ......................................................................................................................... 25

5. Hardware Protection ............................................................................................................... 30

Data Sheet (Preliminary) Rev. 0.3

92-DS-1105-00

MD8832-D1G-V18-X-P/Y Related Products

	MD8832-D1G-V18-X-P/Y	MD8832-D1G-V3-X-P/Y	MD8832-D1G-V3-X-P	MD8331-D2G-V3-X-P/Y	MD8331-D2G-V18-X-P/Y	MD8331-D2G-V3-X-P	MD8331-D2G-V18-X-P	MD8331-D2G-V18-X	MD8331-D2G-V3-X	MD8832-D1G-V18-X-P
Description	IC flash 1gbit 33ns 69fbga	IC flash 1gbit 33ns 69fbga	IC flash 1gbit 33ns 69fbga	IC flash 2gbit 33ns 69fbga	IC flash 2gbit 33ns 69fbga	IC flash 2gbit 33ns 69fbga	IC flash 2gbit 33ns 69fbga	IC flash 2gbit 33ns 69fbga	IC flash 2gbit 33ns 69fbga	IC flash 1gbit 33ns 69fbga

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