User’s Manual
16
RL78/G13
User’s Manual: Hardware
16-Bit Single-Chip Microcontrollers
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Rev.1.00
Sep 2011
Notice
1.
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“Standard”:
2.
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(Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majority-
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(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
NOTES FOR CMOS DEVICES
(1) VOLTAGE APPLICATION WAVEFORM AT INPUT PIN: Waveform distortion due to input noise or a
reflected wave may cause malfunction. If the input of the CMOS device stays in the area between VIL
(MAX) and VIH (MIN) due to noise, etc., the device may malfunction. Take care to prevent chattering noise
from entering the device when the input level is fixed, and also in the transition period when the input level
passes through the area between VIL (MAX) and VIH (MIN).
(2) HANDLING OF UNUSED INPUT PINS: Unconnected CMOS device inputs can be cause of malfunction. If
an input pin is unconnected, it is possible that an internal input level may be generated due to noise, etc.,
causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of
CMOS devices must be fixed high or low by using pull-up or pull-down circuitry. Each unused pin should be
connected to VDD or GND via a resistor if there is a possibility that it will be an output pin. All handling
related to unused pins must be judged separately for each device and according to related specifications
governing the device.
(3) PRECAUTION AGAINST ESD: A strong electric field, when exposed to a MOS device, can cause
destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop
generation of static electricity as much as possible, and quickly dissipate it when it has occurred.
Environmental control must be adequate. When it is dry, a humidifier should be used. It is recommended
to avoid using insulators that easily build up static electricity. Semiconductor devices must be stored and
transported in an anti-static container, static shielding bag or conductive material. All test and measurement
tools including work benches and floors should be grounded. The operator should be grounded using a wrist
strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken
for PW boards with mounted semiconductor devices.
(4) STATUS BEFORE INITIALIZATION: Power-on does not necessarily define the initial status of a MOS
device. Immediately after the power source is turned ON, devices with reset functions have not yet been
initialized. Hence, power-on does not guarantee output pin levels, I/O settings or contents of registers. A
device is not initialized until the reset signal is received. A reset operation must be executed immediately
after power-on for devices with reset functions.
(5) POWER ON/OFF SEQUENCE: In the case of a device that uses different power supplies for the internal
operation and external interface, as a rule, switch on the external power supply after switching on the internal
power supply. When switching the power supply off, as a rule, switch off the external power supply and then
the internal power supply. Use of the reverse power on/off sequences may result in the application of an
overvoltage to the internal elements of the device, causing malfunction and degradation of internal elements
due to the passage of an abnormal current. The correct power on/off sequence must be judged separately
for each device and according to related specifications governing the device.
(6) INPUT OF SIGNAL DURING POWER OFF STATE : Do not input signals or an I/O pull-up power supply
while the device is not powered. The current injection that results from input of such a signal or I/O pull-up
power supply may cause malfunction and the abnormal current that passes in the device at this time may
cause degradation of internal elements. Input of signals during the power off state must be judged
separately for each device and according to related specifications governing the device.
How to Use This Manual
Readers
This manual is intended for user engineers who wish to understand the functions of the
RL78/G13 and design and develop application systems and programs for these devices.
The target products are as follows.
•
20-pin: R5F1006x (x = A, C, D, E)
R5F1016x (x = A, C, D, E)
•
24-pin: R5F1007x (x = A, C, D, E)
R5F1017x (x = A, C, D, E)
•
25-pin: R5F1008x (x = A, C, D, E)
R5F1018x (x = A, C, D, E)
•
30-pin: R5F100Ax (x = A, C, D, E, F, G)
R5F101Ax (x = A, C, D, E, F, G)
•
32-pin: R5F100Bx (x = A, C, D, E, F, G)
R5F101Bx (x = A, C, D, E, F, G)
•
36-pin: R5F100Cx (x = A, C, D, E, F, G)
R5F101Cx (x = A, C, D, E, F, G)
•
40-pin: R5F100Ex (x = A, C, D, E, F, G, H)
R5F101Ex (x = A, C, D, E, F, G, H)
Purpose
•
128-pin:
•
100-pin:
•
80-pin:
•
64-pin:
•
52-pin:
•
48-pin:
•
44-pin:
R5F100Fx (x = A, C, D, E, F, G, H, J, K, L)
R5F101Fx (x = A, C, D, E, F, G, H, J, K, L)
R5F100Gx (x = A, C, D, E, F, G, H, J, K, L)
R5F101Gx (x = A, C, D, E, F, G, H, J, K, L)
R5F100Jx (x = C, D, E, F, G, H, J, K, L)
R5F101Jx (x = C, D, E, F, G, H, J, K, L)
R5F100Lx (x = C, D, E, F, G, H, J, K, L)
R5F101Lx (x = C, D, E, F, G, H, J, K, L)
R5F100Mx (x = F, G, H, J, K, L)
R5F101Mx (x = F, G, H, J, K, L)
R5F100Px (x = F, G, H, J, K, L)
R5F101Px (x = F, G, H, J, K, L)
R5F100Sx (x = H, J, K, L)
R5F101Sx (x = H, J, K, L)
This manual is intended to give users an understanding of the functions described in the
Organization
below.
Organization
The RL78/G13 manual is separated into two parts: this manual and the instructions edition
(common to the RL78 Microcontroller).
RL78/G13
User’s Manual
(This Manual)
•
Pin functions
•
Internal block functions
•
Interrupts
•
Other on-chip peripheral functions
•
Electrical specifications
RL78 Microcontroller
User’s Manual
Instructions
•
CPU functions
•
Instruction set
•
Explanation of each instruction
How to Read This Manual
It is assumed that the readers of this manual have general knowledge of electrical
engineering, logic circuits, and microcontrollers.
•
To gain a general understanding of functions:
→
Read this manual in the order of the
CONTENTS.
The mark “<R>” shows major
revised points. The revised points can be easily searched by copying an “<R>” in the
PDF file and specifying it in the “Find what:” field.
•
How to interpret the register format:
→
For a bit number enclosed in angle brackets, the bit name is defined as a reserved
word in the assembler, and is defined as an sfr variable using the #pragma sfr
directive in the compiler.
•
To know details of the RL78 Microcontroller instructions:
→
Refer to the separate document
RL78 Microcontroller Instructions User’s Manual
(R01US0015E).
Conventions
Data significance:
Note:
Caution:
Remark:
Higher digits on the left and lower digits on the right
Footnote for item marked with
Note
in the text
Information requiring particular attention
Active low representations:
×××
(overscore over pin and signal name)
Supplementary information
...
××××
or
××××B
Numerical representations: Binary
...
××××
Decimal
Hexadecimal
...
××××H
Related Documents
The related documents indicated in this publication may include preliminary versions.
However, preliminary versions are not marked as such.
Documents Related to Devices
Document Name
RL78/G13 User’s Manual Hardware
RL78 Microcontroller Instructions User’s Manual
Document No.
This manual
R01US0015E
Documents Related to Flash Memory Programming
Document Name
PG-FP5 Flash Memory Programmer User’s Manual
Document No.
R20UT0008E
Caution The related documents listed above are subject to change without notice. Be sure to use the latest
version of each document when designing.
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