AND Gate, HC/UH Series, 2-Func, 4-Input, CMOS, CDIP14
Parameter Name | Attribute value |
Maker | Harris |
package instruction | , |
Reach Compliance Code | unknown |
series | HC/UH |
JESD-30 code | R-CDIP-T14 |
Load capacitance (CL) | 50 pF |
Logic integrated circuit type | AND GATE |
Number of functions | 2 |
Number of entries | 4 |
Number of terminals | 14 |
Package body material | CERAMIC, METAL-SEALED COFIRED |
Package shape | RECTANGULAR |
Package form | IN-LINE |
propagation delay (tpd) | 20 ns |
Certification status | Not Qualified |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Terminal form | THROUGH-HOLE |
Terminal location | DUAL |
Base Number Matches | 1 |
HCS21D/SAMPLE | HCS21DMSR | 5962R9577901V9A | 5962R9577901VXC | 5962R9577901VCC | HCS21K/SAMPLE | HCS21KMSR | HCS21HMSR | |
---|---|---|---|---|---|---|---|---|
Description | AND Gate, HC/UH Series, 2-Func, 4-Input, CMOS, CDIP14 | AND Gate, HC/UH Series, 2-Func, 4-Input, CMOS, CDIP14 | AND Gate, HC/UH Series, 2-Func, 4-Input, CMOS | AND Gate, HC/UH Series, 2-Func, 4-Input, CMOS, CDFP14 | AND Gate, HC/UH Series, 2-Func, 4-Input, CMOS, CDIP14 | AND Gate, HC/UH Series, 2-Func, 4-Input, CMOS, CDFP14 | AND Gate, HC/UH Series, 2-Func, 4-Input, CMOS, CDFP14 | AND Gate, HC/UH Series, 2-Func, 4-Input, CMOS |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
series | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH |
JESD-30 code | R-CDIP-T14 | R-CDIP-T14 | X-XUUC-N14 | R-CDFP-F14 | R-CDIP-T14 | R-CDFP-F14 | R-CDFP-F14 | X-XUUC-N14 |
Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
Logic integrated circuit type | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE |
Number of functions | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
Number of entries | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
Number of terminals | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED |
Package shape | RECTANGULAR | RECTANGULAR | UNSPECIFIED | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | UNSPECIFIED |
Package form | IN-LINE | IN-LINE | UNCASED CHIP | FLATPACK | IN-LINE | FLATPACK | FLATPACK | UNCASED CHIP |
propagation delay (tpd) | 20 ns | 20 ns | 20 ns | 20 ns | 20 ns | 20 ns | 20 ns | 20 ns |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | YES | YES | NO | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | FLAT | THROUGH-HOLE | FLAT | FLAT | NO LEAD |
Terminal location | DUAL | DUAL | UPPER | DUAL | DUAL | DUAL | DUAL | UPPER |
Maker | Harris | Harris | - | - | Harris | Harris | Harris | Harris |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - | - |
JESD-609 code | - | e0 | e0 | e4 | e4 | - | e0 | - |
Maximum operating temperature | - | 125 °C | 125 °C | 125 °C | 125 °C | - | 125 °C | 125 °C |
Minimum operating temperature | - | -55 °C | -55 °C | -55 °C | -55 °C | - | -55 °C | -55 °C |
Temperature level | - | MILITARY | MILITARY | MILITARY | MILITARY | - | MILITARY | MILITARY |
Terminal surface | - | Tin/Lead (Sn/Pb) | TIN LEAD | GOLD | GOLD | - | Tin/Lead (Sn/Pb) | - |
total dose | - | 200k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | - | 200k Rad(Si) V | - |