datasheet
EEWORLDEEWORLDEEWORLD
Datasheet
Part Number

Keyword

Search
Keyword

Part Number

Search
Datasheet> All Categories > Passive components> The resistor> CRMV1210BE24K0JLSB
PDF
Preview

CRMV1210BE24K0JLSB

Description
Fixed Resistor, Metal Glaze/thick Film, 0.3W, 24000ohm, 400V, 5% +/-Tol, -150,150ppm/Cel, 1210,
CategoryPassive components    The resistor   
File Size131KB，3 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Download Datasheet Parametric View All

CRMV1210BE24K0JLSB Overview

Fixed Resistor, Metal Glaze/thick Film, 0.3W, 24000ohm, 400V, 5% +/-Tol, -150,150ppm/Cel, 1210,

CRMV1210BE24K0JLSB Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Objectid993072733
Reach Compliance Codeunknown
ECCN codeEAR99
YTEOL7.3
structureChip
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package height0.64 mm
Package length3.18 mm
Package formSMT
Package width2.54 mm
method of packingBulk
Rated power dissipation(P)0.3 W
resistance24000 Ω
Resistor typeFIXED RESISTOR
seriesCRMV
size code1210
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient150 ppm/°C
Tolerance5%
Operating Voltage400 V

CRMV1210BE24K0JLSB Preview

CRMV
www.vishay.com
Vishay Techno
Thick Film Chip Resistors, Medium Voltage
FEATURES
• Voltages up to 800 V
• Automatic placement capability
• Termination style: 3-sided wraparound
termination or single termination flip chip
available
• Tape and reel packaging available
• Suitable for solderable, epoxy bondable, or
wire bondable applications
• Internationally standardized sizes, custom sizes available
• Termination material: Solder-coated nickel barrier
standard; gold, palladium silver, platinum gold, platinum
silver or platinum palladium gold terminations available
• Multiple styles, termination materials and configurations,
allow wide design flexibility
• Non-magnetic terminations available
• Material categorization: For definitions of compliance
please see
www.vishay.com/doc?99912
Note
*
Lead (Pb)-containing terminations are not RoHS-compliant. Exemptions may apply.
STANDARD ELECTRICAL SPECIFICATIONS
GLOBAL MODEL
CASE
SIZE
POWER RATING
P
70 °C
W
0.25
0.30
0.40
0.45
0.50
MAX. WORKING
VOLTAGE
(2)
V
300
400
500
750
800
RESISTANCE
RANGE
(1)
150 to 15M
300 to 20M
500 to 40M
1K to 60M
1K to 75M
TOLERANCE
±%
1, 2, 5, 10, 20
1, 2, 5, 10, 20
1, 2, 5, 10, 20
1, 2, 5, 10, 20
1, 2, 5, 10, 20
TEMPERATURE
COEFFICIENT
± ppm/°C
150
150
150
150
150
CRMV1206
1206
CRMV1210
1210
CRMV2010
2010
CRMV2510
2510
CRMV2512
2512
Notes
• For non-standard sizes, lower values or higher power rating requirement, contact factory.
(1)
Resistance values calibrated at 10 V . Calibration at other voltages available upon request.
DC
(2)
Continuous working voltage shall be
P
x
R
or Maximum Working Voltage, whichever is less.
TECHNICAL SPECIFICATIONS
PARAMETER
Rated dissipation at 70 °C
Limiting element voltage
Insulation resistance
Category temperature range
Weight/1000 (typical)
UNIT
W
V
°C
g
CRMV1206
0.25
300
10
11
- 55 to + 150
12.2
CRMV1210
0.30
400
10
11
- 55 to + 150
19.6
CRMV2010
0.40
500
10
11
- 55 to + 150
32.2
CRMV2510
0.45
750
10
11
- 55 to + 150
39.8
CRMV2512
0.50
800
10
11
- 55 to + 150
49.7
VOLTAGE COEFFICIENT OF RESISTANCE
MODEL
CRMV1206
CRMV1210
CRMV2010
CRMV2510
CRMV2512
VALUE ()
150 to 15M
300 to 20M
500 to 40M
1K to 60M
1K to 75M
VCR (ppm/V)
FURTHER INSTRUCTIONS
Consult factory
Consult factory
Consult factory
Consult factory
Consult factory
GLOBAL PART NUMBER INFORMATION
Global Part Numbering: CRMV1210AF1K00FLET (preferred part number format)
C
GLOBAL
MODEL
CRMV
R
SIZE
1206
1210
2010
2510
2512
M
V
1
2
1
0
A
F
1
K
0
TCR
0
F
L
E
T
PACKAGING
B
= Bulk
F
= T/R
(full reel)
1
= T/R
(1000 pcs)
5
= T/R
(500 pcs)
T
= T/R
(250 pcs min.)
W
= Waffle tray
TERMINAL
STYLE
A
= 3-sided
B
= Top only
TERMINAL
MATERIAL
F
= Nickel barrier
A
= Palladium
silver
B
= Palladium
gold
C
= Gold
D
= Platinum
silver
E
= Platinum
palladium gold
RESISTANCE
VALUE
R
=
K
= k
M
= M
110R
= 110
49K9
= 49.9 k
10M0
= 10 M
TOLERANCE
F
=±1%
G
=±2%
J
=±5%
K
= ± 10 %
M
= ± 20 %
SOLDER
TERMINATION
D
= Sn95/Ag5, HSD
E
= Sn100
F
= Sn95/Ag5
N
= No solder
S
= Sn62/Pb36/Ag2,
HSD
T
= Sn90/Pb10
L
= 150 ppm
Note
• For additional information on packaging, refer to the Surface Mount Resistor Packaging document (www.vishay.com/doc?31543).
Revision: 14-Jan-13
Document Number: 68037
1
For technical questions, contact:
te1resistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CRMV
www.vishay.com
Vishay Techno
LENGTH
(1)
(L)
0.125 ± 0.006
(3.18 ± 0.15)
0.125 ± 0.006
(3.18 ± 0.15)
0.200 ± 0.006
(5.08 ± 0.15)
0.250 ± 0.006
(6.35 ± 0.15)
0.250 ± 0.006
(6.35 ± 0.15)
WIDTH
(1)
(W)
0.063 ± 0.006
(1.60 ± 0.15)
0.100 ± 0.006
(2.54 ± 0.15)
0.100 ± 0.006
(2.54 ± 0.15)
0.100 ± 0.006
(2.54 ± 0.15)
0.126 ± 0.006
(3.20 ± 0.15)
THICKNESS
(1)
(T)
0.025 ± 0.002
(0.64 ± 0.05)
0.025 ± 0.002
(0.64 ± 0.05)
0.025 ± 0.002
(0.64 ± 0.05)
0.025 ± 0.002
(0.64 ± 0.05)
0.025 ± 0.002
(0.64 ± 0.05)
DIMENSIONS
in inches (millimeters)
TERMINATION STYLE A
(3-SIDED WRAPAROUND)
TERMINATION STYLE B
(TOP CONDUCTOR ONLY)
MODEL
CRMV1206
W
L
T
0.025 (0.635)
Max.
T
0.025 (0.635)
Max.
L
W
CRMV1210
CRMV2010
CRMV2510
CRMV2512
Note
(1)
All dimensions are before solder coating.
TYPE
Solderable
Epoxy
bondable/solderable
Wire bondable/
epoxy bondable
Epoxy bondable
TERMINATION
MATERIAL
Nickel barrier
Platinum palladium gold
Gold
Palladium silver
(3)
Platinum gold
Platinum silver
TERMINATION
STYLE
3-sided (wraparound)
Top only (flip chip)
Top only (flip chip)
Top only (flip chip)
Top only (flip chip)
TERMINATION STYLE/
MATERIAL CODE
AF
BF
BE
BC
BA
BB
BD
SOLDER TERMINATION
CODE
E or T (standard);
D, F, or S (optional)
(4)
N (standard);
D or S (optional)
(2)
N
N
Notes
(2)
Use solder termination N for applications requiring epoxy bondable mounting, and solder terminations D or S for applications requiring
solderable mounting.
(3)
While not recommended, palladium silver terminations could be used for solderable applications when using a solder alloy containing silver.
If the solder paste being used to solder the palladium silver terminated parts to the boards does not have a silver-based composition, then
the silver in the terminations could begin to leach when it is exposed to liquidus non-silver-based solders, causing the potential for
solderability and/or solder joint issues.
(4)
Standard solder plating for the nickel barrier parts are solder terminations E or T. Plated termination F and hot solder dipped terminations D
or S are also available.
DERATING CURVE
Rated Power in %
120
100
80
60
40
20
0
- 55
- 25
0
25
50
75 100 125 150 175
70
Ambient Temperature in °C
MATERIAL SPECIFICATIONS
Resistive element
Encapsulation
Substrate
Ruthenium oxide
Epoxy
96 % alumina
Solder-coated nickel barrier standard.
Gold, palladium silver, platinum gold,
platinum silver, platinum palladium gold
terminations available.
Pure tin or tin/lead solder alloys standard.
Tin/silver or tin/lead/silver solder
alloys available.
Termination
Solder finish
PERFORMANCE
TEST
Life
Short time overload
Thermal shock
Low temperature operation
Resistance to bonding exposure
Moisture resistance
Solder mounting integrity
Solderability
Revision: 14-Jan-13
CONDITIONS OF TEST
MIL-STD-202, method 108
1000 h rated power at + 70 °C
MIL-PRF-55342, paragraph 4.8.6
MIL-STD-202, method 107
- 55 °C to + 150 °C
MIL-PRF-55342, paragraph 4.8.5
MIL-STD-202, methods 210
MIL-PRF-55342, paragraph 4.8.9
MIL-PRF-55342, paragraph 4.8.13
2 kg for 30 s
MIL-STD-202, method 208
TEST RESULTS (TYPICAL TEST LOTS)
± 0.50 %
± 0.02 %
± 0.50 %
± 0.02 %
± 0.05 %
± 0.06 %
No evidence of mechanical damage
95 % coverage
Document Number: 68037
2
For technical questions, contact:
te1resistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please
contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by
any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.
Material Category Policy
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
conform to JEDEC JS709A standards.
Revision: 02-Oct-12
1
Document Number: 91000
More (Only the first 5 pages are displayed. Please Download Datasheet to view the full content.) >

Recommended Resources

Circuit diagram of boost DCDC converter using HS7076

Voltage continuous adjustment without current limiting circuit diagram

Automatic car headlight switch

STK461 power amplifier circuit

820e computer motherboard circuit diagram_56

Computer motherboard circuit diagram 815 4_63

Smart electric car seesaw
1. System solution selection and demonstration 1.1 Basic system plan There are two solutions according to the question requirements.Solution 1: Precise Timing Method The main idea of this solution is:...
兰博 Electronics Design Contest
Ultrasonic drive circuit
Ultrasonic drive circuitThe topologies available for the drive circuit include push-pull, half-bridge and full-bridge.1. In the push-pull circuit, the switch tube drive is common ground, no isolation ...
QWE4562009 Discrete Device
Help: How many lines are needed for SWD debugging of stm32f407?
Some people say that the SWD debugging of stm32f407 has 5 lines, [color=rgb(79, 79, 79)][backcolor=transparent][font="]VCC, GND, RST, SWDIO, SWDCLK. Others say it is [/font][/backcolor][/color][color=...
bigbat stm32/stm8
How to use STM32 to read Windows vector fonts
I used STM32 to read the vector font of WINDOWS and converted it to dot matrix for display. Let's exchange some ideas....
wuguozhi MCU
Recruiting part-time DSP and other related professional lecturers or technical support personnel
Recruiting part-time lecturers or technical support personnel in related majors such as DSP, short-term training or technical support, weekends, Beijing, Shanghai, Guangzhou, Shenzhen, Chengdu, Wuhan,...
奈何氵 Recruitment
[CC1352P Review] TI-RTOS uartecho test
In order to understand how TI-RTOS works, I found the example of SDK - uartecho project in the driver directory under rtos for analysis. The purpose of this example is very simple, that is, to receive...
cruelfox RF/Wirelessly
Shortcut:   E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components

  1. 3309P-11-201
  2. LM4040DYM3-4.1-TR
  3. 335-4010-H64
  4. 69190-430ALF
  5. M55342E01B1B13CWS
  6. RA4471UM
  7. 0402WGF2050C5
  8. P-0603E2052AGTP
  9. GMZJ5.6AT/R
  10. SB320_B0_00001
  11. A1252WR-7P
  12. MTF185-205SY3

Popular Articles

  1. IAA 2021丨Continental will showcase in-vehicle supercomputers and innovative solutions for autonomous driving
  2. Vishay's automotive high-voltage thick-film chip resistors save board space and reduce costs
  3. UNIST team develops cathode material with 98% nickel content to increase EV driving range
  4. Honor Magic V foldable phone will be equipped with Snapdragon 8 Gen 1 chip
  5. What is a "flexible invisible large screen"? Looking ahead to the next generation of automotive cockpit technology
  6. ATmega8 timer interrupt external interrupt program
  7. Lumotive and ZKW Demonstrate Integrated LiDAR in Automotive Headlights
  8. Can electric vehicles be equipped with range extenders?
  9. How to use a pointer multimeter to detect synchronous motor faults?
  10. PLC analog input conversion process

Technical ResourceMore

  1. Battery monitor based on single chip microcomputer MSP430
  2. Design of Intelligent PID Controller Based on 51 Single Chip Microcomputer
  3. A code about electronic scale design, learning and progress together with university!
  4. control-loop-design
  5. Enter the shutdown time to shut down at the specified time
  6. Lithium-ion battery production process
  7. DSP5509A routine, FFT
  8. MAX2753
  9. Design of PGA for digital TV receiver
  10. Electronic Practical Handbook (Edited by Nobuo Fujii)

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

About Us Customer Service Contact Information Datasheet Sitemap LatestNews
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号