Approval sheet
RFBPF Series – 2012(0805)- RoHS Compliance
MULTILAYER CERAMIC BAND PASS FILTER
2.4 GHz ISM Band Working Frequency
P/N: RFBPF2012080A7T
*Contents in this sheet are subject to change without prior notice.
Page 1 of 7
ASC_RFBPF2012080A7T_V04
Mar. 2010
Approval sheet
FEATURES
1.
2.
3.
4.
5.
6.
Miniature footprint: 2.0 X 1.2 X 0.8 mm
Low Profile Thickness
Low Insertion loss
High Rejection Rate
High attenuation on 2
LTCC process
nd
3
harmonic suppressed
APPLICATIONS
1.
2.
2.4GHz ISM band RF applications
Bluetooth, Wireless LAN 802.11b/g, HomeRF
CONSTRUCTION
P1
P4
03
P2
P3
PIN
1
2
3
Connection
GND
INPUT/OUTPUT
GND
PIN
4
Connection
INPUT/OUTPUT
DIMENSIONS
Figure
Symbol
L
Dimension (mm)
2.00 ± 0.15
1.25 ± 0.15
0.80 ± 0.10
1.00 ± 0.15
0.30 ± 0.15
0.50 ± 0.15
0.25 ± 0.15
0.25 ± 0.15
L
E
T
W
T
A
B
C
D
E
03
C
A
D
W
Page 2 of 7
ASC_RFBPF2012080A7T_V04
B
Mar. 2010
Approval sheet
ELECTRICAL CHARACTERISTICS
RFBPF2012080A7T
Frequency range
Insertion Loss
VSWR
Impedance
2450 ± 50 MHz
2.8 dB max (typ. 2.5 dB )
2.0 max
50
Ω
40 dB @ DC~1600 MHz
35 dB @ 1710 MHz
25 dB @ 1900 MHz
Attenuation (min.)
12 dB @ 2100 MHz
8 dB @ 2170 MHz
30 dB @ 3100 MHz
40 dB @ 4800~5000 MHz
20 dB @ 7200~7500 MHz
Operation Temperature Range
Typical Electrical Chart
-45°C ~ +85°C
Specification
SOLDER LAND PATTERN
Figure
Symbol
L1
L2
L3
L4
L5
W1
W2
W3
W4
S1
Line width to be design to match 50Ω characteristic impedance,
Ω
depending on PCB material and thickness
.
Dimension (mm)
1.270
±
0.10
0.508
±
0.05
0.610
±
0.05
0.381
±
0.05
0.508
±
0.05
0.762
±
0.10
1.016
±
0.10
0.406
±
0.05
0.762
±
0.05
0.489
±
0.05
0.254
±
0.05
0.381
±
0.05
0.406
±
0.10
S2
S3
Φ
Φ
are the grounding through holes.
Page 3 of 7
ASC_RFBPF2012080A7T_V04
Mar. 2010
Approval sheet
RELIABILITY TEST
Test item
Solderability
JIS C 0050-4.6
JESD22-B102D
Test condition / Test method
*Solder bath temperature：235
±
5°C
*Immersion time：2
±
0.5 sec
*Solder：Sn3Ag0.5Cu for lead-free
Specification
At least 95% of a surface of each terminal
electrode must be covered by fresh solder.
Leaching
(Resistance to dissolution
of metallization)
IEC 60068-2-58
*Solder bath temperature：260
±
5°C
*Leaching immersion time：30
±
0.5 sec
*Solder : SN63A
Loss of metallization on the edges of each
electrode shall not exceed 25%.
Resistance to soldering heat
JIS C 0050-5.4
*Preheating temperature：120~150
℃
,
1 minute.
*Solder temperature：270±5°C
*Immersion time：10±1 sec
*Solder：Sn3Ag0.5Cu for lead-free
Measurement to be made after keeping at
room temperature for 24±2 hrs
No mechanical damage.
Samples shall satisfy electrical specification
after test.
Loss of metallization on the edges of each
electrode shall not exceed 25%.
Drop Test
JIS C 0044
*Height：75 cm
*Test Surface：Rigid surface of concrete
or steel.
*Times：6 surfaces for each units；2
times for each side.
No mechanical damage.
Samples shall satisfy electrical specification
after test.
Adhesive Strength
of Termination
JIS C 0051- 7.4.3
Bending test
JIS C 0051- 7.4.1
*Pressurizing force：
5N(≦0603)；10N(>0603)
*Test time：10±1 sec
The middle part of substrate shall be
pressurized by means of the pressurizing
rod at a rate of about 1 mm/s per second
until the deflection becomes 1mm/s and
then pressure shall be maintained for 5±1
sec.
Measurement to be made after keeping at
room temperature for 24±2 hours
No remarkable damage or removal of the
termination.
No mechanical damage.
Samples shall satisfy electrical specification
after test.
Page 4 of 7
ASC_RFBPF2012080A7T_V04
Mar. 2010
Approval sheet
Temperature cycle
JIS C 0025
1.
2.
3.
4.
30±3 minutes at -40°C±3°C,
10~15 minutes at room temperature,
30±3 minutes at +85°C±3°C,
10~15 minutes at room temperature,
No mechanical damage.
Samples shall satisfy electrical
specification after test.
Total 100 continuous cycles
Measurement to be made after keeping at
room temperature for 24±2 hrs
Vibration
JIS C 0040
*Frequency：10Hz~55Hz~10Hz(1min)
*Total amplitude：1.5mm
*Test times：6hrs.(Two hrs each in three
mutually perpendicular directions)
High temperature
JIS C 0021
*Temperature：85°C±2°C
*Test duration：1000+24/-0 hours
Measurement to be made after keeping at
room temperature for 24±2 hrs
Humidity
(steady conditions)
JIS C 0022
*Time：1000+24/-0 hrs.
Measurement to be made after keeping at
room temperature for 24±2 hrs
※
500hrs measuring the first data then
1000hrs data
Low temperature
JIS C 0020
*Temperature：-40°C±2°C
*Test duration：1000+24/-0 hours
Measurement to be made after keeping at
room temperature for 24±2 hrs
No mechanical damage.
Samples shall satisfy electrical specification
after test.
*Humidity：90% to 95% R.H.
*Temperature：40±2°C
No mechanical damage.
Samples shall satisfy electrical specification
after test.
No mechanical damage.
Samples shall satisfy electrical specification
after test.
No mechanical damage.
Samples shall satisfy electrical specification
after test.
Page 5 of 7
ASC_RFBPF2012080A7T_V04
Mar. 2010
京公网安备 11010802033920号
EEWORLD
