EEWORLDEEWORLDEEWORLD

Part Number

Search

ATS-09G-35-C3-R0

Description
heatsink 36.83x57.6x5.84mm t412
CategoryThermal management products   
File Size382KB,1 Pages
ManufacturerSeek Thermal
Websitehttps://www.thermal.com/
Environmental Compliance  
Download Datasheet Parametric View All

ATS-09G-35-C3-R0 Overview

heatsink 36.83x57.6x5.84mm t412

ATS-09G-35-C3-R0 Parametric

Parameter NameAttribute value
Datasheets
ATS-09G-35-C3-R0
Standard Package1
CategoryFans, Thermal Manageme
FamilyThermal - Heat Sinks
TypeTop Mou
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Attachment MethodPush Pi
ShapeRectangular, Fins
Length1.450" (36.83mm)
Width2.267" (57.60mm)
Diamete-
Height Off Base (Height of Fin)0.230" (5.84mm)
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow22.55°C/W @ 100 LFM
Thermal Resistance @ Natural-
MaterialAluminum
Material FinishBlue Anodized
pushPIN™ Heat Sink Assembly
ATS Part#:
ATS-09G-35-C3-R0
Description:
pushPIN™ HS ASMBLY,FINE-PITCH,STRAIGHT, HOLE PATTERN:4-CORNER,BLUE,T412
Heat Sink Type:
pushPIN™ Heat Sink Assembly
Heat Sink Attachment:
pushPIN™
Features & Benefits
»
Quick Attachment – Push pins feature a flexible barb at the end designed to
engage with pre-drilled holes in a PCB.
»
Compression Springs add the necessary force to hold the assembly together
for secure attachment. Select from over 21 different springs to achieve
precise force required.
»
Push Pin Material available in brass or plastic in 10 sizes ranging from 9-
20mm in length. Stainless steel hardware kit available for more secure
attachment. Visit www.qats.com for available options.
»
Heat Sinks Designed for All Airflow Conditions. Select from over 112 fine
pitch HS designed for high velocity air flows and 98 course pitch HS
designed for low velocity air flow conditions.
»
Pre-assembled with phase-changing material for increased thermal
performance. Double-sided thermal tape and no TIM options available to
meet application-specific requirements.
»
Lightweight, aluminum HS extruded from AL6063 provide optimal heat
transfer with a blue anodized finish.
»
All components are RoHS and REACH compliant.
»
Industry standard hole pattern. Recommended through hole size is 3.175mm
For Illustration Purposes ONLY.
Bill of Material
Heat Sink:
ATS-FPS037058006-35-C3-R0
Push Pin:
Springs:
ATS-PP-08
ATS-PPS-09
Qty
1
4
4
Thermal Performance
100
AIR VELOCITY - LFM (m/s)
(0.5)
Thermal Resistance
°C/W
Unducted Flow
Ducted Flow
22.55
4.42
200
(1.0)
13.78
2.95
300
(1.5)
8.43
2.45
400
(2.0)
5.92
2.16
500
(2.5)
4.64
1.97
600
(3.0)
3.91
1.83
700
(3.5)
3.44
Fin
Pitch
FINE-PITCH
Fin
Type
STRAIGHT
Hole
Pattern
4-CORNER
1.72
Product Detail
P/N
ATS-09G-35-C3-R0
A
36.83
Dimensions
B
C
E
57.60
5.84
26.20
F
47.20
NOTES:
Push Pin
ATS-PP-08
Spring
ATS-PPS-09
TIM
T412
Finish
BLUE ANODIZED
For Illustration Purposes ONLY.
1) Dimension A is the length of the heat sink in the direction of the flow.
2) Dimension B is the width of the heat sink perpendicular to the flow direction.
3) Dimension C is the heat sink height from the bottom of the base to the top of the fin
field.
4) Dimension E is the distance between holes perpendicular to the direction
of flow.
5) Dimension F is the distance between holes in the direction of flow.
6) Thermal performance data are provided for reference only. Actual performance may
vary by application.
7) ATS reserves the right tp update or change its products without notice
to improve the design or performance.
8) ATS certifies that this heat sink assemby is RoHS-6 and REACH compliant.
9) Contact ATS to learn about custom options available.
For further technical information, please contact Advanced Thermal Solutions, Inc.
89-27 ACCESS ROAD, NORWOOD, MA 02062 USA | T: 781.769. 2800 F: 781.769.9979 | WWW.QATS.COM
[Xianji HPM6750 Review] + Software simulation IIC reads the temperature and humidity sensor values
I had some things to do in the middle and stopped updating for a while. Next, we will continue our development and testing. Today, I will make a simple software to simulate IIC to read the temperature...
流行科技 Domestic Chip Exchange
In fact, Valentine's Day 20200214 was cancelled
I heard that there will be a new policy in 2020, and it seems that Western Valentine's Day will be cancelled. Is it true?...
led2015 Talking
This problem occurs when setting up the stm8 environment. What is the reason? Thank you
After clicking OK, the second problem will appear in the compilation, as shown in Figure 2...
ena stm32/stm8
dsp28335 data space
The book says that dsp28335 has 4G data space, but the external interface has only 20 address lines, the maximum addressable data space is 1M, and 32 of them are used to transmit data; and the memory ...
sudongpo2018 DSP and ARM Processors
[Xianji HPM6750 Review 8] Detailed description of the small twists and turns encountered by SPI peripherals
Since the last post about debugging SPI DMA failed, it has been put on hold until now. The official version V0.11.0 has just been released, and this time SPI DMA has been restored. What's strange is t...
RCSN Domestic Chip Exchange
MSP430 MCU Development Record (16)
[b][color=#5E7384]This content is originally created by EEWORLD forum user [size=3]tiankai001[/size]. If you need to reprint or use it for commercial purposes, you must obtain the author's consent and...
tiankai001 Microcontroller MCU

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号