Multilayer Ceramic Chip Capacitors
FEATURES
•
CLASS I DIELECTRIC, TEMPERATURE COMPENSATING
•
HIGH STABILITY OVER TIME, VOLTAGE AND
TEMPERATURE CHANGES
•
LOW DIELECTRIC LOSS
•
NICKEL BARRIER TERMINATIONS AND EXCELLENT
MECHANICAL STRENGTH
SPECIFICATIONS
Capacitance Range
NMC Series NPO
Expanded
Value Range
Up to 0.1µF
0.3pF to 0.1µF
<5pF: ±0.1pF(B), ± 0.25pF(C)
Capacitance Tolerance
>5pF
to <10pF: ±0.1pF(B), ± 0.25pF(C), ±0.5pF(D)
10pF and above: ±1%(F), ±2%(G), ±5% (J)
Operating Temperature Range
-55°C ~ +125°C
Temperature Characteristics
0 ± 30ppm/°C
Rated Voltages
10Vdc, 16Vdc, 25Vdc, 35Vdc, 50Vdc, 100Vdc (see NMC-H Series for higher voltages)
Dissipation Factor
For values >30pF 0.1% @ 25°C; For values
<
30pF Q=400+20 x C (C in pF)
insulation Resistance
10,000Megohms min. or 500Megohm/µF (min.), whichever is less @ +25°C
Dielectric Withstanding Voltage
250% of Rated Voltage for 1 ~ 5 seconds, 50mA maximum current
Test Conditions (EIA-198-2E)
<1000pF;
1MHz, 1.2Vrms max. or >1000pF; 1KHz, 1.2Vrms max.
Note: Reflow soldering allowed for all case sizes. Contact NIC for wave soldering restrictions.
Voltage Coefficient of
Capacitance - NPO
Minimum Insulation Resistance
vs Temperature
0.4
0.3
0.2
0.1
0.0
-0.1
-0.2
-0.3
-0.4
-55
Typical NPO Temperature Coefficient
0.2
0.1
0.0
-0.1
10,000
1000
100
10
10
-25
0 25
50 75 100
Temperature (Degrees Celsius)
1000
100
10
1
0.1
0.01
1
125
-0.2
0 10 20 30 40 50 60 70 80 90 100
DC Volts Applied
0.2
0.1
25
100 150
Temperature (Degrees C)
Impedance vs. Frequency NPO
Aging Rate - NPO
1000pF
100pF
0.0
-0.1
-0.2
1
10
100
Hours
1000
10000
10
100
Frequency (MHz)
1000
PART NUMBER SYSTEM
NMC 0805 NPO 101 J 50 TRP or TRPLP 3K
F
Series
RoHS Compliant
"3K" denotes optional reel quantity or
"4" denotes optional 4mm carrier width (01005 case size only)
Tape & Reel (Embossed Plastic Carrier)
Tape & Reel (Punched carrier)
Voltage (Vdc)
Capacitance Tolerance Code (see chart)
Capacitance Code, expressed in pF, first 2 digits are
significant, 3rd digit is no. of zeros, “R” indicates
decimal for under 10pF
Temperature Characteristic
Size Code (see chart)
®
1
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
Specifications are subject to change
Multilayer Ceramic Chip Capacitors
EIA Case Size
Length (L)
Width (W)
Thickness max. (T)
Termination Width (P)
Capacitance
0.47pF ~ 9.1pF
10pF ~ 22pF
24pF ~ 0.001µF
0.0012µF
0.0015µF
0.0018µF
0.0022µF
0.0027µF
0.0033µF
0.0039µF
0.0047µF
0.0056µF
0.0068µF
0.0075µF
0.0082µF
0.0091µF
0.01µF
0.012µF
0.015µF
0.018µF
0.022µF
0.027µF
0.033µF
0.039µF
0.047µF
0.056µF
0.068µF
0.082µF
0.1µF
1210
3.2±0.2
2.5±0.2
1.80
0.25 ~ 0.71
Working Voltage (Vdc)
16 25 50 100 10 16 25 50 100 10 16 25 50 100
0805
2.0±0.2
1.25±0.2
1.45
0.25 ~ 0.71
1206
3.2±0.2
1.6±0.2
1.80
0.25 ~ 0.71
NMC Series NPO
1812
4.5±0.3
3.2±0.25
1.80
0.25 ~ 0.76
25
50
100
2225
5.70±0.4
6.35±0.25
1.80
0.25 ~ 1.02
50
100
See the
previous page
**
**
**
**
Temporarily
Unavailable
***
*1.90mm maximum thickness, **2.60mm maximum thickness,
***4.5mm ± 0.40 x 3.2mm ± 0.40 x 2.80mm maximum thickness
See NMC High Capactiance datasheet for higher capacitance values
or NMC-H High Voltage datasheet for higher voltage ratings
W
T
P
L
100% Sn over Ni barrier
P
®
3
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
Specifications are subject to change
Multilayer Ceramic Chip Capacitors
REEL
B
Taping Specifications
D
21.0
± 1.0
T max.
4mm Carrier: 5.0 ± 1.5
8mm Carrier: 8.4 ± 1.0
12mm Carrier: 12.8 ± 0.5
REEL DIMENSIONS (mm)
Reel Diameter (A)
B
C
7” (178 ± 2.0)
50 min.
13.0
10” (250 ± 2.0)
100 ± 1.0
± 0.5
13” (330 ± 2.0)
100 ± 1.0
A
7 INCH REEL QUANTITIES*
Size
Tape Size
Min. Qty
Per Reel
Max. Qty
Per Reel
4mm
01005
8mm
40,000
40,000
20,000
20,000
0201
8mm
0402
8mm
10,000
10,000
15,000
15,000
*Quantity dependent on chip thickness. Contact NIC for reel
quantities on larger diameter reels.
8MM & 12MM EMBOSSED PLASTIC CARRIER TAPE DIMENSIONS (mm)
Carrier Width
8mm
12mm
W
8.0 ± 0.2
12 ± 0.2
F
3.5 ± 0.05
5.5 ± 0.05
E
1.75 ± 0.10
P
0
4.0 ± 0.1
P
2
2.0 ± 0.5
D
1.5
+0.1-0.0
K max.
3.0
T max.
2.0
4.5
P
4.0 ± 0.1
8.0 ± 0.1
Notes:
1. Specifications are in compliance with EIA RS481-1-A
“Taping of surface Mount Components for Automatic Placement”
2. Dimensions A
o
(max.) equals component width dimension plus 0.5mm
3. Dimension B
o
(max.) equals component length dimension plus 0.5mm
D
T
K
®
4
NIC COMPONENTS CORP.
www.niccomp.com
D
C
T
CARRIER TAPE MATERIAL
Parts with a thickness of
>1mm
will be taped on embossed
plastic carrier. Parts with a thickness of less then 1mm
will be taped on paper carrier
0603
8mm
4,000
4,000
0805
8mm
4,000
5,000
1206
8mm
4,000
5,000
1210
8mm
2,000
5,000
1812
12mm
1,000
2,000
2225
12mm
400
1,000
P
o
E
P
2
F
B
o
W
A
o
P
See notes 2 & 3 regarding dimensions
Ao
and B
o
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
Specifications are subject to change
FPGA/CPLD
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