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626252L

Description
Heat Sink,
CategoryThermal management products    Heat resisting bracing   
File Size92KB,4 Pages
ManufacturerBoyd Corporation
Download Datasheet Parametric View All

626252L Overview

Heat Sink,

626252L Parametric

Parameter NameAttribute value
Objectid4003062498
Reach Compliance Codeunknown
HEAT SINK COOLING
T H E R M A L P R O D U C T S, I N C.
FOR IGBT MODULES
6-PASS COLD PLATE
Aavid offers several methods for cooling
IGBT modules – cold plates, extruded alu-
minum heat sinks, bonded fin heat sinks,
and fan cooled modules.
6-pass liquid-cooled cold plates offer optimum ther-
mal management for high power IGBT modules.They
are ideal for use in stationary or mobile applications
requiring high power dissipation and low thermal
resistance – welding, plasma, UPS/power supplies, and
motor controls in traction and electric vehicles.
FEATURES:
• Maximizes cooling in a compact package
• Fits all standard IGBT module sizes
• Maintains uniform temperature under devices
• Available in multiple lengths for single and three-
phase design
4-PASS COLD PLATE
1.00
(25.40)
REF
"X"
1.00
(25.40)
1.720
(43.69)
5.00
3.00 (127.00)
(76.20)
3.550
±0.060
(90.17)
7.000
(177.80)
.001/inch
Roughness 63 RMS
2.00
(50.80)
REF
3/8 O.D.
Copper Tubing
0.049/0.050 Wall
0.800
(20.32)
REF.
.001/inch
Roughness 63 RMS
X
2.400
(60.96)
.60
(15.24)
6063 Aluminum
6063 Aluminum
PART#
X
6.0” 416501U
12.0” 416601U
PART#
X
6.0” 416101U
12.0” 416201U
24.0” 416301U
0.600
(15.24)
3/8 O.D.
COPPER TUBING
0.049/0.050 WALL
M A X R E C O M M E N D E D F L OW - 1.5 GPM
OV E R A L L T H E R M A L R E S I S TA N C E M T G .
S U R FA C E TO I N L E T WAT E R -
°
C / W
OV E R A L L T H E R M A L R E S I S TA N C E M T G .
S U R FA C E TO I N L E T WAT E R -
°C
/ W
M A X R E C O M M E N D E D F L OW - 1.5 GPM
20
PRESSURE DROP - PSI
0.05
0.04
0.03
0.02
0.01
0.00
0
1.0
2.0
3.0
4.0
WAT E R F L OW R AT E - G P M
6"
12"
16
12
8
4
5.0
0
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0.000
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
WAT E R F L OW R AT E - G P M
NOTES: THERMAL RESISTANCE BASED ON WATER, IF 50/50 WATER GLYCOL MIXTURE IS USED INCREASE THERMAL RESISTANCES BY 12%
THERMAL RESISTANCES SHOWN ARE FROM INLET WATER TEMPERATURE TO MOUNTING SURFACE HOT SPOTS
NOTES: THERMAL RESISTANCE BASED ON WATER, IF 50/50 WATER GLYCOL MIXTURE IS USED INCREASE THERMAL RESISTANCES BY 12%
THERMAL RESISTANCES SHOWN ARE FROM INLET WATER TEMPERATURE TO MOUNTING SURFACE HOT SPOTS
PRESSURE DROP - PSI
6"
12"
24"
40
35
30
25
20
15
10
5
0

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