|
CD74ACT10E |
CD74ACT10M |
CD74ACT10M96 |
CD74ACT10M96G4 |
CD74ACT10MG4 |
Description |
Triple 3-Input NAND Gates 14-PDIP -55 to 125 |
Triple 3-Input NAND Gates 14-SOIC -55 to 125 |
Triple 3-Input NAND Gates 14-SOIC -55 to 125 |
Triple 3-Input NAND Gates 14-SOIC -55 to 125 |
Triple 3-Input NAND Gates 14-SOIC -55 to 125 |
Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
Maker |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Parts packaging code |
DIP |
SOIC |
SOIC |
SOIC |
SOIC |
package instruction |
DIP-14 |
SOIC-14 |
SOIC-14 |
GREEN, PLASTIC, MS-012AB, SOIC-14 |
SOIC-14 |
Contacts |
14 |
14 |
14 |
14 |
14 |
Reach Compliance Code |
compliant |
compliant |
compliant |
compliant |
compliant |
series |
ACT |
ACT |
ACT |
ACT |
ACT |
JESD-30 code |
R-PDIP-T14 |
R-PDSO-G14 |
R-PDSO-G14 |
R-PDSO-G14 |
R-PDSO-G14 |
JESD-609 code |
e4 |
e4 |
e4 |
e4 |
e4 |
length |
19.3 mm |
8.65 mm |
8.65 mm |
8.65 mm |
8.65 mm |
Load capacitance (CL) |
50 pF |
50 pF |
50 pF |
50 pF |
50 pF |
Logic integrated circuit type |
NAND GATE |
NAND GATE |
NAND GATE |
NAND GATE |
NAND GATE |
MaximumI(ol) |
0.024 A |
0.024 A |
0.024 A |
0.024 A |
0.024 A |
Number of functions |
1 |
1 |
1 |
1 |
1 |
Number of entries |
3 |
3 |
3 |
3 |
3 |
Number of terminals |
14 |
14 |
14 |
14 |
14 |
Maximum operating temperature |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
Minimum operating temperature |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
DIP |
SOP |
SOP |
SOP |
SOP |
Encapsulate equivalent code |
DIP14,.3 |
SOP14,.25 |
SOP14,.25 |
SOP14,.25 |
SOP14,.25 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
IN-LINE |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE |
method of packing |
TUBE |
TUBE |
TR |
TAPE AND REEL |
TUBE |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
260 |
260 |
260 |
260 |
power supply |
5 V |
5 V |
5 V |
5 V |
5 V |
Prop。Delay @ Nom-Sup |
13.5 ns |
13.5 ns |
13.5 ns |
13.5 ns |
13.5 ns |
propagation delay (tpd) |
13.5 ns |
13.5 ns |
13.5 ns |
13.5 ns |
13.5 ns |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Schmitt trigger |
NO |
NO |
NO |
NO |
NO |
Maximum seat height |
5.08 mm |
1.75 mm |
1.75 mm |
1.75 mm |
1.75 mm |
Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
Minimum supply voltage (Vsup) |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
5 V |
5 V |
surface mount |
NO |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Terminal form |
THROUGH-HOLE |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
Terminal pitch |
2.54 mm |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
width |
6.35 mm |
3.91 mm |
3.91 mm |
3.9 mm |
3.91 mm |
Base Number Matches |
1 |
1 |
1 |
1 |
1 |
Factory Lead Time |
6 weeks |
6 weeks |
1 week |
- |
6 weeks |
Maximum supply current (ICC) |
0.08 mA |
0.08 mA |
0.08 mA |
- |
0.08 mA |
Is it lead-free? |
- |
Lead free |
Lead free |
- |
Lead free |
Humidity sensitivity level |
- |
1 |
1 |
1 |
1 |