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GUB-GM8A-02-6572-C-C

Description
Array/Network Resistor, Isolated, Thin Film, 1.2W, 65700ohm, 0.25% +/-Tol, 50ppm/Cel, Surface Mount, 2244, DIP
CategoryPassive components    The resistor   
File Size493KB,3 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Download Datasheet Parametric View All

GUB-GM8A-02-6572-C-C Overview

Array/Network Resistor, Isolated, Thin Film, 1.2W, 65700ohm, 0.25% +/-Tol, 50ppm/Cel, Surface Mount, 2244, DIP

GUB-GM8A-02-6572-C-C Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Objectid1076321351
package instructionSMT, 2244
Reach Compliance Codecompliant
Country Of OriginUSA
ECCN codeEAR99
YTEOL4.88
Other featuresULTRA PRECISION
structureMolded
Component power consumption0.16 W
The first element resistor65700 Ω
JESD-609 codee0
Manufacturer's serial numberGUB
Installation featuresSURFACE MOUNT
Network TypeISOLATED
Number of components1
Number of functions8
Number of terminals16
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package height2.286 mm
Package length11.176 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width5.588 mm
Rated power dissipation(P)1.2 W
Rated temperature70 °C
resistance65700 Ω
Resistor typeARRAY/NETWORK RESISTOR
seriesGUB
size code2244
surface mountYES
technologyTHIN FILM
Temperature Coefficient50 ppm/°C
Temperature coefficient tracking5 ppm/°C
Terminal surfaceTin/Lead (Sn/Pb)
Terminal shapeGULL WING
Tolerance0.25%
TaNFilm
®
Small Outline Surface
Mount Resistor Network
GUB Series
Thin film on ceramic technology
0.220” and 0.300” sizes available
RoHS compliant version available
DESC 87012 and 87013 available
Standard JEDEC packages for automatic placement equipment
Compliant leads to
compensate for
thermal expansion
and contractions.
IRC Advanced Film Division
Ultra precision tantalum
nitride resistance element
on high purity alumina.
Rugged, molded
construction.
IRC’s TaNFilm®, Small Outline Integrated Circuit resistor networks are ideally suited for surface mounting.
The 0.05 inch lead spacing provides higher lead density, increased component count, lower installed resistor
cost, and better reliability. They are ideally suited for the latest surface mount assembly techniques, and each
lead can be 100% visually inspected. The compliant leads relieve thermal expansion and contraction stressed
created by soldering and temperature excursions.
The tantalum nitride film system provides precision tolerance, exceptional TCR tracking, and low noise.
TaNFilm® provides stability, high reliability, and long life characteristics. Testing has demonstrated performance
exceeding MIL-PRF-83401 characteristics H.
Electrical Data
GM Type
Resistance Range (Ω)
GL Type
Absolute Tolerance
Ratio Tolerance To R1
TCR (ppm/°C)
TCR Tracking To R1 (ppm°C)
Operating Temperature Range
Noise
Substrate
Custom circuits and special testing available.
Schem A: 10 to 200K
Schem B: 10 to 1000K
Schem A: 10 to 150K
Schem B: 10 to 75K
Available to ±0.1%
Available to ±0.05%
±25, ±50, ±100
±5
-55°C to +125°C
Less than -25 dB
High purity alumina substrate
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
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